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AMD XA6SLX25-2FGG484Q
- Part No.:
- XA6SLX25-2FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX25-2FGG484Q.pdf
- Description:
- IC FPGA 266 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,185
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Product details
Overview
XA6SLX25-2FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1,728 Kbits of block RAM, and support for LVDS I/O at up to 1,050 Mbps. It operates across -40°C to +105°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX25-2FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event latch-up (SEL) immunity > 75 MeV·cm²/mg, TID tolerance of 100 krad(Si), and QML-Q/V qualification per MIL-PRF-38535.
Technical Context
The XA6SLX25-2FGG484Q implements a 45 nm bulk CMOS process with triple-well isolation and hardened configuration memory. It integrates six 18×18 multipliers, digital clock managers (DCMs), and phase-locked loops (PLLs) supporting jitter < 150 ps RMS over 12 kHz–20 MHz.
Configuration occurs via Master Serial or Slave SelectMAP modes using external PROM or processor interface. Configuration bitstream integrity is enforced by CRC checking and dual-module redundancy for critical control registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for moderate-complexity spaceborne logic |
| Block RAM | 1,728 Kbits - supports dual-port buffering for telemetry packet assembly and decommutation |
| I/O Standards | LVDS, LVTTL, SSTL - enables direct interfacing with ADCs, DACs, and space-qualified transceivers |
| TID Rating | 100 krad(Si) - ensures functional operation after cumulative ionizing dose in low-Earth orbit missions |
| SEL Immunity | >75 MeV·cm²/mg - prevents destructive latch-up during proton and heavy-ion exposure in deep space |
| Operating Temp | -40°C to +105°C - validated for use in unheated payload bays and thermally constrained avionics enclosures |
Pinout & Package
XA6SLX25-2FGG484Q is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and Pb-free NiPdAu surface finish compliant with J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Synchronizes serial bitstream loading from external PROM; requires 50 Ω series termination |
| DIN | Configuration Data Input | Accepts master-serial configuration stream; driven by PROM or microcontroller GPIO |
| PROG_B | Program Initiate | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status Output | Open-drain indicator asserting low during configuration, high upon successful CRC check |
| GND / VCCO / VCCAUX | Power & Ground | Separate analog/digital power domains enable noise isolation for mixed-signal payloads |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | Prevents bit-flip-induced functional interrupts without requiring external scrubbing logic |
| Dual-module register redundancy | Enables automatic recovery from single-event upsets in critical control paths |
| QML-Q/V Class V qualification | Meets MIL-PRF-38535 requirements for screening, testing, and lot traceability in flight hardware |
| LVDS I/O with internal termination | Reduces PCB routing complexity and eliminates discrete termination resistors for high-speed sensor links |
| DCM/PLL jitter performance | Supports stable clock synthesis for synchronous telemetry framing at 10–40 Mbps rates |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Logic |
|---|---|
Use Scenario: Real-time parsing, validation, and formatting of sensor telemetry streams from IMUs and star trackers. IC Role / Device Role / Timing Role: Configurable logic fabric executing HDL-based state machines and packetizers; DCMs generate precise 10 MHz and 40 MHz clocks. Use Value: Eliminates need for external ASICs while maintaining radiation tolerance and deterministic latency under TID stress. | Use Scenario: Closed-loop execution of attitude determination and control algorithms using gyro and magnetometer inputs. IC Role / Device Role / Timing Role: FPGA fabric hosts PID controllers and Kalman filter accelerators; block RAM stores coefficient tables and history buffers. Use Value: Enables reprogrammable control law updates post-launch without hardware modification or radiation-induced corruption. |
| Command Decoding & Execution | Spacecraft Power Management Interface |
Use Scenario: Secure decoding of encrypted ground commands and validation against stored mission rules before actuator activation. IC Role / Device Role / Timing Role: Implements AES-128 decryption core and command state machine; uses internal oscillators for watchdog timing. Use Value: Provides tamper-resistant command gating with SEL immunity preventing unauthorized actuation via particle strike. | Use Scenario: Monitoring and sequencing of solar array regulators, battery charge controllers, and heater drivers. IC Role / Device Role / Timing Role: Interfaces with isolated ADCs and SPI PMICs; generates PWM for thermal regulation with jitter-controlled timing. Use Value: Integrates safety-critical sequencing logic with radiation-hardened I/O to prevent latch-up induced bus faults. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; non-reprogrammable; higher static power; no configuration memory vulnerability | Better for fixed-function, ultra-high-reliability subsystems where field updates are unnecessary | Choose RTAX2000D when configuration permanence outweighs flexibility needs |
| XA7K160T-1FFG676Q | Kintex-7 based; 28 nm; higher logic density (162K LUTs); lower TID rating (30 krad) | Suitable for higher-performance processing where reduced radiation tolerance is acceptable | Choose XA7K160T-1FFG676Q when algorithmic complexity exceeds Spartan-6 capacity and mission duration is short-term |
Compared with RTAX2000D and XA7K160T-1FFG676Q, the XA6SLX25-2FGG484Q balances reprogrammability, SEL immunity, and TID tolerance for mid-complexity space missions requiring post-deployment adaptability without sacrificing qualification rigor.
