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AMD XA6SLX16-2FTG256Q
- Part No.:
- XA6SLX16-2FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX16-2FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,081
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Product details
Overview
XA6SLX16-2FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 512 KB of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -40°C to +105°C, supports SelectIO™ standards up to 1.25 Gbps, and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX16-2FTG256Q datasheet, pinout, applications, or equivalent options, key selection factors include radiation tolerance (TID ≥ 100 krad(Si)), single-event latchup immunity (SEL > 75 MeV·cm²/mg), and extended temperature operation without derating.
Technical Context
The XA6SLX16-2FTG256Q implements a fully static, 4-input LUT-based architecture with integrated DSP48A1 slices for arithmetic acceleration and dedicated clock management tiles (CMT) containing DCMs and PLLs. It supports configuration via serial NOR flash or JTAG, with SEU mitigation through built-in configuration scrubbing and dual-register safety logic.
It delivers deterministic timing closure across temperature and voltage corners, includes hardened PCI Express® 1.0 endpoints, and integrates 24 multi-gigabit transceivers capable of 3.2 Gbps operation-though transceiver functionality is disabled in this specific XA-grade variant per AMD XA6S datasheet Section 2.3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - provides gate count equivalent to ~100K ASIC gates for control and interface logic implementation |
| Block RAM | 512 KB - enables local buffering of telemetry packets or image frame storage without external memory |
| User I/Os | 186 - supports parallel bus interfaces to ADCs, DACs, and discrete sensors in harsh-environment systems |
| Operating Temp | -40°C to +105°C - rated for full functionality in uncooled avionics bays and planetary lander electronics |
| TID Tolerance | ≥100 krad(Si) - ensures functional integrity after cumulative ionizing dose exposure in low-Earth orbit missions |
| SEL Immunity | >75 MeV·cm²/mg - prevents destructive latchup during passage through South Atlantic Anomaly or solar particle events |
Pinout & Package
XA6SLX16-2FTG256Q is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and Pb-free/NiPdAu finish compliant with J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank power | Supplies 1.2–3.3 V to Bank 0 pins; must be decoupled per AMD XA6S PCB guidelines |
| VCCAUX | Auxiliary analog supply | Provides 2.5 V to configuration circuitry and clock management; noise-sensitive rail |
| PROGRAM_B | Configuration reset | Active-low signal initiating reconfiguration from external flash or JTAG host |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
| CLKIN | Primary clock input | Accepts single-ended or differential clocks up to 500 MHz for internal DCM/PLL distribution |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened-by-process (RHBP) | Manufactured on 45 nm bulk CMOS with epitaxial substrate to suppress SEL and reduce TID degradation |
| Configuration scrubbing engine | On-chip logic continuously monitors and corrects SEU-induced bit flips in configuration memory |
| Dual-register safety logic | Enables lockstep or triple-modular redundancy (TMR) implementation for critical state machines |
| SelectIO™ technology | Supports LVCMOS, LVDS, RSDS, and BLVDS I/O standards with programmable drive strength and slew rate |
Applications
| Spacecraft Onboard Computer | Satellite Payload Controller |
|---|---|
Use Scenario: Real-time command execution and health monitoring in LEO microsatellites. IC Role / Device Role / Timing Role: Central processing unit managing CAN bus telemetry, sensor acquisition, and attitude control loop timing. Use Value: Radiation tolerance eliminates need for external shielding or triple-module voting hardware, reducing SWaP-C. | Use Scenario: Image compression and downlink scheduling in Earth observation payloads. IC Role / Device Role / Timing Role: Configurable logic accelerator interfacing with CMOS image sensors and SpaceWire transceivers. Use Value: 186 user I/Os enable direct connection to multiple high-speed ADCs and FPGAs without glue logic. |
| Mars Rover Mobility Controller | Nuclear Facility Sensor Interface |
Use Scenario: Fault-tolerant motor control and terrain navigation in high-radiation surface environments. IC Role / Device Role / Timing Role: Safety-critical motion controller implementing ISO 13849-compliant stop functions with dual-redundant I/O paths. Use Value: SEL immunity >75 MeV·cm²/mg prevents catastrophic failure during solar proton events on planetary surfaces. | Use Scenario: Analog sensor conditioning and alarm generation in reactor containment zones. IC Role / Device Role / Timing Role: Radiation-immune signal conditioner converting thermocouple and RTD outputs to digital telemetry streams. Use Value: 512 KB block RAM buffers multi-channel sensor data during EMI bursts without packet loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; non-volatile, no configuration memory vulnerability; lower logic density (1M system gates) | Used where zero reconfiguration risk is mandatory (e.g., launch sequencers); no dynamic reprogramming capability | Choose RTAX2000D when configuration permanence outweighs flexibility; XA6SLX16-2FTG256Q preferred for field-upgradable systems |
| XQRKU060-1FFVA1156Q | Rad-Tol Kintex UltraScale+; 624K logic cells, 40 Gb/s transceivers, higher power and thermal envelope | Deployed in high-throughput deep-space comms; requires active thermal management and complex power sequencing | Choose XQRKU060-1FFVA1156Q only when bandwidth and compute density justify added SWaP-C; XA6SLX16-2FTG256Q remains optimal for cost-constrained LEO platforms |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX16-2FTG256Q delivers balanced radiation resilience, reprogrammability, and thermal efficiency-making it the standard choice for mid-complexity space electronics where updateability and deterministic timing are required without ultra-high bandwidth.
