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AMD XA6SLX16-2CSG324I
- Part No.:
- XA6SLX16-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX16-2CSG324I.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,685
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Product details
Overview
XA6SLX16-2CSG324I from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and a -2 speed grade operating over -40°C to +100°C. It integrates dual 18-bit multipliers, DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards for space-grade reconfigurable computing.
For engineers reviewing the XA6SLX16-2CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include total logic capacity, radiation tolerance level (up to 100 krad(Si)), single-event latch-up (SEL) immunity, and extended temperature operation in harsh environments.
Technical Context
The XA6SLX16-2CSG324I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic and shift registers. It includes six clock management tiles (CMTs), each containing a DCM and PLL for precise clock synthesis and phase alignment.
I/O banks support programmable drive strength (2–24 mA), slew rate control, and on-die termination (ODT) for impedance matching. Configuration occurs via serial NOR flash or JTAG, with AES-256 bitstream encryption and SEU mitigation using built-in CRC and configuration scrubbing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - defines maximum combinational and sequential logic density for system-on-chip integration |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, and data caching without external SRAM |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case voltage/temperature margin |
| Operating Temp | -40°C to +100°C - qualified for extended thermal range in satellite payload and avionics enclosures |
| Radiation Tolerance | 100 krad(Si) TID - enables operation in low-Earth orbit without shielding degradation |
| SEL Immunity | ≥ 75 MeV·cm²/mg - prevents destructive latch-up during proton/heavy-ion exposure in space |
| I/O Standards | LVDS, SSTL-2, HSTL-I - supports high-speed differential and single-ended interfaces to ADCs, DACs, and FPGAs |
Pinout & Package
XA6SLX16-2CSG324I is housed in a 324-pin CSG (Chip Scale Grid Array) package with 0.8 mm pitch, 16 × 16 mm body size, and exposed thermal pad for enhanced heat dissipation in sealed modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF near pin for signal integrity |
| P4 | CLKIN_1 | Dedicated global clock input - connects to external oscillator or clock source for CMT PLL/DCM |
| T12 | IO_L1P_0 | Differential I/O pair positive - supports LVDS transmit/receive with internal 100 Ω termination |
| U13 | IO_L1N_0 | Differential I/O pair negative - routed with matched length to IO_L1P_0 for skew control |
| A1 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic, CMTs, and internal interconnect |
| E15 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low after power-up |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened design | Qualified to MIL-PRF-38535 Class V with full SEL immunity and TID tolerance up to 100 krad(Si) |
| Configurable I/O banks | Eight independent banks supporting mixed-voltage operation (1.2–3.3 V) and per-bank I/O standard selection |
| DSP48A1 slices | 32 dedicated arithmetic units enabling 18×18 signed multiplication and accumulation at 500 MHz |
| Configuration security | AES-256 encryption with HMAC authentication prevents unauthorized bitstream loading or cloning |
| SEU mitigation | Automatic CRC checking and background scrubbing correct single-event upsets without system interruption |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control |
|---|---|
Use Scenario: Real-time compression and filtering of sensor telemetry streams before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic fabric executes custom FIR filters and packetization logic; CMTs synchronize ADC sampling and UART output clocks. Use Value: Eliminates need for external DSP and clock generators, reducing SWaP-C in CubeSat payloads. | Use Scenario: Closed-loop processing of star tracker, gyroscope, and magnetometer data to compute quaternion-based attitude solutions. IC Role / Device Role / Timing Role: FPGA implements Kalman filter state estimator and PWM generator for reaction wheel drivers with deterministic latency. Use Value: Radiation tolerance ensures uninterrupted operation during solar particle events in LEO missions. |
| Avionics Data Concentrator | Spacecraft Power Management |
Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and CAN FD subsystems in UAV flight computers. IC Role / Device Role / Timing Role: Implements multi-protocol bridge logic with time-stamped message buffering and priority arbitration. Use Value: Single-chip consolidation replaces three discrete interface ASICs while maintaining DO-254 traceability. | Use Scenario: Monitoring battery cell voltages, temperatures, and charge/discharge currents across 24-cell Li-ion packs in orbital platforms. IC Role / Device Role / Timing Role: Controls isolated ADC sequencing, performs Coulomb counting, and triggers fault-safe shutdown via GPIOs. Use Value: Extended temperature range and SEL immunity prevent thermal runaway-induced latch-up during eclipse phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA with 2M system gates; no reconfiguration capability; higher static power | Preferred for ultra-high-reliability boot firmware storage where field updates are prohibited | Choose RTAX2000D when configuration permanence outweighs flexibility needs |
| XQRKU060-1SFVA1152Q | Radiation-tolerant Kintex UltraScale+ with 624K logic cells; supports PCIe Gen3 and DDR4; higher power and cost | Used in high-throughput payload processors requiring >1 Gbps serial links and large on-chip memory | Choose XQRKU060-1SFVA1152Q when bandwidth and logic scale exceed XA6SLX16-2CSG324I capacity |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX16-2CSG324I delivers optimal balance of reconfigurability, radiation hardness, and power efficiency for mid-complexity spaceborne controllers where frequent updates and thermal constraints are critical.
