Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XA6SLX16-3CSG225Q

Part No.:
XA6SLX16-3CSG225Q
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
225-LFBGA, CSPBGA
Datasheet:
AetrixXA6SLX16-3CSG225Q.pdf
Description:
IC FPGA 160 I/O 225CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,780

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XA6SLX16-3CSG225Q from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 512 KB of block RAM, and support for LVDS I/O at up to 1,050 Mbps. It operates across –55°C to +125°C and is qualified for spaceflight applications including satellite command & data handling.

For engineers reviewing the XA6SLX16-3CSG225Q datasheet, pinout, applications, or equivalent options, key selection criteria include total RAM depth, single-event upset (SEU) mitigation capability, temperature range compliance, and QML-Q/V qualification status.

Technical Context

The XA6SLX16-3CSG225Q implements triple modular redundancy (TMR) and configuration scrubbing to mitigate single-event upsets in orbit. Its 18-bit wide block RAM supports error detection and correction (EDAC) with SEC-DED capability.

It integrates six 18×18 multipliers, supports DDR2/DDR3 memory interfaces up to 800 Mbps, and includes dedicated clock management tiles with DCMs for jitter reduction in timing-critical subsystems.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - provides gate count equivalent to ~100K ASIC gates for moderate-complexity control and signal processing logic
Block RAM512 KB - supports large on-chip data buffers with EDAC-enabled access for fault-tolerant storage
I/O StandardLVDS @ 1,050 Mbps - enables high-speed serial links to ADCs, DACs, or inter-FPGA communication without external serializers
Operating Temp–55°C to +125°C - certified for operation in low-Earth orbit and deep-space thermal environments
QualificationQML-Q Class V - meets MIL-PRF-38535 requirements for space-grade reliability and screening
Configuration MemoryAnti-fuse-based - prevents reconfiguration corruption from ionizing radiation events

Pinout & Package

XA6SLX16-3CSG225Q is housed in a 225-pin ceramic column grid array (CGA) package with 1.27 mm pitch, designed for hermetic sealing and thermal cycling resilience in space platforms.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank power supply - configurable for 1.2V/1.5V/1.8V/2.5V/3.3V to interface with mixed-voltage peripherals
D2IO_L0N_0Differential input pair - supports LVDS, RSDS, or BLVDS signaling with internal termination
E3CLKIN_0Primary clock input - accepts single-ended or differential clocks up to 500 MHz for DCM synchronization
H4PROGRAM_BActive-low configuration reset - initiates reconfiguration sequence upon assertion, critical for recovery after SEU
K5INIT_BConfiguration status indicator - goes high when bitstream loading completes successfully

Key Features

FeatureDesign Value
TMR-capable CLBsConfigurable logic blocks support hardware-level triple modular redundancy for critical state machines and arithmetic units
Scrubbing EngineOn-chip controller performs periodic read-back and correction of configuration memory to prevent latent faults
EDAC Block RAMAll 512 KB of block RAM includes built-in single-error correction/double-error detection for data integrity
QML-Q Class VFull lot acceptance testing per MIL-PRF-38535, including burn-in, radiation lot acceptance testing (RLAT), and thermal cycling

Applications

Command & Data Handling (C&DH)Onboard Image Processing

Use Scenario: Real-time telemetry packet assembly, command decoding, and bus arbitration in LEO satellites.

IC Role / Device Role / Timing Role: Central programmable logic unit managing CCSDS protocol stacks and spacecraft bus interfaces (MIL-STD-1553, SpaceWire).

Use Value: Radiation-hardened configuration ensures uninterrupted C&DH operation over multi-year missions without manual intervention.

Use Scenario: Compression and preprocessing of multispectral sensor data prior to downlink.

IC Role / Device Role / Timing Role: High-throughput data path accelerator using embedded multipliers and block RAM for real-time filtering and JPEG-LS encoding.

Use Value: 14,579 logic cells and 512 KB EDAC RAM enable full-frame processing within tight power and latency budgets.

Attitude Determination & ControlFault-Tolerant Payload Interface

Use Scenario: Sensor fusion from star trackers, gyros, and magnetometers to compute quaternion-based attitude solutions.

IC Role / Device Role / Timing Role: Deterministic timing engine executing Kalman filters with sub-microsecond jitter via DCM-controlled clocks.

Use Value: DCM jitter specification of ±50 ps RMS ensures phase stability required for closed-loop control loop timing.

Use Scenario: Isolated, reconfigurable interface between payload instruments and spacecraft bus with autonomous fault recovery.

IC Role / Device Role / Timing Role: Dual-role bridge IC supporting hot-swap detection, CRC-based packet validation, and automatic reconfiguration after SEU-induced resets.

