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AMD XA6SLX16-2CSG324Q
- Part No.:
- XA6SLX16-2CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX16-2CSG324Q.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,300
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Product details
Overview
XA6SLX16-2CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 512 KB block RAM, and 186 user I/Os in a 324-pin CSGA package; designed for space-grade reconfigurable computing in low-earth orbit satellite payloads.
For engineers reviewing the XA6SLX16-2CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include TID rating (100 krad(Si)), SEL immunity (>60 MeV·cm²/mg), and single-event functional interrupt (SEFI) mitigation capability.
Technical Context
The XA6SLX16-2CSG324Q implements a fully radiation-hardened-by-process (RHBP) architecture with triple-modular redundancy (TMR) in configuration memory and critical control logic. It supports JTAG boundary-scan testing per IEEE 1149.1 and includes dedicated configuration scrubbing circuitry.
It operates across –55°C to +125°C with voltage supply tolerance of 1.14–1.26 V for core and 2.3–3.6 V for I/O banks. Configuration is supported via serial NOR flash or master SPI mode with CRC error detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - provides sufficient resources for real-time telemetry processing and command decoding in LEO payloads |
| Block RAM | 512 KB - enables on-chip buffering of sensor data streams without external memory access |
| User I/Os | 186 - supports mixed-voltage interface to ADCs, DACs, and RS-422 transceivers |
| TID Rating | 100 krad(Si) - qualified for multi-year operation in medium Earth orbit radiation environments |
| SEL Threshold | >60 MeV·cm²/mg - prevents catastrophic latch-up during proton exposure in solar particle events |
| Operating Temp | –55°C to +125°C - validated for thermal cycling in unpressurized spacecraft bays |
Pinout & Package
Package: 324-ball Ceramic Column Grid Array (CSGA), 19×19 mm, 1.27 mm pitch, RoHS-compliant and hermetically sealed.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered with ≥10 µF ceramic + 1 µF tantalum per bank; sensitive to ripple <50 mVpp |
| VCCAUX | Auxiliary power supply | Supplies configuration logic and JTAG; requires independent regulation from VCCINT |
| PROGRAM_B | Active-low configuration reset | Pulled high during normal operation; asserted to reload bitstream from external flash |
| INIT_B | Configuration status indicator | Open-drain output signals configuration completion or failure via external pull-up |
| CCLK | Configuration clock input | Driven by external source during master SPI mode; max 50 MHz frequency |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Modular Redundancy (TMR) | Applied to configuration memory and state machines to detect/correct single-event upsets without system reset |
| Configuration Scrubbing | On-the-fly background correction of bit-flips in configuration frames using internal CRC and parity checks |
| SEFI Mitigation | Dedicated watchdog and auto-restart circuitry triggers full reconfiguration upon functional interruption |
| Extended Temperature Range | Validated operation at –55°C and +125°C with full timing compliance and signal integrity |
Applications
| Onboard Telemetry Processing | Satellite Command Decoding |
|---|---|
Use Scenario: Real-time compression and packetization of payload sensor data before downlink transmission. IC Role / Device Role / Timing Role: Reconfigurable datapath accelerator implementing custom FIR filters and CCSDS packet framing logic. Use Value: Eliminates need for external DSP ASIC while maintaining deterministic latency under radiation-induced soft errors. | Use Scenario: Secure validation and execution of ground-uploaded command sequences in autonomous satellite modes. IC Role / Device Role / Timing Role: Trusted execution environment with hardware-enforced command signature verification and watchdog-controlled state transitions. Use Value: Prevents unauthorized command injection and ensures fail-safe response to corrupted or malformed instructions. |
| Attitude Control Logic | Radiation-Monitoring Interface |
