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Texas Instruments X66AK2H06AAAW2

Part No.:
X66AK2H06AAAW2
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixX66AK2H06AAAW2.pdf
Description:
IC DSP ARM SOC BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

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Product details

Overview

X66AK2H06AAAW2 from Texas Instruments is a KeyStone II–based multicore SoC integrating two ARM Cortex-A15 processors (up to 1.4 GHz) and four TMS320C66x DSP cores (up to 1.2 GHz), with 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It delivers 2.8 GHz aggregate ARM and 4.8 GHz aggregate DSP processing for media infrastructure and packet-processing applications.

For engineers reviewing the X66AK2H06AAAW2 datasheet, X66AK2H06AAAW2 pinout, X66AK2H06AAAW2 application, or X66AK2H06AAAW2 equivalent, key selection considerations include its 1517-pin AAW BGA package, 14 × 64-bit timers, SmartReflex™ core voltage scaling, and support for IEEE 1588 time synchronization in telecom edge nodes.

Technical Context

The X66AK2H06AAAW2 implements a heterogeneous multicore architecture where the ARM CorePac handles OS-level tasks and system control while the C66x DSP CorePacs execute real-time signal processing, with coherent interconnect via AMBA 4.0 ACE and TeraNet. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA for offloading data movement from CPU cores.

Network Coprocessor integration includes dedicated Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, HMAC, IPSec up to 2.4 Gbps), both operating independently of main CPU clusters. The 5-port SGMII Ethernet switch subsystem supports full wire-speed 1-Gbps forwarding with IEEE 1588 Annex D/E and SyncE timing support.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores 2× ARM Cortex-A15 @ up to 1.4 GHz + 4× C66x DSP @ up to 1.2 GHz - enables concurrent high-level OS execution and deterministic real-time signal processing.
Memory Subsystem 6 MB MSMC SRAM shared across all cores + dual 72-bit DDR3/DDR3L @ 1600 MHz - provides low-latency cache-coherent access and high-bandwidth external memory for streaming workloads.
Timers Fourteen 64-bit configurable timers - supports precise scheduling, timestamping, and real-time event management in telecom and media applications.
Networking 5-port Gigabit Ethernet switch (SGMII) + Serial RapidIO 2.1 (4 lanes) + PCIe Gen2 (2 lanes) - enables multi-protocol backhaul, fronthaul, and chip-to-chip interconnect without external switches.
Security & Acceleration Hardware-accelerated IPSec, SSL/TLS, and air interface ciphering (up to 2.4 Gbps) + packet acceleration for GTP-U, SCTP, PDCP - reduces CPU load for encrypted mobile traffic processing.
Package & Thermal 1517-pin flip-chip BGA (AAW), 40 mm × 40 mm, 0°C to 85°C commercial temperature range - compatible with standard high-density PCB assembly and thermal management for embedded infrastructure.

Pinout & Package

The X66AK2H06AAAW2 is housed in a 1517-ball flip-chip plastic BGA (package code AAW), 40 mm × 40 mm, with 1.0 mm ball pitch. Ball assignment follows TI's standardized AAW pin map; 10-GbE XFI pins are reserved (no-connect) in this variant.

Pin/Terminal Circuit Role Design Meaning
DDR3AD00–DDR3AD31 DDR3 Address/Data Bus 72-bit wide dual-channel DDR3/DDR3L interface supporting 1600 MHz operation with on-die termination and dynamic ODT control.
HYP0RXP0/HYP0RXN0 etc. HyperLink Differential I/O Two 4-lane HyperLink interfaces for scalable chip-to-chip interconnect with coherency support and up to 50 GBaud aggregate bandwidth.
SGMII0RXP/SGMII0RXN etc. Gigabit Ethernet PHY Interface Five independent SGMII lanes for direct connection to external PHYs or optical modules, supporting IEEE 1588 timestamping at line rate.
PCIETXN0/PCIETXP0 etc. PCIe Gen2 Differential Pair Two-lane PCIe Gen2 endpoint interface enabling high-speed host communication or peripheral expansion with root complex compatibility.
CVDD, DVDD15, AVDDA1 etc. Power Supply Rails Multiple independent voltage domains (core, I/O, analog, USB, DDR) with SmartReflex™ adaptive voltage scaling for dynamic power optimization.