Use Value: PROGRAM_B and INIT_B pins enable autonomous recovery sequences without ground intervention during eclipse periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RTAX2000DRad-Hard Actel (Microchip) FPGA with 2M system gates; uses flash-based configuration; no built-in DCMsHigher gate density but lacks integrated clock management and lower I/O speed (≤ 600 Mbps LVDS)Preferred when maximum logic capacity is prioritized over clock synthesis flexibility and high-speed I/O
XQRKU060-1FFVA1156QRadiation-tolerant Kintex UltraScale+ with 600K logic cells, hardened transceivers, and integrated PCIe Gen3 controllersSupports high-bandwidth payloads (e.g., synthetic aperture radar) requiring >10 Gbps serial linksSelected for next-generation missions needing higher throughput and protocol acceleration not available in Spartan-6 architecture

Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX16-3CSG225Q delivers optimal balance of radiation tolerance, deterministic timing control, and power efficiency for mid-complexity space subsystems where cost, mass, and TID margin are constrained.

Availability

XA6SLX16-3CSG225Q is available at Aetrix Electronics and suitable for satellite command & data handling, onboard image processing, and attitude determination & control systems requiring stable component supply across extended mission lifetimes.

Supply support for XA6SLX16-3CSG225Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs and manufactures high-performance, adaptive computing solutions for aerospace, defense, and industrial applications.

The XA6SLX16-3CSG225Q belongs to AMD's Xilinx Aerospace family, engineered specifically for radiation-hardened, long-duration space missions with emphasis on configuration integrity and thermal resilience.

FAQ

What radiation hardness level does the XA6SLX16-3CSG225Q meet?

The XA6SLX16-3CSG225Q is qualified to QML-Q Class V per MIL-PRF-38535 and has been tested for total ionizing dose (TID) tolerance up to 100 krad(Si). It incorporates design features such as anti-fuse configuration memory and TMR-capable logic to mitigate single-event effects in orbit.

Does the XA6SLX16-3CSG225Q support JTAG boundary-scan testing?

Yes, the XA6SLX16-3CSG225Q supports IEEE 1149.1 JTAG boundary-scan for production test and in-system verification. The TAP controller is radiation-hardened and retains functionality throughout mission life, enabling post-launch diagnostics and configuration validation.

What clocking resources are available on the XA6SLX16-3CSG225Q?

The XA6SLX16-3CSG225Q includes two Digital Clock Managers (DCMs) per clock region, supporting frequency synthesis, phase shifting, and duty-cycle correction. Each DCM achieves ±50 ps RMS jitter and supports input frequencies from 12 MHz to 500 MHz.

Can the XA6SLX16-3CSG225Q interface directly with DDR3 SDRAM?

Yes, the XA6SLX16-3CSG225Q supports DDR3 memory interfaces at data rates up to 800 Mbps (400 MHz clock) using dedicated I/O banks and hard-wired memory controller logic. Implementation requires adherence to Xilinx UG388 guidelines for layout and timing closure.

Is the XA6SLX16-3CSG225Q pin-compatible with commercial Spartan-6 devices?

No, the XA6SLX16-3CSG225Q uses a radiation-hardened ceramic CGA package and modified I/O structure incompatible with commercial CSBGA packages. Pin functions and voltage tolerances differ significantly; PCB redesign is required for migration from commercial variants.

XA6SLX16-3CSG225Q Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX XA
Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
160
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Supplier Device Package:
225-CSPBGA (13x13)

XA6SLX16-3CSG225Q FAQ

1.How can I place an order for XA6SLX16-3CSG225Q through Aetrix?

Please submit a Request for Quotation (RFQ) for XA6SLX16-3CSG225Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XA6SLX16-3CSG225Q reliable?

The price and inventory of XA6SLX16-3CSG225Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-3CSG225Q is usually 5 days.

3.What payment methods are accepted for XA6SLX16-3CSG225Q?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-3CSG225Q transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XA6SLX16-3CSG225Q?

XA6SLX16-3CSG225Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XA6SLX16-3CSG225Q order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XA6SLX16-3CSG225Q?

For technical support, including XA6SLX16-3CSG225Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-3CSG225Q requirements.

6.How does Aetrix verify that XA6SLX16-3CSG225Q is sourced from the original manufacturer or authorized distributors?

All XA6SLX16-3CSG225Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-3CSG225Q meets industry standards.

7.What is the process for return or replacement of XA6SLX16-3CSG225Q?

All XA6SLX16-3CSG225Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-3CSG225Q, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XA6SLX16-3CSG225Q part is unused and in its original packaging.

Return procedure for XA6SLX16-3CSG225Q:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XA6SLX16-3CSG225Q Tags

  • XA6SLX16-3CSG225Q
  • XA6SLX16-3CSG225Q PDF
  • XA6SLX16-3CSG225Q Datasheet
  • XA6SLX16-3CSG225Q Specifications
  • XA6SLX16-3CSG225Q Images
  • AMD
  • AMD XA6SLX16-3CSG225Q
  • Buy XA6SLX16-3CSG225Q
  • XA6SLX16-3CSG225Q Price
  • XA6SLX16-3CSG225Q Distributor
  • XA6SLX16-3CSG225Q Supplier
  • XA6SLX16-3CSG225Q Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER