Texas Instruments X4MF03107SPZQQ1
- Part No.:
- X4MF03107SPZQQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
X4MF03107SPZQQ1.pdf
- Description:
- IC MCU 16/32B 320KB FLSH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
X4MF03107SPZQQ1 from Texas Instruments is an automotive-grade 32-bit ARM Cortex-M3 microcontroller designed for safety-critical real-time control in engine management, transmission control, and chassis systems. It integrates 320KB flash with SECDED ECC, 16KB SRAM with ECC, dual CAN controllers (16/32 mailboxes), and a 16-channel 10-bit MibADC - all operating across −40°C to 125°C.
For engineers reviewing the X4MF03107SPZQQ1 datasheet, X4MF03107SPZQQ1 pinout, X4MF03107SPZQQ1 application, or X4MF03107SPZQQ1 equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety features (ECC, BIST, ESM), and real-world timing/peripheral constraints for ISO 26262 ASIL-B–capable designs.
Technical Context
The X4MF03107SPZQQ1 implements the TMS470M platform architecture with a big-endian memory layout and FMzPLL-based clock generation enabling up to 80MHz system operation. Its memory subsystem includes pipeline-capable flash (320KB + 64KB bank) and ECC-protected SRAM (16KB), both accessible via VBUSP/AHB interconnect with MBIST/LBIST support.
Peripherals are tightly coupled to the Cortex-M3 core through dedicated bus masters: two MibSPIs (64-word buffers with parity), two LIN/SCI interfaces, dual DCAN controllers with mailbox RAM parity, and a 16-channel HET with XOR-share capability and 128-word timer RAM. All I/O operates at 3.3V with adaptive 4mA drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, 1.2 DMIPS/MHz, MPU, Thumb2 instruction set |
| Flash Memory | 320KB main bank + 64KB secondary bank, SECDED ECC, pipeline mode supports 80MHz CPU clock |
| SRAM | 16KB total, SECDED ECC, bit-accessible SET/CLR space for atomic register manipulation |
| CAN Interfaces | Dual DCAN: DCAN1 (16 mailboxes), DCAN2 (32 mailboxes), both with mailbox RAM parity |
| ADC | 16-channel, 10-bit MibADC with 64-word FIFO, parity, and calibration/self-test modes |
| HET | 16-channel High-End Timer with XOR-share feature, 128-word RAM with parity, HR channel sharing enabled |
| Operating Temp | −40°C to +125°C (Automotive Grade 1), qualified per AEC-Q100 Rev G |
Pinout & Package
Package: 100-pin Plastic Quad Flatpack (PZ), green/lead-free, 0.5mm pitch, 14mm × 14mm body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HET[0] | High-End Timer Channel 0 | Programmable I/O for capture/compare; can be configured as general-purpose input/output |
| CAN1STX | DCAN1 Transmit Output | Drives CAN bus differential signal; supports up to 1 Mbps; requires external transceiver |
| CAN1SRX | DCAN1 Receive Input | Receives CAN bus differential signal; internal comparator with hysteresis and filtering |
| MIBSPI1SOMI | MibSPI1 Serial Output from Master/Slave | Input to master or output from slave; supports full-duplex communication with configurable polarity/phase |
| ADIN[0] | Analog Input Channel 0 | 10-bit ADC input with sample-and-hold; referenced to ADREFHI/ADREFLO; supports single/continuous conversion |
| RST | Reset Input | Asynchronous active-low reset; initiates power-on reset sequence and clears CPU, peripherals, and registers |
| VCC | Core Power Supply | 3.3V nominal supply for digital logic; decoupling required per TI layout guidelines (SPNS159C Section 7.2) |
| VCCAD | Analog Power Supply | 3.3V analog domain supply; isolated from digital VCC to minimize noise coupling into ADC path |
Key Features
| Feature | Design Value |
|---|---|
| ECC Protection | SECDED on 320KB flash and 16KB SRAM enables single-bit correction and double-bit detection for ASIL-B compliance |
| Built-in Self Test | LBIST (CPU) and MBIST (SRAM) execute at boot or runtime to validate functional integrity before safety-critical operation |
| FMzPLL Clock Module | Zero-pin PLL eliminates external loop filter components; provides stable 80MHz HCLK and independent peripheral clocks |
