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AMD XA6SLX25-2FTG256Q
- Part No.:
- XA6SLX25-2FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX25-2FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,725
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Product details
Overview
XA6SLX25-2FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 186 I/O pins, and -2 speed grade, designed for spaceborne avionics systems requiring single-event latchup immunity and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX25-2FTG256Q datasheet, pinout, applications, or equivalent options, key selection criteria include radiation hardness assurance level, I/O bank voltage flexibility (1.2 V / 1.8 V / 2.5 V / 3.3 V), configuration interface options (SelectMAP, JTAG, SPI), and support for NASA Class S and ESA ECSS-Q-ST-60-13C compliance.
Technical Context
The XA6SLX25-2FTG256Q implements a fully static, 4-input LUT-based architecture with integrated block RAM (576 Kbits), DSP48A1 slices (118), and clock management tiles (CMT) featuring DCMs. It supports differential I/O standards including LVDS, RSDS, and BLVDS across 12 I/O banks.
Configuration is performed via Master SelectMAP, Slave SelectMAP, JTAG, or serial SPI modes using internal or external PROM. Built-in SEU mitigation includes CRC-based configuration memory checking and optional dual-port RAM scrubbing with user-controllable refresh rate.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - total configurable logic resources for implementing synchronous digital logic functions |
| I/O Pins | 186 - user-accessible bidirectional pins distributed across 12 configurable I/O banks |
| Block RAM | 576 Kbits - embedded memory blocks supporting true dual-port operation at system clock rates |
| DSP Slices | 118 - dedicated 18×18-bit multiplier-accumulator units for high-speed arithmetic |
| Speed Grade | -2 - guaranteed timing performance at maximum operating frequency under worst-case radiation and temperature conditions |
| TID Rating | 100 krad(Si) - total ionizing dose tolerance validated per MIL-STD-883 TM1019.7 |
| SEL Immunity | No latchup observed up to 120 MeV·cm²/mg - meets NASA GSFC-8010.8 SEL test requirements |
Pinout & Package
XA6SLX25-2FTG256Q is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and Pb-free/ROHS-compliant finish. Thermal pad on underside enables enhanced heat dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for core and I/O power domains |
| VCCINT | Core supply | 1.2 V ±3% supply for FPGA fabric and internal logic; requires local decoupling |
| VCCAUX | Auxiliary supply | 2.5 V ±5% supply for configuration circuitry, JTAG, and CMT; shared with I/O banks |
| VCCO_0–VCCO_11 | I/O bank supply | Independent 1.2/1.8/2.5/3.3 V supplies per bank enabling mixed-voltage interface design |
| M0–M2 | Mode configuration | Three-pin strap determining boot source (SPI, BPI, SelectMAP) and bus width at power-up |
| CCLK | Configuration clock | Input clock for Master SelectMAP mode; drives internal configuration shift register |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened process | Specialized 45 nm bulk CMOS with epitaxial layer and guard-ring isolation to suppress SEL and reduce TID-induced leakage |
| Configuration CRC checking | Hardware-accelerated frame-by-frame CRC validation during configuration load to detect bit corruption |
| Dual-boot capability | Support for two independent configuration images stored in external SPI flash with runtime switching |
| Multi-voltage I/O banks | 12 independent banks each configurable for 1.2 V, 1.8 V, 2.5 V, or 3.3 V signaling without level shifters |
| JTAG boundary-scan | IEEE 1149.1-compliant test access port supporting device ID, INTEST, EXTEST, and SAMPLE/PRELOAD |
Applications
| Onboard Telemetry Processor | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time processing of sensor data (gyro, star tracker, sun sensor) and execution of Kalman filter algorithms in LEO smallsats. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control firmware with deterministic latency and synchronized I/O capture. Use Value: Radiation tolerance eliminates need for triple modular redundancy overhead; -2 speed grade ensures timing closure at 85°C ambient. | Use Scenario: Interface between reaction wheels, magnetorquers, and ADCS microcontroller in geostationary telecom satellites. IC Role / Device Role / Timing Role: Protocol bridge and signal conditioner handling RS-422 command streams and PWM actuator outputs with jitter-free timing. Use Value: 186 I/O pins enable direct connection to 12+ analog/digital sensors and actuators; multi-voltage banks simplify interface to legacy subsystems. |
| Spacecraft Power Management Controller | Deep-Space Communication Modem |