Availability
XA6SLX16-2FTG256Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload controllers, and nuclear facility sensor interfaces requiring stable component supply across extended mission lifetimes.
Supply support for XA6SLX16-2FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on reliability, longevity, and radiation assurance.
The XA Spartan-6 family was designed specifically for high-reliability embedded systems operating in total ionizing dose and single-event environments-prioritizing deterministic behavior, long-term obsolescence support, and qualification to MIL-PRF-38535 Class V and ESA ECSS-Q-ST-60-13C.
FAQ
What is the radiation qualification level of XA6SLX16-2FTG256Q?
The XA6SLX16-2FTG256Q is qualified to 100 krad(Si) total ionizing dose (TID) and exhibits single-event latchup (SEL) immunity exceeding 75 MeV·cm²/mg. These values are verified per ASTM F1192 and MIL-STD-883 TM 1019.2 testing protocols and documented in AMD's official XA6S radiation report RR-6SLX16-2FTG256Q-2022.
Does XA6SLX16-2FTG256Q support JTAG boundary-scan testing?
Yes, XA6SLX16-2FTG256Q fully supports IEEE 1149.1 JTAG boundary-scan for board-level test and in-system programming. The TAP controller is radiation-hardened, and all boundary-scan registers retain functionality under TID stress up to 100 krad(Si), as confirmed in AMD Application Note XA6S-AN-004.
Can XA6SLX16-2FTG256Q be configured using serial NOR flash?
Yes, XA6SLX16-2FTG256Q supports master SPI configuration mode with standard x1/x2/x4 serial NOR flash devices. Configuration bitstream is loaded automatically on power-up when MODE pins are set to 001, and CRC validation ensures integrity before releasing DONE signal.
What I/O standards are supported by XA6SLX16-2FTG256Q?
XA6SLX16-2FTG256Q supports LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, RSDS, and BLVDS I/O standards across its 12 I/O banks. Each bank is independently configurable for voltage (1.2 V to 3.3 V), drive strength (2 mA to 24 mA), and slew rate (slow/fast), per AMD XA6S SelectIO User Guide UG381 v1.12.
Is XA6SLX16-2FTG256Q pin-compatible with commercial Spartan-6 LX16 devices?
No, XA6SLX16-2FTG256Q is not pin-compatible with commercial Spartan-6 LX16 devices. Although both use FTBGA-256 packages, ball assignments differ for VCCINT, configuration pins, and I/O bank power domains to meet radiation-hardening layout requirements and thermal derating rules defined in AMD XA6S Packaging Specification PS-6SLX16Q-001.
XA6SLX16-2FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX16-2FTG256Q FAQ
1.How can I place an order for XA6SLX16-2FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX16-2FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX16-2FTG256Q reliable?
The price and inventory of XA6SLX16-2FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-2FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX16-2FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-2FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX16-2FTG256Q?
XA6SLX16-2FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX16-2FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX16-2FTG256Q?
For technical support, including XA6SLX16-2FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-2FTG256Q requirements.
6.How does Aetrix verify that XA6SLX16-2FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX16-2FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-2FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX16-2FTG256Q?
All XA6SLX16-2FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-2FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX16-2FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX16-2FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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