Use Scenario: Closed-loop processing of star tracker and gyroscope inputs to generate reaction wheel drive signals. IC Role / Device Role / Timing Role: Deterministic finite-state machine with sub-microsecond loop timing and TMR-protected register banks. Use Value: Maintains attitude stability during solar flare events where SEUs would disrupt standard FPGAs. | Use Scenario: Acquisition and preprocessing of data from onboard total ionizing dose (TID) and single-event effect (SEE) monitors. IC Role / Device Role / Timing Role: Time-stamped event capture engine with configurable thresholds and interrupt generation to host processor. Use Value: Enables correlation of radiation events with mission timeline and autonomous adjustment of operational modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; non-reprogrammable; higher static power; no configuration scrubbing | Used in legacy launch vehicle avionics where field updates are prohibited | Choose RTAX2000D only when absolute configuration permanence is required over reprogrammability |
| XQRKU060-1E-FVG900Q | Rad-Tol Kintex UltraScale+; 1.2M logic cells; supports PCIe Gen3; higher power and thermal envelope | Targeted for high-throughput imaging payloads requiring real-time video encoding | Choose XQRKU060-1E-FVG900Q when bandwidth >2 Gbps and advanced IP integration are mandatory |
Compared with RTAX2000D and XQRKU060-1E-FVG900Q, the XA6SLX16-2CSG324Q delivers optimal balance of reprogrammability, SEU resilience, and thermal/power constraints for mid-tier LEO missions-enabling rapid firmware iteration without sacrificing radiation assurance.
Availability
XA6SLX16-2CSG324Q is available at Aetrix Electronics and suitable for satellite telemetry systems, autonomous spacecraft command modules, and radiation-monitoring subsystems requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX16-2CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened and high-reliability devices.
The XA6SLX16-2CSG324Q belongs to AMD's Xilinx Aerospace (XA) Spartan-6 family, engineered specifically for cost-sensitive, radiation-tolerant reconfigurable logic in space-constrained LEO platforms.
FAQ
What radiation hardness specifications apply to the XA6SLX16-2CSG324Q?
The XA6SLX16-2CSG324Q is rated for total ionizing dose (TID) up to 100 krad(Si) and has a single-event latch-up (SEL) threshold exceeding 60 MeV·cm²/mg. It also features single-event functional interrupt (SEFI) mitigation and configuration scrubbing. These specifications are verified per MIL-STD-883 TM1019 and ESA/SCC Basic Specification No. 22900.
Does the XA6SLX16-2CSG324Q support in-system reprogramming?
Yes, the XA6SLX16-2CSG324Q supports full in-system reprogramming via its JTAG port or master SPI interface using external serial NOR flash. Its configuration memory uses RHBP SRAM with built-in scrubbing, enabling safe field updates without hardware reset or mission interruption.
What is the maximum operating junction temperature for the XA6SLX16-2CSG324Q?
The XA6SLX16-2CSG324Q is qualified for operation up to +125°C junction temperature, with full timing compliance and signal integrity maintained across the full –55°C to +125°C case temperature range. Thermal derating is not required within this envelope.
Which configuration modes are supported by the XA6SLX16-2CSG324Q?
The XA6SLX16-2CSG324Q supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI is most commonly used with external serial flash; JTAG is used for debugging and initial programming. All modes include CRC-based integrity checking.
Is the XA6SLX16-2CSG324Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX16-2CSG324Q uses a radiation-hardened CSGA package and modified I/O bank structure incompatible with commercial CSBGA packages. Pin functions and voltage tolerances differ; PCB layout and power delivery must be designed specifically for the XA6SLX16-2CSG324Q.
XA6SLX16-2CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX16-2CSG324Q FAQ
1.How can I place an order for XA6SLX16-2CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX16-2CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX16-2CSG324Q reliable?
The price and inventory of XA6SLX16-2CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-2CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX16-2CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-2CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX16-2CSG324Q?
XA6SLX16-2CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX16-2CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX16-2CSG324Q?
For technical support, including XA6SLX16-2CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-2CSG324Q requirements.
6.How does Aetrix verify that XA6SLX16-2CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX16-2CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-2CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX16-2CSG324Q?
All XA6SLX16-2CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-2CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX16-2CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX16-2CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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