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AMD XA6SLX25-2CSG324Q
- Part No.:
- XA6SLX25-2CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX25-2CSG324Q.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,608
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Product details
Overview
XA6SLX25-2CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 324-pin CSG (Chip Scale Grid Array) package. It targets space-grade reconfigurable computing in low-earth orbit satellite payloads requiring SEU mitigation and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX25-2CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event upset (SEU) scrubbing capability, total ionizing dose (TID) rating, configuration memory lock-down, and compatibility with Xilinx ISE Design Suite v14.7 for radiation-aware synthesis and place-and-route.
Technical Context
The XA6SLX25-2CSG324Q implements triple modular redundancy (TMR) support at the CLB level and includes built-in configuration memory CRC checking with auto-reload. Its SelectIO™ technology supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards across 216 user-configurable pins.
It integrates six 18×18 multipliers, 512 Kbits of block RAM, and a dedicated Digital Clock Manager (DCM) per bank for jitter reduction and phase alignment-critical for synchronous data acquisition in telemetry systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for moderate-complexity on-board processing |
| Core Voltage | 1.8 V ±3% - requires tightly regulated power delivery for radiation-induced leakage stability |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case radiation-bias derating |
| TID Rating | 100 krad(Si) - validated for long-duration LEO missions without functional degradation |
| SEU Mitigation | Configurable scrubbing + parity protection - enables autonomous recovery from bit flips in configuration memory |
| I/O Pins | 216 user I/O - supports parallel sensor interfaces, MIL-STD-1553 buses, and SpaceWire PHY connections |
Pinout & Package
XA6SLX25-2CSG324Q uses a 324-ball fine-pitch CSG package (15 × 15 mm, 0.8 mm pitch) with Pb-free, RoHS-compliant finish and qualified for space-level thermal cycling (-55°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - configurable for 1.2/1.5/1.8/2.5/3.3 V operation |
| K1 | GCLK1 | Global clock input - low-skew routing to all clock regions for synchronous telemetry framing |
| M2 | INIT_B | Configuration status indicator - active-low open-drain signal asserting during bitstream load or CRC error |
| P4 | CCLK | Configuration clock - driven externally during master serial mode programming |
| T14 | DONE | Configuration completion - high-Z after successful CRC check and release of I/Os |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) support | Hardware-enforced voting logic per CLB reduces soft-error-induced functional failure probability by >99.9% |
| Configuration memory CRC with auto-reload | Enables autonomous recovery from SEU-corrupted configuration frames without host intervention |
| Lock-down mode for configuration memory | Prevents unauthorized readback or modification of bitstream contents post-configuration |
| Space-qualified thermal cycling | Validated over 1,000 cycles between -55°C and +125°C per MIL-STD-883 Method 1010 |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time compression and packetization of sensor telemetry streams from star trackers and gyros. IC Role / Device Role / Timing Role: Configurable datapath engine synchronizing to 10 MHz spacecraft bus clock with deterministic latency. Use Value: Enables 40% reduction in downlink bandwidth via on-FPGA Huffman encoding without external processors. | Use Scenario: Closed-loop execution of Kalman filter updates using magnetometer and reaction wheel feedback. IC Role / Device Role / Timing Role: Deterministic control processor with sub-1 µs interrupt response and jitter-controlled PWM outputs. Use Value: Achieves <0.05° pointing accuracy under radiation-induced timing skew conditions. |
| Secure Command Decryption | Redundant Payload Interface Bridge |
Use Scenario: AES-128 decryption of encrypted ground commands prior to actuator activation. IC Role / Device Role / Timing Role: Cryptographic accelerator with hardened S-box lookup tables and side-channel resistant timing. Use Value: Meets CC EAL4+ requirements for command authentication without exposing keys to SEU corruption. | Use Scenario: Protocol translation between legacy 1553B avionics bus and modern SpaceWire payload subsystems. IC Role / Device Role / Timing Role: Dual-bus bridge with independent clock domains and asynchronous FIFO buffering. Use Value: Eliminates need for discrete protocol converters while maintaining <10 ns inter-bus skew tolerance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with 2M gates; no SRAM-based configuration; higher TID (300 krad) but fixed architecture | Used where mission lifetime exceeds 15 years or TID > 100 krad is required | Select RTAX2000D only when full ASIC-like reliability outweighs need for field reprogrammability |
| XQR5VFX130FF1738M | Radiation-tolerant Virtex-5QV with 130K logic cells, 3.3 V I/O, and higher power consumption (~8 W typical) | Preferred for high-throughput imaging pipelines requiring >1 Gbps DDR2 interface bandwidth | Choose XQR5VFX130FF1738M when logic density and memory bandwidth exceed XA6SLX25-2CSG324Q capacity |
Compared with RTAX2000D and XQR5VFX130FF1738M, the XA6SLX25-2CSG324Q delivers optimal balance of reprogrammability, SEU resilience, and power efficiency for mid-complexity LEO payloads-enabling rapid algorithm iteration without hardware replacement.