Key Features

Feature Design Value
ARM + DSP Heterogeneous Compute 2× Cortex-A15 + 4× C66x cores enable parallel OS services and real-time signal processing without software abstraction overhead.
Coherent Shared Memory 6 MB MSMC SRAM with MPU protection and ACE coherency allows safe, low-latency data sharing between ARM and DSP clusters.
Hardware Packet Acceleration Dedicated Packet Accelerator offloads GTP-U, SCTP, and PDCP protocol processing from CPUs-enabling 1.5 Mpackets/s at 1 Gbps line rate.
IEEE 1588 Time Synchronization Hardware timestamping engine integrated into SGMII MACs supports sub-100 ns precision for telecom synchronization in mobile backhaul.
SmartReflex™ Power Management Dynamic voltage and frequency scaling per core cluster reduces active power by up to 40% under variable workload conditions.

Applications

Mobile Fronthaul Gateway Media Transcoding Server

Use Scenario: Aggregating and synchronizing CPRI/eCPRI traffic between RRUs and BBU pools in 4G/5G RAN.

IC Role / Device Role / Timing Role: Real-time DSP-based IQ sample processing, IEEE 1588 boundary clock, and SGMII-based transport switching.

Use Value: Eliminates need for discrete FPGA+PHY+switch combo; achieves <1 µs fronthaul latency with deterministic jitter control.

Use Scenario: High-density video transcoding for OTT delivery in cloud edge servers.

IC Role / Device Role / Timing Role: Parallel decode (ARM) + encode (C66x) pipeline with shared MSMC buffer and DDR3 bandwidth optimized for 4K/HEVC streams.

Use Value: Processes 12× 1080p30 streams simultaneously using hardware-accelerated motion estimation and CABAC.

Secure Network Appliance Industrial Video Analytics Edge Node

Use Scenario: Inline encrypted traffic inspection and policy enforcement in enterprise firewalls or SD-WAN gateways.

IC Role / Device Role / Timing Role: Security Accelerator handles AES-GCM/SHA-2 crypto while Packet Accelerator parses GTP/SSL headers in hardware.

Use Value: Delivers 2.4 Gbps IPSec throughput without CPU saturation-enabling full-line-rate encryption at 1 Gbps.

Use Scenario: Real-time object detection and metadata extraction from multi-camera feeds in smart city infrastructure.

IC Role / Device Role / Timing Role: C66x DSPs run CNN inference kernels; ARM cores manage RTSP streaming, storage, and MQTT telemetry.

Use Value: Achieves 30 FPS inference on 1080p video using fixed-point C66x-optimized neural network libraries.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore DSP+ARM applications.

Alternative Part Technical Difference Application Difference Selection Advice
TDA4VM ARM Cortex-A72 + C7x DSP, 8 MB L3 cache, integrated GPU, lower power (7 W typical), no SGMII switch Better suited for automotive ADAS vision processing; lacks telecom-grade packet acceleration and 1588 support Select when AI vision inference dominates over telecom protocol offload and precise time sync.
66AK2H12AAAW2 Same AAW package, but with 4× ARM A15 + 8× C66x cores, 20× 64-bit timers, and identical peripherals Higher compute density for baseband processing or radar beamforming requiring >4.8 GHz DSP throughput Choose when additional DSP capacity justifies higher power and cost-same PCB layout and firmware portability.

Compared with TDA4VM and 66AK2H12AAAW2, the X66AK2H06AAAW2 offers optimal balance of telecom-specific acceleration, IEEE 1588 timing, and 4-core DSP performance for fronthaul and media edge nodes-without over-provisioning for automotive or macro-baseband use cases.

Availability

X66AK2H06AAAW2 is available at Aetrix Electronics and suitable for mobile fronthaul gateways, media transcoding servers, and secure network appliances requiring stable component supply across extended product lifecycles.