| HET XOR-Share | Enables sub-channel pulse generation by XORing adjacent high-resolution HET outputs - critical for precise PWM dead-time control |
| Error Signaling Module (ESM) | Centralized error aggregator with priority-encoded interrupt output to VIM, simplifying fault response in safety firmware |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time fuel injection timing, spark advance calculation, and knock detection using multi-sensor fusion. IC Role / Device Role / Timing Role: Primary controller executing deterministic control loops at ≤100 µs intervals with CAN-based actuator coordination. Use Value: 10-bit MibADC with 1.55 µs conversion time captures crank/cam signals accurately; dual CAN handles powertrain and diagnostics traffic simultaneously. |
Use Scenario: Clutch pressure modulation, gear shift scheduling, and torque converter lock-up control under thermal stress. IC Role / Device Role / Timing Role: Safety-aware real-time executor with ECC-protected flash storing calibrated shift maps and fault recovery routines. Use Value: SECDED ECC ensures firmware integrity during voltage transients; HET generates precise PWM for solenoid drivers without CPU overhead. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
|
Use Scenario: Assist torque calculation, motor phase current sensing, and road feedback compensation in compact EPS assemblies. IC Role / Device Role / Timing Role: Sensor fusion hub interfacing with torque sensor, motor encoder, and vehicle speed CAN bus. Use Value: 16-channel ADC acquires analog sensor data concurrently; LIN/SCI interfaces enable communication with steering angle sensor and host ECU. |
Use Scenario: ABS/EBD pressure modulation, wheel speed monitoring, and brake-by-wire actuation in harsh under-hood environments. IC Role / Device Role / Timing Role: Fault-tolerant controller performing cyclic self-tests and managing dual-redundant CAN networks. Use Value: ESM aggregates faults from DCAN, ADC, and memory BIST; RTI and DWD provide fail-safe watchdog and timing supervision. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS470MF04207SPZQQ1 | 448KB flash + 24KB SRAM vs. 320KB + 16KB; identical pinout, peripherals, and safety features | Higher memory capacity supports larger control algorithms and OTA update partitions | Select when >320KB flash or >16KB SRAM is required for application code or data logging |
| RM46L852ZWTT | ARM Cortex-R4F core, 1MB flash, 192KB RAM, dual-lockstep CPU, higher ASIL-D readiness | Targeted for ASIL-D systems requiring redundant execution; lacks HET but adds VIM enhancements | Choose for next-generation safety architectures needing lockstep validation and larger memory footprint |
Compared with X4MF03107SPZQQ1, TMS470MF04207SPZQQ1 offers direct pin-compatible memory scaling, while RM46L852ZWTT shifts to a higher-safety R4F architecture with lockstep - making X4MF03107SPZQQ1 optimal for cost-sensitive ASIL-B applications where HET-based timing precision is essential.
Availability
X4MF03107SPZQQ1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across extended automotive lifecycles.
Supply support for X4MF03107SPZQQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for automotive, industrial, and communications markets.
The TMS470M family - including X4MF03107SPZQQ1 - was engineered for high-integrity automotive real-time control, integrating safety mechanisms (ECC, BIST, ESM) and deterministic peripherals (HET, DCAN, MibADC) into a single-chip solution.
FAQ
What is the maximum system clock frequency supported by the X4MF03107SPZQQ1?
The X4MF03107SPZQQ1 supports up to 80MHz system clock frequency when flash is operated in pipeline mode. This requires configuration of the FRDCNTL register post-reset; the device powers up in non-pipeline mode (28MHz max) by default. The FMzPLL generates the base clock, and the global clock module distributes HCLK, GCLK, and peripheral clocks accordingly. X4MF03107SPZQQ1 achieves this performance while maintaining single-cycle memory access and deterministic interrupt latency.