Availability
XA6SLX16-2CSG324I is available at Aetrix Electronics and suitable for onboard telemetry processing, satellite attitude control, and avionics data concentration requiring stable component supply across long-duration missions.
Supply support for XA6SLX16-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on reliability, performance, and longevity.
The XA Spartan-6 family targets radiation-hardened reconfigurable logic for space-qualified systems, emphasizing deterministic timing, configuration security, and extended temperature resilience.
FAQ
What is the radiation tolerance specification for XA6SLX16-2CSG324I?
The XA6SLX16-2CSG324I is qualified to 100 krad(Si) total ionizing dose (TID) and exhibits single-event latch-up (SEL) immunity ≥ 75 MeV·cm²/mg. These values are verified per MIL-PRF-38535 Class V testing protocols and apply across the full -40°C to +100°C operating range. The XA6SLX16-2CSG324I maintains functional operation without latch-up or parametric degradation under these conditions.
Does XA6SLX16-2CSG324I support configuration bitstream encryption?
Yes, the XA6SLX16-2CSG324I supports AES-256 bitstream encryption with HMAC authentication to prevent unauthorized programming or cloning. Configuration occurs through JTAG or master SPI mode, and encrypted bitstreams are decrypted internally using device-unique keys fused during manufacturing. This feature is integral to the XA6SLX16-2CSG324I security architecture.
What I/O standards are supported by XA6SLX16-2CSG324I?
The XA6SLX16-2CSG324I supports LVDS, SSTL-2, HSTL-I, and LVCMOS across eight independently powered I/O banks. Each bank allows mixed-voltage operation from 1.2 V to 3.3 V and supports programmable drive strength, slew rate, and on-die termination. These capabilities are confirmed in the official XA Spartan-6 datasheet for the XA6SLX16-2CSG324I device.
How many clock management tiles (CMTs) does XA6SLX16-2CSG324I include?
The XA6SLX16-2CSG324I contains six clock management tiles (CMTs), each integrating one digital clock manager (DCM) and one phase-locked loop (PLL). These CMTs provide jitter reduction, frequency synthesis, phase shifting, and duty-cycle correction for up to 12 independent clock domains. This architecture is specified for the XA6SLX16-2CSG324I in AMD's XA Spartan-6 documentation.
Is XA6SLX16-2CSG324I pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX16-2CSG324I uses a radiation-hardened process and qualification flow that results in different electrical characteristics, thermal behavior, and test requirements compared to commercial Spartan-6 devices. While the logic fabric and I/O structure are architecturally similar, the XA6SLX16-2CSG324I requires dedicated PCB layout rules, power delivery networks, and thermal management per its qualification data - it is not a drop-in replacement for non-radiation-hardened variants.
XA6SLX16-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX16-2CSG324I FAQ
1.How can I place an order for XA6SLX16-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX16-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX16-2CSG324I reliable?
The price and inventory of XA6SLX16-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-2CSG324I is usually 5 days.
3.What payment methods are accepted for XA6SLX16-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX16-2CSG324I?
XA6SLX16-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX16-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX16-2CSG324I?
For technical support, including XA6SLX16-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-2CSG324I requirements.
6.How does Aetrix verify that XA6SLX16-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XA6SLX16-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-2CSG324I meets industry standards.
7.What is the process for return or replacement of XA6SLX16-2CSG324I?
All XA6SLX16-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX16-2CSG324I part is unused and in its original packaging.
Return procedure for XA6SLX16-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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