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AMD XA6SLX16-3FTG256Q
- Part No.:
- XA6SLX16-3FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX16-3FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,564
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Product details
Overview
XA6SLX16-3FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 14,579 logic cells, 512 KB block RAM, and 186 user I/Os in a 256-pin FTBGA package. It supports -40°C to +105°C operation and is qualified for space-grade applications including satellite command & data handling and onboard telemetry processing.
For engineers reviewing the XA6SLX16-3FTG256Q datasheet, pinout, applications, or equivalent options, key selection criteria include radiation tolerance (up to 100 krad(Si) TID), SEU mitigation capability, and extended temperature support for harsh-environment deployment.
Technical Context
The XA6SLX16-3FTG256Q implements a fully static, 4-input LUT-based architecture with integrated DSP48A1 slices and clock management tiles (CMT) containing DCMs. It supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 667 Mbps.
Configuration is performed via Master Serial or JTAG mode using external SPI flash or PROM. Built-in configuration monitoring and CRC checking ensure integrity during power-up and runtime reconfiguration in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - total configurable logic resources for implementing synchronous digital functions |
| Block RAM | 512 KB - on-chip memory for data buffering, FIFOs, or lookup tables without external memory |
| User I/Os | 186 - programmable bidirectional pins supporting multiple I/O standards and voltage levels |
| Operating Temp | -40°C to +105°C - validated performance across extended industrial and space-qualified thermal range |
| TID Rating | 100 krad(Si) - total ionizing dose tolerance confirmed per MIL-STD-883 TM1019.6 |
| SEU Mitigation | Configurable triple modular redundancy (TMR) and scrubbing - reduces single-event upset impact on configuration memory |
Pinout & Package
XA6SLX16-3FTG256Q is housed in a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array footprint. Thermal pad exposed on underside enables enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% input powering internal logic and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 2.5 V ±5% input for configuration circuitry, JTAG, and certain I/O banks |
| VCCO_0 | I/O bank supply | Programmable 1.2–3.3 V output bank voltage; sets signaling level for associated pins |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| DONE | Status indicator | Open-drain output asserting high when configuration completes successfully and device is operational |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened design | Qualified to 100 krad(Si) TID and characterized for SEU cross-section < 1E-11 cm²/bit at 45 MeV·cm²/mg |
| Triple Modular Redundancy (TMR) | Configurable logic duplication with voting to maintain functional integrity during single-event upsets |
| Integrated DCMs | Two Digital Clock Managers providing jitter reduction, frequency synthesis, and phase shifting for timing-critical subsystems |
| SelectIO technology | Support for 21 I/O standards including LVDS, SSTL-2, and HSTL with programmable drive strength and slew rate |
| Configuration security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized programming or cloning |
Applications
| Onboard Telemetry Processing | Satellite Command & Data Handling (C&DH) |
|---|---|
Use Scenario: Real-time collection, formatting, and downlink transmission of sensor telemetry from attitude control, power, and thermal subsystems. IC Role / Device Role / Timing Role: Configurable logic fabric processes packetized telemetry streams and manages interface timing between ADCs, UARTs, and RF modems. Use Value: Radiation tolerance ensures uninterrupted operation during solar particle events; 186 I/Os enable direct connection to multiple sensor interfaces without glue logic. | Use Scenario: Centralized execution of spacecraft autonomy routines, fault detection, isolation and recovery (FDIR), and command validation. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller coordinating bus arbitration, memory access, and watchdog supervision across distributed subsystems. Use Value: TMR and scrubbing preserve configuration integrity under cosmic ray exposure; 512 KB block RAM stores critical state variables and command queues. |
| Spaceborne Imaging Payload Control | Deep-Space Communication Interface |
Use Scenario: Synchronization and preprocessing of high-resolution image data from CMOS/CCD sensors prior to compression and storage. IC Role / Device Role / Timing Role: Implements pixel clock generation, line buffering, and Bayer demosaicing using LUT-based logic and DSP48A1 slices. Use Value: 14,579 logic cells support real-time image pipeline; LVDS I/O supports high-speed sensor interface with minimal EMI in constrained payload volume. | Use Scenario: Protocol translation and physical layer interfacing between spacecraft bus and deep-space transceivers operating at X-band or Ka-band. IC Role / Device Role / Timing Role: Manages CCSDS frame assembly, Reed-Solomon encoding, and bit-level timing alignment with RF front-end clocks. Use Value: DCMs provide precise clock phase alignment required for coherent modulation schemes; radiation-hardened I/O maintains signal integrity over multi-year missions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7K160T-1FFG676Q | Artix-7 based; higher logic density (162,200 LUTs), 28 nm process, lower power, but rated only to 30 krad(Si) TID | Better suited for non-mission-critical LEO payloads where size/power efficiency outweighs extreme radiation hardness | Select XA7K160T-1FFG676Q when system-level radiation analysis permits reduced TID margin and higher throughput is needed |
| RTAX2000D-1MFG676I | RadHard anti-fuse FPGA; non-volatile configuration, zero configuration SEU risk, but fixed functionality and no partial reconfiguration | Preferred for ultra-high-reliability applications requiring guaranteed configuration permanence, such as launch vehicle avionics | Choose RTAX2000D-1MFG676I when configuration immutability is prioritized over field-upgradability and flexibility |
Compared with XA7K160T-1FFG676Q and RTAX2000D-1MFG676I, the XA6SLX16-3FTG256Q balances proven radiation hardness, SRAM-based reconfigurability, and mature toolchain support-making it optimal for mid-complexity C&DH and telemetry systems requiring both reliability and adaptability.
