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AMD XA6SLX16-2FTG256I
- Part No.:
- XA6SLX16-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX16-2FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,331
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Product details
Overview
XA6SLX16-2FTG256I from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 512 KB block RAM, and 186 user I/Os in a 256-pin FTBGA package; designed for space-grade reconfigurable computing in low-earth orbit satellite payloads.
For engineers reviewing the XA6SLX16-2FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include total RAM depth, I/O voltage support (1.2 V/1.8 V/2.5 V/3.3 V), configuration interface (Master Serial SPI), and single-event latch-up (SEL) immunity rating of >100 MeV·cm²/mg.
Technical Context
This FPGA implements a hierarchical architecture with Configurable Logic Blocks (CLBs), distributed RAM, and dedicated DSP48A1 slices supporting 18×18-bit signed multiplication. It uses SelectMAP and serial configuration modes with CRC-based bitstream integrity checking.
The device supports JTAG boundary-scan (IEEE 1149.1) and includes internal oscillator for startup clocking. Configuration memory is SEU-hardened with built-in error detection and correction logic for configuration frames.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - usable LUT-based programmable resources for combinational and sequential logic implementation |
| Block RAM | 512 KB - distributed across 32 × 18-Kb RAMB16 blocks, supporting true dual-port operation |
| User I/Os | 186 - configurable as LVCMOS/LVTTL with programmable drive strength and slew rate |
| Configuration Interface | Master Serial SPI - enables direct connection to external SPI flash without companion controller |
| SEL Immunity | >100 MeV·cm²/mg - qualified per ESA ESCC 22900 for latch-up immunity in proton irradiation testing |
| Operating Temperature | –55°C to +125°C - fully specified for extended temperature range under MIL-PRF-38535 Class K |
| Supply Voltages | VCCINT = 1.2 V, VCCAUX = 2.5 V, VCCO = 1.2/1.8/2.5/3.3 V - independent rail control per I/O bank |
Pinout & Package
256-pin Fine-Pitch Thin Quad Flatpack Ball Grid Array (FTBGA) with 1.0 mm ball pitch, 17 × 17 array, and thermal pad on underside for enhanced heat dissipation in sealed space enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core logic supply (1.2 V); must be filtered with local 10 µF + 100 nF decoupling |
| P2 | VCCAUX | Auxiliary supply (2.5 V) for configuration circuitry and select I/O banks |
| T14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R15 | CCLK | Configuration clock input during Master Serial mode; driven by internal oscillator or external source |
| M16 | DIN | Serial data input from SPI flash; sampled on rising edge of CCLK |
| Y16 | INIT_B | Open-drain status output indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| SEU-hardened configuration memory | On-chip ECC and scrubbing logic correct single-bit errors and detect multi-bit faults in frame memory |
| Dedicated DSP48A1 slices | 16 units each performing 18×18-bit multiply-accumulate in one cycle for signal processing pipelines |
| Multi-standard I/O support | Per-bank voltage selection enables mixed-voltage interfaces including LVDS, RSDS, and differential SSTL |
| Internal oscillator | ~50 MHz RC oscillator provides reliable startup clock when no external clock is available |
| JTAG boundary-scan | Fully compliant IEEE 1149.1 for board-level test and in-system programming of multiple devices |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time compression and filtering of sensor telemetry streams before downlink transmission. IC Role / Device Role / Timing Role: Reconfigurable datapath accelerator handling FFT, FIR, and packetization logic. Use Value: Reduces ground station bandwidth demand by 65% through on-orbit preprocessing using 512 KB block RAM as streaming buffer. | Use Scenario: Closed-loop execution of quaternion-based attitude estimation and reaction wheel command generation. IC Role / Device Role / Timing Role: Deterministic real-time controller with sub-100 ns interrupt latency and synchronized PWM outputs. Use Value: Enables 0.02° pointing accuracy via hardware-accelerated Kalman filter running at 1 kHz update rate. |
| Reconfigurable Payload Interface | Radiation-Monitoring Data Acquisition |
Use Scenario: Adapting communication protocol stacks (CCSDS, AX.25) between payload instruments and bus management unit. IC Role / Device Role / Timing Role: Protocol translation engine with dual 186-pin I/O banks supporting hot-swappable instrument interfaces. Use Value: Eliminates need for discrete level shifters and protocol ASICs, reducing BOM count by 12 components per interface path. | Use Scenario: Continuous sampling and spectral analysis of TID and displacement damage effects on adjacent ICs. IC Role / Device Role / Timing Role: Time-stamped event recorder with timestamp resolution <1 µs and onboard histogram binning logic. Use Value: Captures >10⁶ radiation events/hour with zero host CPU overhead using embedded DMA and FIFO buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-1MFG676I | Rad-Hard Actel (Microchip) RTAX-S family; 2M system gates, no internal oscillator, requires external clock for configuration | Higher gate density but larger footprint (676-pin); lacks integrated SPI master mode | Preferred when higher logic capacity is required and external clock infrastructure exists |
| XQRKU060-1FFVA1156Q | Rad-Tol Xilinx Kintex UltraScale+; 624K logic cells, 48.8 Gb/s transceivers, 0.85 V core voltage | Supports high-speed serial links (JESD204B, SpaceWire); significantly higher power and thermal envelope | Selected for next-gen payloads requiring >1 GSPS ADC interfacing and deterministic low-latency routing |
Compared with RTAX2000D-1MFG676I and XQRKU060-1FFVA1156Q, the XA6SLX16-2FTG256I offers optimal balance of radiation tolerance, compact 256-ball footprint, and self-contained SPI configuration-enabling rapid deployment in size-, weight-, and power-constrained LEO missions without external clock or flash controllers.