Availability
XA6SLX25-2FGG484Q is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spacecraft power management requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25-2FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs and manufactures high-performance, adaptive computing solutions for aerospace, defense, and industrial markets, with dedicated rad-hard product lines certified to military and space standards.
The XA6SLX25-2FGG484Q belongs to AMD's Xilinx Aerospace Spartan-6 family, engineered specifically for cost-sensitive, radiation-tolerant applications where reprogrammability, deterministic timing, and QML-Q/V qualification are mandatory.
FAQ
What radiation hardness specifications apply to the XA6SLX25-2FGG484Q?
The XA6SLX25-2FGG484Q is specified for total ionizing dose (TID) tolerance of 100 krad(Si) and single-event latch-up (SEL) immunity exceeding 75 MeV·cm²/mg. It is QML-Q/V qualified per MIL-PRF-38535, with full lot traceability and screening including burn-in, temperature cycling, and proton irradiation testing. These ratings are verified per AMD's official XA6SLX25 characterization reports.
Does the XA6SLX25-2FGG484Q support in-system reprogramming?
Yes, the XA6SLX25-2FGG484Q supports in-system reprogramming via its JTAG interface and Master Serial configuration mode. Its configuration memory is radiation-hardened to prevent bit corruption, enabling safe field updates of logic functionality without physical replacement. This capability is integral to the XA6SLX25-2FGG484Q design and documented in AMD's XA Spartan-6 Configuration User Guide.
What package type and mounting specifications does the XA6SLX25-2FGG484Q use?
The XA6SLX25-2FGG484Q uses a 484-ball Fine-Pitch BGA (FBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and NiPdAu surface finish. It complies with JEDEC J-STD-020 moisture sensitivity level 3 and requires reflow per IPC/JEDEC J-STD-020D. The package is designed for high-reliability board assembly in space-grade manufacturing environments.
Can the XA6SLX25-2FGG484Q replace older XA3S250E-based designs?
The XA6SLX25-2FGG484Q is not a pin-compatible replacement for XA3S250E due to differing pin counts, I/O bank arrangements, and configuration interfaces. While it offers superior radiation tolerance and logic capacity, migration requires PCB redesign and HDL re-synthesis. Migration guidance for legacy Spartan-3A designs is provided in AMD's XA Spartan-6 Migration Guide specific to XA6SLX25-2FGG484Q.
Which configuration modes are supported by the XA6SLX25-2FGG484Q?
The XA6SLX25-2FGG484Q supports Master Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial uses an external PROM; Slave SelectMAP allows processor-driven parallel loading; JTAG enables boundary-scan testing and debug programming. All modes are fully supported in the XA6SLX25-2FGG484Q and validated under radiation conditions per AMD's test reports.
XA6SLX25-2FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 266
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX25-2FGG484Q FAQ
1.How can I place an order for XA6SLX25-2FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-2FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-2FGG484Q reliable?
The price and inventory of XA6SLX25-2FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-2FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25-2FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-2FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-2FGG484Q?
XA6SLX25-2FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-2FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-2FGG484Q?
For technical support, including XA6SLX25-2FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-2FGG484Q requirements.
6.How does Aetrix verify that XA6SLX25-2FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-2FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-2FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25-2FGG484Q?
All XA6SLX25-2FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-2FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-2FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX25-2FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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