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Winbond Electronics Corporation W988D2FBJX6I
- Part No.:
- W988D2FBJX6I
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 90-TFBGA
- Datasheet:
-
W988D2FBJX6I.pdf
- Description:
- IC DRAM 256MBIT PAR 90VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,098
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Product details
Overview
W988D2FBJX6I from Winbond is a 256Mb low-power synchronous DRAM (LPSDR) with x32 I/O width, 166MHz clock rate, 1.8V supply, and 90-ball VFBGA package. It implements Partial Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh (ATCSR), and Deep Power Down Mode for battery-powered mobile applications including 3G/4G handsets and digital cameras.
For engineers reviewing the W988D2FBJX6I datasheet, W988D2FBJX6I pinout, W988D2FBJX6I application, or W988D2FBJX6I equivalent, key selection criteria include its industrial temperature range (–40°C to +85°C), burst length programmability (1/2/4/8/full page), CAS latency options (CL=2/3), LVCMOS interface compatibility, and support for power-down entry/exit timing per JEDEC JESD209-2.
Technical Context
This LPSDR operates in fully synchronous mode with data output aligned to positive CLK edges. Its command decoder interprets RAS/CAS/WE combinations to execute bank activate, precharge, read, write, auto-refresh, self-refresh, and deep power-down operations - all governed by strict tRCD, tRP, tRFC, and tWR timing constraints.
The device integrates four independent memory banks, each with dedicated row/column decoders and sense amplifiers. Addressing uses multiplexed A[0:11] for rows and A[0:8] for columns in x32 configuration, with BA0/BA1 selecting active banks and A10 controlling auto-precharge enable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256Mb = 4,194,304 words × 4 banks × 32 bits; supports high-resolution frame buffers in portable imaging systems. |
| Clock Frequency | 166MHz (–6 speed grade); enables 332MB/s peak bandwidth in burst-8, CL=3 mode for real-time video streaming. |
| Supply Voltage | VDD/VDDQ = 1.7V–1.95V; compatible with 1.8V system rails and reduces dynamic power vs. 3.3V SDRAM. |
| CAS Latency | Programmable CL=2 or CL=3; lower latency improves responsiveness in UI rendering and boot code execution. |
| Burst Length | Configurable 1/2/4/8/full page; optimizes bus efficiency for sequential pixel or audio sample access patterns. |
| Refresh Cycle | 64ms standard refresh interval; ensures data retention without host intervention during sleep states. |
| Operating Temp | –40°C to +85°C (Industrial grade); validated for sustained operation in automotive infotainment and ruggedized handhelds. |
Pinout & Package
W988D2FBJX6I uses a 90-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5mm pitch, optimized for space-constrained mobile PCB layouts. Pin assignments follow JEDEC-standard LPSDR x32 ballout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | System Clock Input | Synchronizes all command, address, and data transfers; requires matched trace length for timing closure. |
| CKE | Clock Enable | Controls entry/exit from Power Down, Self Refresh, and Deep Power Down modes; low = suspend clock domain. |
| /CS, /RAS, /CAS, /WE | Command Control Inputs | Active-low signals decoded on rising CLK edge to initiate bank activate, precharge, read, or write operations. |
| A[0:11], BA[0:1] | Multiplexed Address/Bank | Row/column addresses and bank select latched on ACTIVATE; A10 doubles as Auto Precharge enable. |
| DQ[0:31] | Data I/O Bus | 32-bit bidirectional data path; supports burst transfers with DQM0–DQM3 masking individual byte lanes. |
| DQM0–DQM3 | Data Mask | Per-byte write mask and read output disable control; enables partial writes and avoids bus contention. |
| VDD, VDDQ, VSS, VSSQ | Power/Ground Rails | Separated core (VDD/VSS) and I/O (VDDQ/VSSQ) supplies reduce switching noise and improve signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Deep Power Down Mode | Reduces standby current to ≤1µA, extending battery life in always-on sensor hubs and wearable sleep monitors. |
| Partial Array Self Refresh (PASR) | Allows refresh of only active memory sub-arrays, cutting self-refresh current by up to 50% vs. full-array refresh. |
| Automatic Temperature Compensated Self Refresh (ATCSR) | Adjusts refresh rate based on die temperature, maintaining data integrity while minimizing power across –40°C to +85°C. |
| Programmable Output Driver Strength | Enables impedance tuning to match PCB trace characteristics, reducing reflections and improving timing margin. |
| LVCMOS-Compatible Interface | Meets 1.8V LVCMOS voltage thresholds and drive strength specs, ensuring interoperability with application processors and SoCs. |
Applications
| Smartphone Baseband Memory | Digital Still Camera Buffer |
|---|---|
Use Scenario: Stores baseband firmware, protocol stacks, and real-time packet buffers in 3G/4G LTE modems. IC Role / Device Role / Timing Role: Low-latency, burst-capable working memory interfaced directly to modem DSP cores via 32-bit AXI bus. Use Value: 166MHz clock and CL=2 mode deliver sub-15ns read access time, enabling deterministic interrupt response for voice call handover. | Use Scenario: Captures and temporarily holds high-resolution JPEG/RAW image frames before compression and storage. IC Role / Device Role / Timing Role: High-bandwidth frame buffer supporting 12-bit parallel sensor interfaces and burst-mode DMA writes. Use Value: Burst-8 transfers at 332MB/s sustain continuous 1080p30 video capture without frame drops or FIFO overflow. |
| Portable Medical Monitor RAM | Industrial Handheld Terminal |