Supply support for X66AK2H06AAAW2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The 66AK2Hxx family was designed specifically for high-performance embedded infrastructure-targeting wireless baseband, media processing, and secure packet-forwarding applications where heterogeneous compute and hardware acceleration are critical.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the X66AK2H06AAAW2?

The X66AK2H06AAAW2 integrates two ARM Cortex-A15 processors operating up to 1.4 GHz and four TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions (0°C to 85°C case temperature) with proper power delivery and thermal management. The X66AK2H06AAAW2 does not support higher-frequency variants like the 66AK2H14's 1.6 GHz DSP option.

Does the X66AK2H06AAAW2 support IEEE 1588 Precision Time Protocol?

Yes, the X66AK2H06AAAW2 includes hardware timestamping engines integrated into each of its five SGMII Ethernet MACs, supporting IEEE 1588-2008 Annex D/E and SyncE standards. This enables sub-100 ns timestamp resolution for telecom synchronization in mobile backhaul and fronthaul applications. The X66AK2H06AAAW2 requires external PHYs with PTP-capable MDIO registers for full boundary clock implementation.

How many DDR3 memory channels does the X66AK2H06AAAW2 support, and what is the maximum data rate?

The X66AK2H06AAAW2 supports two independent 72-bit DDR3/DDR3L memory controllers, each capable of 1600 MT/s data rates. Each channel includes on-die termination, dynamic ODT control, and ECC support for 8-bit correction. Total theoretical bandwidth is 25.6 GB/s, shared across ARM, DSP, and accelerator subsystems via the MSMC interconnect.

What differentiates the X66AK2H06AAAW2 from the X66AK2H12AAAW2 in terms of core count and timer resources?

The X66AK2H06AAAW2 contains two ARM Cortex-A15 cores and four C66x DSP cores, whereas the X66AK2H12AAAW2 has four ARM cores and eight DSP cores. Timer count differs accordingly: the X66AK2H06AAAW2 provides fourteen 64-bit configurable timers, while the X66AK2H12AAAW2 offers twenty. Both share identical peripherals including the 5-port SGMII switch and Packet Accelerator.

Is the X66AK2H06AAAW2 pin-compatible with other devices in the 66AK2Hxx family?

Yes, the X66AK2H06AAAW2 shares the same 1517-pin AAW BGA package and mechanical footprint with the X66AK2H12AAAW2 and X66AK2H14AAAW2. All three devices use identical ball mapping for power, ground, DDR3, SGMII, PCIe, HyperLink, and UART interfaces. Reserved balls (e.g., XFI for 10-GbE) are consistent across variants, enabling single PCB design reuse across performance tiers.

X66AK2H06AAAW2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
66AK2Hx KeyStone Multicore
Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Type:
DSP+ARM®
Interface:
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate:
1.2GHz
Non-Volatile Memory:
ROM (384kB)
On-Chip RAM:
8.375MB
Voltage - I/O:
0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core:
Variable
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1517-FCBGA (40x40)

X66AK2H06AAAW2 FAQ

1.How can I place an order for X66AK2H06AAAW2 through Aetrix?

Please submit a Request for Quotation (RFQ) for X66AK2H06AAAW2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for X66AK2H06AAAW2 reliable?

The price and inventory of X66AK2H06AAAW2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for X66AK2H06AAAW2 is usually 5 days.

3.What payment methods are accepted for X66AK2H06AAAW2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for X66AK2H06AAAW2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for X66AK2H06AAAW2?

X66AK2H06AAAW2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your X66AK2H06AAAW2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for X66AK2H06AAAW2?

For technical support, including X66AK2H06AAAW2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your X66AK2H06AAAW2 requirements.

6.How does Aetrix verify that X66AK2H06AAAW2 is sourced from the original manufacturer or authorized distributors?

All X66AK2H06AAAW2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that X66AK2H06AAAW2 meets industry standards.

7.What is the process for return or replacement of X66AK2H06AAAW2?

All X66AK2H06AAAW2 units undergo pre-shipment inspection (PSI). If there is an issue with X66AK2H06AAAW2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The X66AK2H06AAAW2 part is unused and in its original packaging.

Return procedure for X66AK2H06AAAW2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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