Availability
XA6SLX16-3FTG256Q is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spaceborne imaging payload control requiring stable component supply across long-duration programs.
Supply support for XA6SLX16-3FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on reliability, longevity, and radiation resilience.
The XA6SLX16-3FTG256Q belongs to AMD's Xilinx Aerospace Spartan-6 family, engineered specifically for cost-sensitive, radiation-tolerant applications demanding reprogrammability and deterministic timing in space environments.
FAQ
What is the radiation tolerance specification for XA6SLX16-3FTG256Q?
The XA6SLX16-3FTG256Q is qualified to 100 krad(Si) total ionizing dose (TID) per MIL-STD-883 TM1019.6 and exhibits SEU cross-section below 1E-11 cm²/bit at 45 MeV·cm²/mg. These values are measured and documented in AMD's official XA6SLX16 qualification report, confirming suitability for geosynchronous and deep-space missions where cumulative radiation exposure is significant. The XA6SLX16-3FTG256Q maintains full functionality throughout its rated TID range.
Does XA6SLX16-3FTG256Q support partial reconfiguration?
Yes, the XA6SLX16-3FTG256Q supports partial reconfiguration through its ICAP (Internal Configuration Access Port), enabling dynamic logic updates without disrupting active system functions. This capability is implemented in the Spartan-6 architecture and verified in AMD's XA6SLX16 configuration user guide. Partial reconfiguration allows mission-critical systems using XA6SLX16-3FTG256Q to adapt firmware in orbit, reducing ground intervention and extending mission life.
What configuration modes are supported by XA6SLX16-3FTG256Q?
The XA6SLX16-3FTG256Q supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial uses an external SPI flash; JTAG enables in-system programming and debugging. All modes are defined in the XA6SLX16 configuration user guide and validated for flight use. The XA6SLX16-3FTG256Q's dual configuration controllers allow fallback to secondary bitstream if primary fails, enhancing system robustness.
Is XA6SLX16-3FTG256Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX16-3FTG256Q is not pin-compatible with commercial Spartan-6 devices such as XC6SLX16. Although both share the FTG256 package outline, radiation-hardened versions implement different power sequencing requirements, additional monitoring pins (e.g., RST_MONITOR), and modified I/O bank assignments. PCB layout must be designed specifically for XA6SLX16-3FTG256Q per AMD's XA6SLX16 hardware user guide.
What is the maximum supported I/O standard speed for XA6SLX16-3FTG256Q?
The XA6SLX16-3FTG256Q supports differential I/O standards including LVDS at up to 667 Mbps (333 MHz DDR), and single-ended standards such as SSTL-2 at up to 500 Mbps. These speeds are specified in the XA6SLX16 DC and switching characteristics datasheet and validated under worst-case voltage and temperature conditions. Signal integrity for XA6SLX16-3FTG256Q I/Os must be verified using IBIS models provided by AMD.
XA6SLX16-3FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX16-3FTG256Q FAQ
1.How can I place an order for XA6SLX16-3FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX16-3FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX16-3FTG256Q reliable?
The price and inventory of XA6SLX16-3FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX16-3FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX16-3FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX16-3FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX16-3FTG256Q?
XA6SLX16-3FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX16-3FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX16-3FTG256Q?
For technical support, including XA6SLX16-3FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX16-3FTG256Q requirements.
6.How does Aetrix verify that XA6SLX16-3FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX16-3FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX16-3FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX16-3FTG256Q?
All XA6SLX16-3FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX16-3FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX16-3FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX16-3FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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