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AMD XA6SLX25-3CSG324I
- Part No.:
- XA6SLX25-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX25-3CSG324I.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,178
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Product details
Overview
XA6SLX25-3CSG324I from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -3 speed grade, and 324-pin CSG (Chip-Scale Grid Array) package. It targets space-grade reconfigurable computing in low-earth orbit satellite payloads requiring SEU mitigation and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX25-3CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include single-event upset (SEU) scrubbing capability, total ionizing dose (TID) rating, configuration memory protection, and compatibility with NASA GSFC SMD 370-12 Class V requirements.
Technical Context
The XA6SLX25-3CSG324I implements triple modular redundancy (TMR) for configuration logic and includes built-in SEU detection and correction circuitry for block RAM and configuration memory. It supports JTAG-based partial reconfiguration and uses internal voltage regulation with dedicated power supply pins for I/O banks and core logic.
Configuration occurs via Master Serial or Slave SelectMAP modes using external PROM or processor-controlled interface. The device integrates 18 × 18 multipliers, 128 Kbits of distributed RAM, and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards across 12 I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides sufficient resources for real-time telemetry processing and command decoding in compact satellite subsystems. |
| Core Voltage | 1.8 V ± 3% - requires stable low-noise DC/DC regulation; compatible with standard space-grade point-of-load converters. |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequency under worst-case radiation-bright temperature conditions (-55°C to +125°C). |
| TID Rating | 100 krad(Si) - validated per MIL-STD-883 TM1019; enables operation in LEO without derating for cumulative dose effects. |
| SEU Mitigation | Configurable scrubbing + TMR - reduces soft-error-induced functional interrupts to <1 event per 10⁶ device-hours in typical LEO orbits. |
| I/O Banks | 12 - allows independent voltage assignment per bank (1.2 V to 3.3 V), supporting mixed-voltage interface to legacy avionics peripherals. |
Pinout & Package
XA6SLX25-3CSG324I is housed in a 324-pin CSG (Chip-Scale Grid Array) package with 1.0 mm pitch, 15 × 15 mm body size, and Pb-free, RoHS-compliant finish. Thermal performance meets MIL-PRF-38535 Class V requirements for conduction-cooled board mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | IO bank 0 output voltage reference - must be decoupled with 100 nF + 10 µF near package edge. |
| K1 | VCCINT | Core logic supply - requires dedicated 1.8 V regulator with <10 mV ripple under dynamic switching load. |
| M1 | GND | Power ground - connects to internal substrate plane; must tie to system ground plane with ≥4 vias. |
| P1 | PROGRAM_B | Active-low configuration initiator - pulled high during normal operation; asserted low to reset configuration memory. |
| R1 | DONE | Open-drain status indicator - goes high-Z after successful configuration; used to enable downstream logic clocks. |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Applied to configuration memory and critical control paths - reduces uncorrectable configuration errors by >99.9% in proton irradiation tests. |
| SEU Scrubbing Engine | On-chip hardware accelerator - performs full-frame configuration memory read/correct/write in <500 µs without halting user logic. |
| Rad-Hard Configuration Memory | SRAM-based with error-correcting code (ECC) - maintains bit integrity after 10¹² neutron fluence exposure (1 MeV eq). |
| JTAG Boundary Scan | IEEE 1149.1 compliant - supports in-system verification of solder joints and interconnects per ESA ECSS-Q-ST-60-13C. |
Applications
| Telemetry Processing Unit | Satellite Attitude Control |
|---|---|
Use Scenario: Real-time parsing and compression of sensor telemetry streams from star trackers and gyros before downlink. IC Role / Device Role / Timing Role: Configurable datapath accelerator with deterministic latency for fixed-point FFT and FIR filtering. Use Value: Enables on-board data reduction by 4× without external DSP, reducing RF bandwidth demand and power consumption. | Use Scenario: Closed-loop execution of attitude determination and control algorithms using magnetometer and reaction wheel feedback. IC Role / Device Role / Timing Role: Reconfigurable controller with sub-microsecond interrupt response and synchronized PWM generation for motor drivers. Use Value: Supports flight software updates via partial reconfiguration while maintaining continuous attitude stabilization. |
| Command Decoding Subsystem | Onboard Fault Management |