Does the X4MF03107SPZQQ1 support EEPROM emulation, and how is it implemented?
Yes, the X4MF03107SPZQQ1 supports EEPROM emulation using its 64KB secondary flash bank (Bank 1). This bank is organized into four 16KB sectors and can be independently erased and programmed to emulate byte-addressable nonvolatile storage. TI's nowFlash™ tool and associated firmware libraries provide wear-leveling, error handling, and atomic write primitives. X4MF03107SPZQQ1's flash ECC ensures data integrity during emulation cycles, critical for storing calibration parameters or fault logs.
How does the HET XOR-share feature function on the X4MF03107SPZQQ1?
The HET XOR-share feature on X4MF03107SPZQQ1 allows adjacent high-resolution HET channels (e.g., HET[0] and HET[1]) to be logically XORed, generating sub-channel pulses with finer timing resolution than native HET granularity. This is implemented in hardware within the HET micromachine and requires no CPU intervention. X4MF03107SPZQQ1 uses this to achieve precise dead-time control in motor gate drivers or generate complementary PWM signals with programmable overlap prevention.
What safety certifications apply to the X4MF03107SPZQQ1?
The X4MF03107SPZQQ1 is qualified to AEC-Q100 Grade 1 (−40°C to +125°C) and incorporates hardware safety mechanisms aligned with ISO 26262 ASIL-B requirements: SECDED ECC on flash/SRAM, LBIST/MBIST, ESM, CRC module, and FMzPLL clock monitoring. While not pre-certified to ASIL-B, X4MF03107SPZQQ1 provides the foundational hardware features required for customer-led functional safety qualification. Documentation such as SPNS159C and the TMS470M Functional Safety Manual supports safety case development.
Can the X4MF03107SPZQQ1 operate with a single 3.3V supply, and what are the voltage domain separations?
Yes, the X4MF03107SPZQQ1 operates from a single 3.3V supply (VCC) for digital logic, while maintaining separate analog (VCCAD/VSSAD) and I/O (VCCIOR) domains. VCCAD powers the 10-bit MibADC and reference circuitry; VCCIOR supplies the 3.3V I/O buffers with adaptive 4mA drive strength. Internal regulators generate the 1.55V core voltage. X4MF03107SPZQQ1 requires proper decoupling per TI's layout guidelines to prevent noise coupling between domains - especially critical for ADC accuracy and CAN signal integrity.
X4MF03107SPZQQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Hercules™ TMS470M ARM® Cortex®-M3
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 16/32-Bit
- Speed:
- 80MHz
- Connectivity:
- CANbus, LINbus, MibSPI, SCI, UART/USART
- Peripherals:
- POR, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 320KB (320K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.4V ~ 1.7V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
X4MF03107SPZQQ1 FAQ
1.How can I place an order for X4MF03107SPZQQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for X4MF03107SPZQQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for X4MF03107SPZQQ1 reliable?
The price and inventory of X4MF03107SPZQQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for X4MF03107SPZQQ1 is usually 5 days.
3.What payment methods are accepted for X4MF03107SPZQQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for X4MF03107SPZQQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for X4MF03107SPZQQ1?
X4MF03107SPZQQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your X4MF03107SPZQQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for X4MF03107SPZQQ1?
For technical support, including X4MF03107SPZQQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your X4MF03107SPZQQ1 requirements.
6.How does Aetrix verify that X4MF03107SPZQQ1 is sourced from the original manufacturer or authorized distributors?
All X4MF03107SPZQQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that X4MF03107SPZQQ1 meets industry standards.
7.What is the process for return or replacement of X4MF03107SPZQQ1?
All X4MF03107SPZQQ1 units undergo pre-shipment inspection (PSI). If there is an issue with X4MF03107SPZQQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The X4MF03107SPZQQ1 part is unused and in its original packaging.
Return procedure for X4MF03107SPZQQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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