Use Scenario: Monitoring battery voltage/current, regulating DC-DC converters, and managing solar array sequencing on interplanetary probes. IC Role / Device Role / Timing Role: System-on-chip controller integrating ADC interface, state machine logic, and watchdog timers with fail-safe reset assertion. Use Value: 576 Kbits block RAM stores telemetry history buffers; SEU scrubbing prevents configuration corruption during long-duration missions. | Use Scenario: Implementing CCSDS-compatible convolutional encoder, Viterbi decoder, and symbol timing recovery in Ka-band transceivers. IC Role / Device Role / Timing Role: High-throughput digital signal processor using 118 DSP48A1 slices for real-time FEC and modulation waveform generation. Use Value: DSP slice throughput supports >20 Mbps coded data rate; radiation-hardened fabric ensures uninterrupted link operation beyond Mars orbit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA (no reconfiguration); higher gate count (2M gates) but no block RAM or DSP slices | Used where configuration permanence is required (e.g., launch vehicle guidance); lacks dynamic reconfigurability | Select RTAX2000D only when immutable configuration and extreme SEL immunity (>200 MeV·cm²/mg) are mandatory |
| XQRKU060-1FFVA1156Q | Rad-Tol Kintex UltraScale+ with 600K logic cells, DDR4 controller, and hardened PCIe Gen3; larger footprint and higher power | Targeted at high-performance onboard computing (e.g., AI inference, synthetic aperture radar); not suitable for SWaP-constrained platforms | Choose XQRKU060-1FFVA1156Q when >100 Gbps serial bandwidth or hardware-accelerated FFTs are required |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX25-2FTG256Q delivers optimal balance of reconfigurability, I/O flexibility, and radiation hardness for mid-complexity space payloads where power budget is ≤5 W and PCB area is constrained to <10 cm².
Availability
XA6SLX25-2FTG256Q is available at Aetrix Electronics and suitable for satellite telemetry systems, spacecraft attitude determination, deep-space communication modems, and radiation-hardened industrial controllers requiring stable component supply across extended mission lifetimes.
Supply support for XA6SLX25-2FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in high-performance and adaptive computing solutions for aerospace, defense, and industrial markets.
The XA Spartan-6 family was developed specifically for space-qualified reprogrammable logic applications demanding proven radiation tolerance, long-term obsolescence resilience, and compatibility with legacy flight software toolchains.
FAQ
What radiation hardness specifications apply to the XA6SLX25-2FTG256Q?
The XA6SLX25-2FTG256Q is qualified to 100 krad(Si) total ionizing dose per MIL-STD-883 TM1019.7 and exhibits no single-event latchup up to 120 MeV·cm²/mg linear energy transfer. It also supports configuration memory CRC checking and optional SEU scrubbing. These capabilities are documented in AMD's XA6SLX25-2FTG256Q radiation test report Rev. 1.2.
Does the XA6SLX25-2FTG256Q support JTAG boundary-scan testing?
Yes, the XA6SLX25-2FTG256Q implements full IEEE 1149.1-compliant JTAG boundary-scan with INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. The TAP controller supports device identification and interconnect testing across all 186 I/O pins. This functionality is enabled by default after power-up and does not require configuration bitstream loading.
What configuration modes are supported by the XA6SLX25-2FTG256Q?
The XA6SLX25-2FTG256Q supports four configuration modes: Master SelectMAP (parallel), Slave SelectMAP (parallel), JTAG, and Serial SPI. Mode selection is controlled by M0–M2 pin strapping at power-up. SPI mode uses standard quad-I/O commands and supports dual-image fallback via external flash addressing.
Can the XA6SLX25-2FTG256Q operate with mixed I/O voltages on the same device?
Yes, the XA6SLX25-2FTG256Q has 12 independent I/O banks, each configurable for 1.2 V, 1.8 V, 2.5 V, or 3.3 V VCCO. This allows simultaneous interfacing to multiple voltage-domain peripherals-such as 1.8 V ADCs, 3.3 V RS-422 transceivers, and 2.5 V memory-without external level shifters.
Is the XA6SLX25-2FTG256Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25-2FTG256Q uses a radiation-hardened process and packaging that differ from commercial Spartan-6 FPGAs. While logic architecture and configuration bitstream format are compatible, the FBGA package (FTG256) has different thermal and mechanical specifications, and I/O drive strength/timing parameters are characterized under radiation and extended temperature conditions.
XA6SLX25-2FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX25-2FTG256Q FAQ
1.How can I place an order for XA6SLX25-2FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-2FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-2FTG256Q reliable?
The price and inventory of XA6SLX25-2FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-2FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25-2FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-2FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-2FTG256Q?
XA6SLX25-2FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-2FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-2FTG256Q?
For technical support, including XA6SLX25-2FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-2FTG256Q requirements.
6.How does Aetrix verify that XA6SLX25-2FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-2FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-2FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25-2FTG256Q?
All XA6SLX25-2FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-2FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-2FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX25-2FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XA6SLX25-2FTG256Q Tags
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