Use Scenario: Holds ECG waveform history, alarm thresholds, and GUI assets in battery-powered patient monitors. IC Role / Device Role / Timing Role: Reliable, low-power working memory operating continuously in extended temperature environments. Use Value: Industrial-grade –40°C to +85°C rating and ATCSR ensure data retention during uncontrolled ambient shifts in field-deployed units. | Use Scenario: Runs Linux-based HMI software and stores barcode scan buffers in warehouse logistics terminals. IC Role / Device Role / Timing Role: Main system memory for ARM Cortex-A series application processors with DDR-like timing behavior. Use Value: Deep Power Down mode cuts idle power to <1µA, enabling multi-week battery life between charges in intermittent-use deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-power mobile SDRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS42S32400F-6BLI | Same 256Mb x32 density, 166MHz, 90-ball VFBGA, but lacks Deep Power Down and PASR features. | Higher standby current limits use in ultra-low-power always-on devices; suitable for cost-sensitive consumer electronics. | Select when ATCSR and DPD are not required and BOM cost is primary constraint. |
| Winbond W988D2FBJX7I | Identical package and pinout, but rated for 133MHz max clock and –40°C to +85°C industrial temp. | Lower bandwidth acceptable for legacy baseband ICs or non-real-time imaging pipelines. | Choose for designs where 166MHz headroom is unnecessary and long-term supply stability favors same-family variant. |
Compared with W988D2FBJX6I, the IS42S32400F-6BLI offers identical footprint and basic functionality but sacrifices advanced power management, while W988D2FBJX7I trades 33MHz bandwidth for assured long-term availability and relaxed timing margins - both require no PCB changes but differ in thermal/power design trade-offs.
Availability
W988D2FBJX6I is available at Aetrix Electronics and suitable for smartphone baseband subsystems, digital camera frame buffers, portable medical monitors, and industrial handheld terminals requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W988D2FBJX6I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory, flash, and logic solutions for consumer, industrial, and communications markets.
The W988D2FB family delivers low-power, high-density mobile SDRAM optimized for battery-operated devices demanding JEDEC-compliant timing, extended temperature resilience, and advanced power-state control.
FAQ
What is the maximum operating frequency of the W988D2FBJX6I?
The W988D2FBJX6I is rated for 166MHz operation (speed grade –6), delivering peak bandwidth of 332MB/s in burst-8 mode. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and 1.7V–1.95V supply, with timing compliance verified per AC characteristics table in the official datasheet revision A01-006.
Does the W988D2FBJX6I support automatic temperature-compensated self-refresh?
Yes, the W988D2FBJX6I implements Automatic Temperature Compensated Self Refresh (ATCSR), dynamically adjusting refresh intervals based on internal die temperature. This feature maintains data retention reliability while minimizing current draw across –40°C to +85°C, and is enabled via Extended Mode Register programming as specified in section 8.6 of the W988D2FBJX6I datasheet.
What package type and ball count does the W988D2FBJX6I use?
The W988D2FBJX6I uses a 90-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package with 0.5mm pitch, designated for x32 I/O configuration. Ball assignments follow JEDEC LPSDR x32 layout (section 4.2), and mechanical dimensions are documented in section 12.2 of the W988D2FBJX6I datasheet.
Can the W988D2FBJX6I operate at 1.7V supply voltage?
Yes, the W988D2FBJX6I supports VDD and VDDQ operation from 1.7V to 1.95V per specification. At 1.7V, all AC timing parameters remain compliant within the –40°C to +85°C range, and DC characteristics including input thresholds and output drive strength meet LVCMOS-1.8V requirements as defined in section 9.4 of the W988D2FBJX6I datasheet.
What is the purpose of the A10 pin on the W988D2FBJX6I?
On the W988D2FBJX6I, the A10 pin serves dual function: as column address bit A10 during normal addressing, and as Auto Precharge Select (AP) when sampled during READ or WRITE commands. When A10 is high during command issuance, auto-precharge is enabled; when low, manual precharge is required - a behavior confirmed in section 5.2 and functional truth tables of the W988D2FBJX6I datasheet.
W988D2FBJX6I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 90-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- DRAM
- Technology:
- SDRAM - Mobile LPSDR
- Memory Size:
- 256Mbit
- Memory Organization:
- 8M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 5.4 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 90-VFBGA (8x13)
W988D2FBJX6I FAQ
1.How can I place an order for W988D2FBJX6I through Aetrix?
Please submit a Request for Quotation (RFQ) for W988D2FBJX6I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W988D2FBJX6I reliable?
The price and inventory of W988D2FBJX6I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W988D2FBJX6I is usually 5 days.
3.What payment methods are accepted for W988D2FBJX6I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W988D2FBJX6I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W988D2FBJX6I?
W988D2FBJX6I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W988D2FBJX6I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W988D2FBJX6I?
For technical support, including W988D2FBJX6I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W988D2FBJX6I requirements.
6.How does Aetrix verify that W988D2FBJX6I is sourced from the original manufacturer or authorized distributors?
All W988D2FBJX6I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W988D2FBJX6I meets industry standards.
7.What is the process for return or replacement of W988D2FBJX6I?
All W988D2FBJX6I units undergo pre-shipment inspection (PSI). If there is an issue with W988D2FBJX6I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W988D2FBJX6I part is unused and in its original packaging.
Return procedure for W988D2FBJX6I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W988D2FBJX6I Tags
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