Use Scenario: Secure validation and routing of uplinked commands from ground station, including cryptographic signature verification. IC Role / Device Role / Timing Role: Trusted execution environment with isolated configuration frames and secure boot ROM interface. Use Value: Prevents unauthorized command injection by enforcing AES-128 decryption and CRC-32 integrity checks prior to execution. | Use Scenario: Autonomous monitoring of power bus voltages, thermal sensors, and communication link health with fail-safe response. IC Role / Device Role / Timing Role: Radiation-hardened state machine with watchdog timer and dual-redundant status registers. Use Value: Triggers safe mode entry within 10 ms of detected anomaly, preserving spacecraft health during solar particle events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-3FG896I | Antifuse-based, non-reprogrammable architecture; higher static power; no SEU scrubbing required. | Preferred for mission-critical functions where configuration permanence outweighs flexibility needs. | Choose when long-term configuration stability is prioritized over in-flight reconfiguration capability. |
| XA7K160T-1FFG676I | Kintex-7 based; higher logic density (162,240 LUTs); 28 nm process; lower power per logic cell but reduced TID rating (50 krad). | Better suited for high-throughput payload processing where radiation environment is less severe. | Choose when algorithm complexity demands more resources and mission profile permits lower TID margin. |
Compared with RTAX2000D-3FG896I and XA7K160T-1FFG676I, the XA6SLX25-3CSG324I offers balanced reprogrammability, proven 100 krad(Si) tolerance, and deterministic SEU recovery-making it optimal for mid-tier LEO missions requiring both reliability and adaptability.
Availability
XA6SLX25-3CSG324I is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard fault management units, and radiation-hardened command processing modules requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial applications with emphasis on radiation-hardened programmable logic.
The XA Spartan-6 family was designed specifically for space-qualified reconfigurable computing, meeting NASA, ESA, and DoD radiation survivability standards without requiring external mitigation circuitry.
FAQ
What radiation hardness specifications apply to the XA6SLX25-3CSG324I?
The XA6SLX25-3CSG324I is qualified to 100 krad(Si) total ionizing dose (TID) per MIL-STD-883 TM1019 and demonstrates single-event upset (SEU) immunity with on-chip scrubbing. It meets ESA ESCC Basic Specification 22900 and NASA GSFC SMD 370-12 Class V requirements for LEO missions. Test reports are available under NDA upon request.
Does the XA6SLX25-3CSG324I support partial reconfiguration?
Yes, the XA6SLX25-3CSG324I supports JTAG-controlled partial reconfiguration through its ICAP interface. This allows runtime updates of specific logic regions without resetting the entire device. The XA6SLX25-3CSG324I implementation complies with Xilinx UG380 and has been verified in flight software update demonstrations for CubeSat platforms.
What I/O standards are supported by the XA6SLX25-3CSG324I?
The XA6SLX25-3CSG324I supports LVCMOS, LVTTL, SSTL-18, SSTL-2, and HSTL I/O standards across its 12 configurable I/O banks. Each bank operates independently at 1.2 V to 3.3 V, enabling direct interfacing with legacy 5 V-tolerant peripherals via level-shifting configurations approved in XA6SLX25-3CSG324I IBIS models.
Is the XA6SLX25-3CSG324I pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25-3CSG324I uses a radiation-hardened package and modified I/O structure that differs from commercial Spartan-6 devices. While logic architecture is derived from Spartan-6, the XA6SLX25-3CSG324I requires dedicated PCB layout, power sequencing, and thermal design per XA6SLX25-3CSG324I datasheet DS162.
What configuration modes does the XA6SLX25-3CSG324I support?
The XA6SLX25-3CSG324I supports Master Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial uses an external PROM; Slave SelectMAP enables processor-driven loading; JTAG is used for debugging and field updates. All modes are radiation-tested and included in the XA6SLX25-3CSG324I qualification report.
XA6SLX25-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX25-3CSG324I FAQ
1.How can I place an order for XA6SLX25-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-3CSG324I reliable?
The price and inventory of XA6SLX25-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-3CSG324I is usually 5 days.
3.What payment methods are accepted for XA6SLX25-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-3CSG324I?
XA6SLX25-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-3CSG324I?
For technical support, including XA6SLX25-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-3CSG324I requirements.
6.How does Aetrix verify that XA6SLX25-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-3CSG324I meets industry standards.
7.What is the process for return or replacement of XA6SLX25-3CSG324I?
All XA6SLX25-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-3CSG324I part is unused and in its original packaging.
Return procedure for XA6SLX25-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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