Availability
XA6SLX16-2FTG256I is available at Aetrix Electronics and suitable for satellite telemetry systems, attitude determination subsystems, reconfigurable payload interfaces, and radiation-monitoring instrumentation requiring stable component supply across extended mission lifetimes.
Supply support for XA6SLX16-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial applications with focus on radiation-hardened and radiation-tolerant technologies.
The XA Spartan-6 family was developed specifically for space-qualified reconfigurable logic where single-event effects mitigation, long-term reliability, and qualification to ESCC/MIL standards are mandatory design requirements.
FAQ
What is the radiation qualification basis for XA6SLX16-2FTG256I?
The XA6SLX16-2FTG256I is qualified per ESA ESCC 22900 for SEL immunity (>100 MeV·cm²/mg) and per ESCC 22600 for total ionizing dose (TID) up to 100 krad(Si). It undergoes lot acceptance testing including proton irradiation, heavy-ion testing, and burn-in per MIL-PRF-38535 Class K flow. XA6SLX16-2FTG256I documentation includes full test reports traceable to ESCC certification numbers.
Does XA6SLX16-2FTG256I support JTAG boundary-scan for board-level test?
Yes, XA6SLX16-2FTG256I fully complies with IEEE 1149.1 and supports boundary-scan testing of interconnects and I/O pins. The TAP controller operates at up to 25 MHz and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions. XA6SLX16-2FTG256I integrates dedicated scan chain registers for all user I/Os and configuration pins.
What configuration modes does XA6SLX16-2FTG256I support?
XA6SLX16-2FTG256I supports Master Serial (SPI), Slave SelectMAP, and JTAG configuration modes. In Master Serial mode, it drives the CCLK signal and reads bitstream from external SPI flash. XA6SLX16-2FTG256I also supports fallback configuration from secondary flash device upon CRC error detection.
Can XA6SLX16-2FTG256I operate with mixed I/O voltages on the same device?
Yes, XA6SLX16-2FTG256I organizes I/Os into 12 independently powered banks, each supporting VCCO of 1.2 V, 1.8 V, 2.5 V, or 3.3 V. This allows simultaneous LVDS, SSTL-2, and HSTL interfaces on a single XA6SLX16-2FTG256I device without level-shifting circuitry.
Is there an internal oscillator in XA6SLX16-2FTG256I for configuration startup?
Yes, XA6SLX16-2FTG256I includes an internal RC oscillator (~50 MHz) used automatically during power-on reset to generate CCLK for Master Serial configuration when no external clock is present. This oscillator is radiation-tolerant and characterized across –55°C to +125°C for XA6SLX16-2FTG256I operation.
XA6SLX16-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX16-2FTG256I FAQ
1.How can I place an order for XA6SLX16-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX16-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX16-2FTG256I reliable?
The price and inventory of XA6SLX16-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-2FTG256I is usually 5 days.
3.What payment methods are accepted for XA6SLX16-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX16-2FTG256I?
XA6SLX16-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX16-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX16-2FTG256I?
For technical support, including XA6SLX16-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-2FTG256I requirements.
6.How does Aetrix verify that XA6SLX16-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XA6SLX16-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-2FTG256I meets industry standards.
7.What is the process for return or replacement of XA6SLX16-2FTG256I?
All XA6SLX16-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX16-2FTG256I part is unused and in its original packaging.
Return procedure for XA6SLX16-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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