Winbond Electronics Corporation W989D6DBGX6E

Overview

W989D6DBGX6E from Winbond is a 512Mb (4,194,304 words × 4 banks × 16 bits) low-power synchronous DRAM IC designed for mobile memory subsystems. It operates at 1.8V VDD/VDDQ, supports 166MHz clock frequency (–6 speed grade), delivers CAS latency of 2 or 3, and implements Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR) for battery-constrained handheld devices.

For engineers reviewing the W989D6DBGX6E datasheet, W989D6DBGX6E pinout, W989D6DBGX6E application, or W989D6DBGX6E equivalent, key selection considerations include its 54-ball VFBGA x16 package, extended temperature range (–25°C to +85°C), LVCMOS-compatible interface, burst length programmability (1/2/4/8/full page), and deep power-down mode entry/exit timing compliance.

Technical Context

The W989D6DBGX6E implements a 4-bank architecture with multiplexed row/column addressing using A0–A12 and BA0/BA1, where A10 serves as Auto Precharge Select. Its command decoder interprets standard SDRAM control signals (CS, RAS, CAS, WE, CKE, CLK) to execute bank activate, precharge, read, write, auto-refresh, self-refresh, power-down, and deep power-down operations.

It supports both sequential and interleaved burst addressing modes, programmable output driver strength, and dual-mode refresh (8K cycles per 64ms). The device uses separate VDDQ/VSSQ rails for I/O buffers to reduce switching noise and maintains full functionality under 1.7V–1.95V supply tolerance.

Key Specifications

Pinout & Package

W989D6DBGX6E is housed in a 54-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA) package, footprint-optimized for mobile PCB stacking and thermal dissipation. Ball pitch is 0.5mm; package dimensions are 8.0mm × 10.5mm × 0.6mm (max).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-power mobile SDRAM applications.

Compared with W989D6DBGX6E, W989D6DBGX6I offers identical electrical behavior with extended cold-temperature support, while MT47H64M16HR-37E requires full interface redesign due to DDR2 protocol, voltage, and timing incompatibility.

Availability

W989D6DBGX6E is available at Aetrix Electronics and suitable for smartphone baseband memory, digital still camera buffers, portable gaming console RAM, industrial handheld terminal memory, and other applications requiring stable component supply with extended temperature capability and low-power memory management.

Supply support for W989D6DBGX6E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR Flash, PSRAM, and low-power DRAM for mobile and embedded markets.

The W989D6DB family is part of Winbond's Mobile LPSDR product line, engineered specifically for battery-powered handheld devices demanding high memory density, ultra-low standby current, and robust thermal performance without sacrificing timing flexibility.

FAQ

What is the maximum clock frequency supported by the W989D6DBGX6E?

The W989D6DBGX6E supports a maximum clock frequency of 166MHz, corresponding to the "–6" speed grade designation in its ordering code. This frequency is validated across the full –25°C to +85°C operating range and assumes compliant AC timing parameters including tCK (clock period), tAC (access time), and tRC (row cycle time) as specified in the official Winbond datasheet revision A01-002.

Does the W989D6DBGX6E support true pin-to-pin compatibility with other Winbond LPSDR parts?

Yes, the W989D6DBGX6E shares identical ball assignment, signal mapping, and DC/AC characteristics with W989D6DBGX6I - differing only in temperature rating. Both use the same 54-ball VFBGA x16 footprint and require no PCB layout changes. However, cross-family compatibility (e.g., with x32 variants like W989D2DBJX6E) is not supported due to different ball counts, signal routing, and internal organization.

How does the Automatic Temperature Compensated Self Refresh (ATCSR) function in the W989D6DBGX6E?

The W989D6DBGX6E implements ATCSR by internally monitoring junction temperature and dynamically scaling self-refresh current to maintain data retention while minimizing power draw. At 25°C, typical self-refresh current is ~35µA; at 0°C, it drops to ~18µA. This feature is enabled by default and requires no host software configuration - it operates transparently during self-refresh entry triggered by CKE low assertion.

What burst lengths are supported by the W989D6DBGX6E, and how are they configured?

The W989D6DBGX6E supports burst lengths of 1, 2, 4, 8, and full-page, configured via the Burst Length field (A2–A0) in the Mode Register Set (MRS) command. Burst type is fixed as sequential. Configuration occurs during initialization after power-up and can be reprogrammed only when all banks are idle. Burst termination is supported via the Burst Stop command during active reads or writes.

Can the W989D6DBGX6E operate with a 1.7V supply voltage?

Yes, the W989D6DBGX6E is fully specified to operate across VDD and VDDQ ranges of 1.7V to 1.95V per the datasheet. All DC characteristics (e.g., input thresholds, output drive) and AC timing parameters (e.g., tCK, tAC, tRCD) remain valid at 1.7V, making it suitable for systems implementing adaptive voltage scaling to further reduce dynamic power consumption in battery-operated devices.