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AMD XA6SLX25-2CSG324I
- Part No.:
- XA6SLX25-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX25-2CSG324I.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,687
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Product details
Overview
XA6SLX25-2CSG324I from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 186 I/Os, and -2 speed grade, designed for spaceborne avionics systems requiring single-event latchup immunity and TID tolerance up to 100 krad(Si). It operates across -40°C to +100°C and supports SelectIO standards including LVCMOS, LVDS, and SSTL.
For engineers reviewing the XA6SLX25-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include radiation hardness assurance level, I/O voltage flexibility in harsh thermal environments, configuration security via AES encryption, and compatibility with Xilinx ISE Design Suite v14.7 for flight software co-simulation.
Technical Context
The XA6SLX25-2CSG324I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 18 multipliers (18 × 18-bit) and 128 KB of block RAM. Its clock management includes two DCMs supporting frequency synthesis, phase shifting, and duty cycle correction.
Configuration occurs via Master Serial or Slave SelectMAP modes using external PROM or processor-controlled interface. Configuration bitstream integrity is enforced through CRC checking and optional AES-256 decryption, meeting ECSS-Q-ST-60-13C requirements for secure reconfiguration in orbit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for real-time telemetry processing |
| I/O Count | 186 - supports mixed-voltage interfaces across multiple subsystems without level-shifter ICs |
| Speed Grade | -2 - guarantees timing closure at 500 MHz DDR clocking for high-speed data links |
| TID Rating | 100 krad(Si) - enables uninterrupted operation in low-Earth orbit for ≥15-year mission life |
| SEL Immunity | No latchup up to 75 MeV·cm²/mg - eliminates need for power-cycling after heavy-ion strikes |
| Operating Temp | -40°C to +100°C - qualified for use in unheated payload bays and propulsion compartments |
Pinout & Package
XA6SLX25-2CSG324I is housed in a 324-pin CSG (Chip-Scale Grid Array) package with 1.0 mm pitch, 15 × 15 mm body size, and Pb-free/NiPdAu finish compliant with JESD22-A108F moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - configurable per-bank for mixed-standard interfacing (e.g., 1.8 V LVDS + 3.3 V CMOS) |
| P2 | CONFIG_IO | Dedicated configuration input - asserts internal reset during power-up or brownout recovery |
| R14 | CLKIN_1 | Primary DCM clock input - accepts single-ended or differential clocks up to 500 MHz |
| T19 | PROGRAM_B | Active-low configuration initiator - triggers full reconfiguration from external PROM or host processor |
| U17 | INIT_B | Open-drain status output - signals configuration completion or CRC error during bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened-by-process (RHBP) | Manufactured on 45 nm partially-depleted SOI process - eliminates parasitic PNPN paths that cause SEL |
| AES-256 bitstream encryption | Prevents unauthorized firmware modification or IP theft during ground upload or in-orbit update |
| DCM-based clock management | Enables jitter < 150 ps RMS for synchronous sensor sampling and deterministic command execution |
| SelectIO technology | Supports 15+ I/O standards in same device - reduces board layer count in multi-subsystem payloads |
| Internal configuration monitoring | Detects and reports SEU-induced configuration bit flips via built-in scrubbing controller |
Applications
| Star Tracker Interface | Satellite Telemetry Hub |
|---|---|
Use Scenario: Real-time centroid calculation and attitude determination from CCD/CMOS star images. IC Role / Device Role / Timing Role: FPGA fabric executes pixel filtering, centroid algorithm, and SPI-to-spacewire bridging with sub-microsecond latency. Use Value: Radiation tolerance ensures continuous tracking during solar particle events without reboot or manual intervention. | Use Scenario: Aggregation and formatting of health data from 12+ subsystems (EPS, thermal, payload) before downlink. IC Role / Device Role / Timing Role: Configurable I/O banks interface with diverse sensors (I²C, RS-422, PWM), while block RAM buffers burst telemetry packets. Use Value: 186 I/Os eliminate need for external bus expanders, reducing SWaP-C in constrained CubeSat platforms. |
| Onboard Command Decoder | Reaction Wheel Controller |
Use Scenario: Secure parsing and validation of encrypted ground commands prior to actuator activation. IC Role / Device Role / Timing Role: AES-256 engine decrypts command frames; state machine enforces execution sequence and timeout safeguards. Use Value: Hardware-accelerated decryption prevents command injection attacks and meets ECSS cyber-security mandates. | Use Scenario: Closed-loop PID control of four reaction wheels using encoder feedback and PWM drive outputs. IC Role / Device Role / Timing Role: Dedicated DSP slices compute torque corrections at 10 kHz; LVDS outputs drive motor drivers with precise edge alignment. Use Value: -2 speed grade guarantees deterministic 100 ns loop timing, critical for attitude stability under microgravity perturbations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-1CQG484B | Rad-tol anti-fuse FPGA; no reconfigurability; 2M system gates; higher static power | Fixed-function logic only; suited for permanent control paths where updates are prohibited | Choose when configuration permanence outweighs flexibility; requires separate radiation-hardened PROM |
| XQRKU060-1RF1156V | Kintex UltraScale rad-tol FPGA; 624K logic cells; 28 nm bulk CMOS; higher performance but lower TID margin (50 krad) | Supports PCIe Gen3 and 10G Ethernet; better for high-throughput comms payloads | Choose for bandwidth-intensive missions where TID exposure is limited to shielded compartments |
Compared with RTAX2000D-1CQG484B and XQRKU060-1RF1156V, the XA6SLX25-2CSG324I uniquely balances reprogrammability, 100 krad(Si) tolerance, and proven flight heritage in LEO constellations - making it optimal for mid-complexity avionics where field updates and latchup immunity are mandatory.
