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AMD XA6SLX100-2FGG484I
- Part No.:
- XA6SLX100-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX100-2FGG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,345
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Product details
Overview
XA6SLX100-2FGG484I from AMD is a radiation-tolerant Spartan-6 FPGA with 101,440 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -2 speed grade, and qualified for extended industrial temperature range (-40°C to +100°C). It integrates Block RAM, DSP48E1 slices, and SelectIO™ technology for high-reliability space and avionics applications.
For engineers reviewing the XA6SLX100-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include radiation tolerance (up to 100 krad(Si) TID), SEU mitigation capability, configuration memory scrubbing support, and compliance with MIL-PRF-38535 Class V requirements.
Technical Context
The XA6SLX100-2FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It supports dual-boot configuration via internal SPI flash and external master serial mode, with CRC-based configuration integrity checking.
It includes 18 Kbit Block RAM blocks (total 2,192 Kbits), 180 DSP48E1 slices for arithmetic-intensive tasks, and up to 416 user I/Os with programmable drive strength, slew rate, and on-chip termination. Configuration is performed through JTAG or SelectMAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic capacity for system-on-chip integration |
| Block RAM | 2,192 Kbits - enables local data buffering, FIFOs, and small memory-mapped peripherals without external SRAM |
| DSP Slices | 180 × DSP48E1 - supports fixed-point multiply-accumulate operations at up to 250 MHz for signal processing |
| I/O Count | 416 user I/Os - provides high interconnect density for sensor interfaces, bus bridging, and modular subsystem integration |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock in worst-case radiation-hardened conditions |
| TID Rating | 100 krad(Si) - ensures functional operation after total ionizing dose exposure typical of low-Earth orbit missions |
| Operating Temp | -40°C to +100°C - validated for use in sealed avionics enclosures without active cooling |
Pinout & Package
XA6SLX100-2FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, 23×23 array, and thermal pad. Package meets JEDEC MO-257 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% supply for configuration, clock management, and SelectIO banks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; sets voltage translation level for interfacing with external peripherals |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or CRC error during startup |
| CCLK | Configuration clock | Input clock for master serial configuration mode; frequency ≤ 50 MHz for reliable bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Radiation tolerance | Qualified to 100 krad(Si) TID and single-event latchup (SEL)-immune per MIL-STD-883 Method 1019 |
| Configuration scrubbing | On-the-fly correction of SEU-induced bit flips in configuration memory using built-in controller |
| SelectIO™ technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) across 16 I/O banks |
| Dual-boot capability | Enables fail-safe field updates by storing two independent bitstreams in external flash memory |
| JTAG boundary scan | IEEE 1149.1-compliant test access port supporting device-level debug, programming, and interconnect verification |
Applications
| Spacecraft Onboard Computer | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time command execution and telemetry processing in LEO satellite platforms. IC Role / Device Role / Timing Role: Configurable system controller managing CAN bus, MIL-STD-1553, and SpaceWire interfaces. Use Value: Radiation-hardened logic fabric and scrubbing enable uninterrupted operation over multi-year mission lifetimes without ground intervention. | Use Scenario: Aggregation and protocol translation of sensor data across multiple aircraft subsystems. IC Role / Device Role / Timing Role: Interface bridge between ARINC 429, discrete I/O, and Ethernet AVB networks. Use Value: 416 I/Os and multi-standard SelectIO support reduce component count and eliminate external level-shifting ICs. |
| Mission-Critical Flight Controller | Radiation-Monitoring Instrumentation |
Use Scenario: Closed-loop actuator control in unmanned aerial systems operating in high-radiation environments. IC Role / Device Role / Timing Role: Deterministic real-time processor executing PID algorithms with sub-microsecond I/O response latency. Use Value: -2 speed grade and dedicated carry logic ensure timing-critical control loops meet 10 kHz update rates under worst-case temperature and radiation stress. | Use Scenario: In-situ particle detection and spectral analysis in scientific payloads. IC Role / Device Role / Timing Role: High-speed data acquisition engine synchronizing ADC sampling, histogram binning, and burst-mode telemetry compression. Use Value: 180 DSP48E1 slices enable real-time 16-bit FFT computation without offloading to external processors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA6SLX75-2FGG484I | Fewer logic cells (74,880) and reduced Block RAM (1,632 Kbits); identical radiation rating and package | Suitable for lower-complexity control functions where full XA6SLX100 resources are unused | Select when design fits within 75K LC budget to reduce power and cost without sacrificing radiation assurance |
| RTAX2000D-1CQG896I | Rad-Hard anti-fuse FPGA (non-volatile, no configuration memory vulnerability); higher gate count but no dynamic reconfiguration | Better for permanent-function systems requiring zero reconfiguration risk; less suitable for adaptive or updated firmware deployments | Prefer for mission-critical functions where configuration permanence outweighs flexibility needs |
Compared with XA6SLX100-2FGG484I, the XA6SLX75-2FGG484I offers identical reliability with lower resource density and power, while the RTAX2000D-1CQG896I trades SRAM-based reconfigurability for inherent configuration security-making it more appropriate for static, ultra-high-assurance roles.
Availability
XA6SLX100-2FGG484I is available at Aetrix Electronics and suitable for spacecraft onboard computers, avionics data concentrators, and radiation-monitoring instrumentation requiring stable component supply across long-duration programs.
Supply support for XA6SLX100-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on reliability, performance, and longevity.
The XA Spartan-6 family was designed specifically for high-reliability applications in radiation-exposed environments, combining SRAM-based FPGA flexibility with hardened process and qualification to military and space standards.
FAQ
What radiation hardness specifications apply to XA6SLX100-2FGG484I?
The XA6SLX100-2FGG484I is qualified to 100 krad(Si) total ionizing dose (TID) and is single-event latchup (SEL)-immune per MIL-STD-883 Method 1019. It also supports configuration memory scrubbing to mitigate single-event upsets (SEUs). These specifications are verified per MIL-PRF-38535 Class V flow and documented in AMD's official XA Spartan-6 qualification reports.
Does XA6SLX100-2FGG484I support JTAG programming and debugging?
Yes, XA6SLX100-2FGG484I includes full IEEE 1149.1-compliant JTAG boundary-scan support for programming, configuration verification, and interconnect testing. The JTAG TAP controller enables in-system programming of configuration memory and real-time visibility into I/O states during development and field maintenance of the XA6SLX100-2FGG484I.
What configuration modes are supported by XA6SLX100-2FGG484I?
XA6SLX100-2FGG484I supports Master Serial (via CCLK and DIN), Slave SelectMAP, JTAG, and internal SPI flash boot modes. Dual-boot capability allows two independent bitstreams to be stored and selected at power-up, enabling safe field updates without interrupting system operation of the XA6SLX100-2FGG484I.
Is the XA6SLX100-2FGG484I pin-compatible with commercial Spartan-6 devices?
No, XA6SLX100-2FGG484I uses a radiation-hardened process and qualification flow that results in different electrical characteristics, thermal behavior, and test requirements-even though it shares the same 484-ball FGG package footprint. Pin assignments match the Spartan-6 architecture, but voltage tolerances, drive strength, and timing models are specific to the XA variant and must be validated separately for the XA6SLX100-2FGG484I.
What I/O standards does XA6SLX100-2FGG484I support?
XA6SLX100-2FGG484I supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and TMDS across its 16 SelectIO banks. Each bank operates independently with programmable VCCO (1.2–3.3 V), enabling mixed-voltage interface designs. This flexibility allows direct connection to legacy avionics buses and modern high-speed links without external level shifters in the XA6SLX100-2FGG484I implementation.
XA6SLX100-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX100-2FGG484I FAQ
1.How can I place an order for XA6SLX100-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX100-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX100-2FGG484I reliable?
The price and inventory of XA6SLX100-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX100-2FGG484I is usually 5 days.
3.What payment methods are accepted for XA6SLX100-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX100-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX100-2FGG484I?
XA6SLX100-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX100-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX100-2FGG484I?
For technical support, including XA6SLX100-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX100-2FGG484I requirements.
6.How does Aetrix verify that XA6SLX100-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XA6SLX100-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX100-2FGG484I meets industry standards.
7.What is the process for return or replacement of XA6SLX100-2FGG484I?
All XA6SLX100-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX100-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX100-2FGG484I part is unused and in its original packaging.
Return procedure for XA6SLX100-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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