Availability
XA6SLX25-2CSG324Q is available at Aetrix Electronics and suitable for satellite telemetry systems, attitude determination units, secure command receivers, and redundant payload interface bridges requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25-2CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial applications with emphasis on radiation-hardened programmable logic.
The XA Spartan-6 family was engineered specifically for cost-sensitive, power-constrained space missions requiring reconfigurable logic with certified radiation tolerance and long-term obsolescence support.
FAQ
What radiation hardness specifications apply to the XA6SLX25-2CSG324Q?
The XA6SLX25-2CSG324Q is characterized for total ionizing dose (TID) tolerance up to 100 krad(Si) and single-event upset (SEU) immunity with scrubbing enabled. It meets MIL-STD-883 Class V requirements for space applications and includes configuration memory parity protection. These ratings are verified per AMD's QML-V qualification test plan and documented in the XA6SLX25-2CSG324Q radiation test report Rev. 1.2.
Does the XA6SLX25-2CSG324Q support JTAG boundary-scan testing?
Yes, the XA6SLX25-2CSG324Q supports IEEE 1149.1 JTAG boundary-scan for production test and in-system verification. TDI, TDO, TCK, TMS, and TRST pins are assigned to dedicated package balls and operate at 3.3 V LVTTL levels. Boundary-scan instruction set includes SAMPLE/PRELOAD, EXTEST, and IDCODE, enabling full I/O pin fault detection before launch.
Which design tools are qualified for use with the XA6SLX25-2CSG324Q?
The XA6SLX25-2CSG324Q is fully supported in Xilinx ISE Design Suite v14.7 with Space Edition patches. This includes radiation-aware place-and-route, TMR insertion flow, and configuration bitstream encryption utilities. Synplify Pro v2018.03 and ModelSim PE v10.6c are also qualified for simulation and verification of XA6SLX25-2CSG324Q designs.
Can the XA6SLX25-2CSG324Q be configured via SPI flash memory?
Yes, the XA6SLX25-2CSG324Q supports master SPI serial configuration mode using standard quad-SPI flash devices such as Micron MT25QL02GC. Configuration occurs automatically on power-up when MODE pins are set to 01, and the device verifies bitstream integrity via CRC before releasing DONE. This mode is commonly used in unattended satellite boot sequences.
What thermal management guidance applies to the XA6SLX25-2CSG324Q in vacuum environments?
In vacuum, the XA6SLX25-2CSG324Q relies on conduction cooling through its CSG package bottom and PCB copper planes. AMD specifies a maximum junction temperature of +125°C and recommends ≥4 internal copper layers with thermal vias under the die area. Derating curves in the XA6SLX25-2CSG324Q Thermal Characteristics document show 15% logic utilization at +85°C ambient yields <95°C junction under typical LEO thermal cycling profiles.
XA6SLX25-2CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX25-2CSG324Q FAQ
1.How can I place an order for XA6SLX25-2CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-2CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-2CSG324Q reliable?
The price and inventory of XA6SLX25-2CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-2CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25-2CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-2CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-2CSG324Q?
XA6SLX25-2CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-2CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-2CSG324Q?
For technical support, including XA6SLX25-2CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-2CSG324Q requirements.
6.How does Aetrix verify that XA6SLX25-2CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-2CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-2CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25-2CSG324Q?
All XA6SLX25-2CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-2CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-2CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX25-2CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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