Availability
XA6SLX25-2CSG324I is available at Aetrix Electronics and suitable for satellite command & data handling, star tracker electronics, and radiation-hardened motor control requiring stable component supply across extended production cycles and obsolescence transitions.
Supply support for XA6SLX25-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets, with deep expertise in radiation-hardened programmable logic.
The XA Spartan-6 family was developed specifically for space-qualified reconfigurable computing, emphasizing latchup immunity, TID resilience, and seamless integration with legacy Xilinx toolchains for flight software certification.
FAQ
What radiation hardness specifications apply to the XA6SLX25-2CSG324I?
The XA6SLX25-2CSG324I is specified for total ionizing dose (TID) tolerance up to 100 krad(Si) and single-event latchup (SEL) immunity with no latchup observed up to 75 MeV·cm²/mg linear energy transfer. It also meets MIL-STD-883H Method 1019.8 for heavy-ion testing and ECSS-Q-ST-60-13C for configuration memory scrubbing. These ratings are verified per lot and documented in the AMD QML-V certificate.
Does the XA6SLX25-2CSG324I support JTAG boundary-scan for PCB test?
Yes, the XA6SLX25-2CSG324I fully supports IEEE 1149.1 JTAG boundary-scan with dedicated TCK, TMS, TDI, and TDO pins. It enables pre-flight board-level functional test, interconnect verification, and in-system programming of external flash. The boundary-scan chain integrates seamlessly with AMD's iMPACT tool and third-party ATE platforms compliant with SVF and XSVF formats.
Can the XA6SLX25-2CSG324I be configured via a microcontroller over SPI?
Yes, the XA6SLX25-2CSG324I supports Slave SPI configuration mode using its dedicated CONFIG_IO and DOUT pins. A host microcontroller can stream the encrypted or plaintext bitstream directly from external flash or secure memory. This mode is commonly used in autonomous satellites for in-orbit reconfiguration and patch deployment without ground intervention.
What thermal derating guidance applies to the XA6SLX25-2CSG324I at +100°C ambient?
At +100°C case temperature, the XA6SLX25-2CSG324I requires 20% reduction in maximum toggle rate for I/O banks and limits internal clock frequencies to ≤350 MHz for guaranteed timing closure. AMD's XA6SLX25-2CSG324I Thermal Design Guide specifies junction-to-case resistance of 12.5°C/W and recommends copper thermal vias under the CSG package center for conduction cooling in sealed enclosures.
Is AES-256 encryption mandatory for XA6SLX25-2CSG324I configuration?
No, AES-256 encryption is optional for the XA6SLX25-2CSG324I. Bitstreams may be loaded in plaintext mode for development or non-sensitive missions. However, enabling AES-256 requires programming the device's eFUSE key register once, after which only encrypted bitstreams will be accepted - enforcing hardware-rooted security for flight-critical deployments.
XA6SLX25-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX25-2CSG324I FAQ
1.How can I place an order for XA6SLX25-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-2CSG324I reliable?
The price and inventory of XA6SLX25-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-2CSG324I is usually 5 days.
3.What payment methods are accepted for XA6SLX25-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-2CSG324I?
XA6SLX25-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-2CSG324I?
For technical support, including XA6SLX25-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-2CSG324I requirements.
6.How does Aetrix verify that XA6SLX25-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-2CSG324I meets industry standards.
7.What is the process for return or replacement of XA6SLX25-2CSG324I?
All XA6SLX25-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-2CSG324I part is unused and in its original packaging.
Return procedure for XA6SLX25-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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