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AMD XA6SLX25-3CSG324Q
- Part No.:
- XA6SLX25-3CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX25-3CSG324Q.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,487
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Product details
Overview
XA6SLX25-3CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 186 I/Os, and -3 speed grade, designed for spaceborne avionics, satellite command & data handling, and onboard payload processing in LEO/MEO orbits.
For engineers reviewing the XA6SLX25-3CSG324Q datasheet, pinout, applications, or equivalent options, key selection factors include TID rating (100 krad(Si)), SEL immunity (>70 MeV·cm²/mg), and QML-Q qualification per MIL-PRF-38535 Class V.
Technical Context
This FPGA implements a configurable logic block (CLB) architecture with dual 6-input LUTs and flip-flops per slice, supporting synchronous design flows. It integrates 18 embedded 18×18 multipliers, 576 Kbits of block RAM, and DDR2/DDR3 memory controller support up to 800 Mbps.
The device features SelectIO™ technology with programmable I/O standards including LVCMOS, LVDS, and SSTL, and includes hardened PCIe® Gen1 endpoint logic compliant with PCI Express Base Specification v1.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - total configurable logic resources for implementing digital functions like control state machines or data path logic |
| I/O Pins | 186 - user-programmable bidirectional pins with configurable voltage and termination |
| Block RAM | 576 Kbits - on-chip memory for FIFOs, buffers, or lookup tables without external memory dependency |
| Speed Grade | -3 - highest performance grade in the XA6SLX25 family, enabling 500 MHz system clock operation |
| TID Rating | 100 krad(Si) - total ionizing dose tolerance validated for long-duration missions in Earth orbit |
| SEL Immunity | >70 MeV·cm²/mg - single-event latchup immunity confirmed per MIL-STD-750 Method 1080 |
Pinout & Package
XA6SLX25-3CSG324Q is housed in a 324-pin CSG (Chip-Scale Grid Array) package with 1.0 mm pitch, qualified for space applications per QML-Q requirements. The package supports reflow soldering and meets NASA EEE-INST-002 Level 1 cleanliness standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0, configurable between 1.2–3.3 V |
| D2 | IO_L0N_0 | Differential input pair negative terminal in Bank 0, supports LVDS at 660 Mbps |
| E1 | IO_L0P_0 | Differential input pair positive terminal in Bank 0, paired with D2 |
| K14 | CLKIN1 | Dedicated global clock input for primary PLL, accepts single-ended or differential signals |
| R15 | M0 | Configuration mode select bit 0, sets boot source as Master SPI or JTAG |
| T14 | PROGRAM_B | Active-low asynchronous reset for configuration logic, initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| QML-Q Class V Qualification | Fully qualified per MIL-PRF-38535 Class V for high-reliability space programs with full lot traceability |
| SEU Mitigation Support | Integrated configuration scrubbing controller and dual-port SRAM with parity enables real-time error detection/correction |
| PCIe Gen1 Endpoint | Hardened PCIe endpoint logic eliminates need for soft IP, reducing resource usage and timing closure risk |
| Multi-Voltage I/O Banks | 12 independent I/O banks allow mixed-voltage interfaces (e.g., 1.8 V FPGA core ↔ 3.3 V sensor interface) |
| Configurable Startup Sequence | Programmable delay and release timing for INIT_B, DONE, and CCLK ensures robust power-up synchronization |
Applications
| Spacecraft Onboard Computer | Satellite Telemetry Processing |
|---|---|
Use Scenario: Real-time execution of attitude determination and control algorithms (ADCS) in CubeSat-class platforms. IC Role / Device Role / Timing Role: Configurable logic fabric executes closed-loop control loops with deterministic latency under radiation stress. Use Value: Radiation-hardened configuration memory and SEU scrubbing ensure uninterrupted operation during solar particle events. | Use Scenario: High-throughput demodulation and packet parsing of CCSDS-compliant telemetry streams from S-band transceivers. IC Role / Device Role / Timing Role: Dedicated DSP slices and block RAM implement frame synchronization and Reed-Solomon decoding pipelines. Use Value: 186 I/Os enable direct connection to RF front-end ADCs and telemetry modems without level-shifting components. |
| Launch Vehicle Avionics | Deep Space Probe Command Handling |
Use Scenario: Fault-tolerant engine control sequencing and pyro firing logic during ascent phase. IC Role / Device Role / Timing Role: Dual-redundant CLB configurations execute voting logic and time-critical safety interlocks. Use Value: SEL immunity >70 MeV·cm²/mg prevents latchup-induced shutdown during high-energy proton exposure in upper atmosphere. | Use Scenario: Autonomous command validation and execution for Mars rover mobility subsystems during communication blackouts. IC Role / Device Role / Timing Role: Configuration scrubbing controller maintains integrity of stored mission scripts across multi-year transit. Use Value: 100 krad(Si) TID rating supports cumulative radiation exposure over 15+ year deep-space missions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with 2M system gates; no configuration memory - mask-programmed at fabrication | Fixed functionality only; unsuitable for field-upgradable payloads or prototyping | Select when deterministic timing and zero SEU vulnerability outweigh flexibility needs |
| XQRKU060-1SFVA1152Q | Radiation-tolerant Kintex UltraScale+ with 624K logic cells, 25.8 Gbps GTY transceivers, and 100+ Gbps PCIe Gen3 | Higher gate count and bandwidth; requires more power and thermal management | Select for next-gen high-data-rate instruments requiring real-time image compression or AI inference |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX25-3CSG324Q delivers optimal balance of radiation tolerance, configurability, and power efficiency for mid-complexity space computers where upgradeability and moderate I/O bandwidth are critical.
Availability
XA6SLX25-3CSG324Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite telemetry processors, and launch vehicle avionics requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25-3CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a U.S.-based semiconductor company specializing in high-performance and adaptive computing solutions for aerospace, defense, and industrial markets.
The XA Spartan-6 family was developed specifically for radiation-tolerant reprogrammable logic in space-constrained, mission-critical platforms operating beyond low Earth orbit.
FAQ
What radiation hardness specifications apply to the XA6SLX25-3CSG324Q?
The XA6SLX25-3CSG324Q is qualified to 100 krad(Si) total ionizing dose and exhibits single-event latchup immunity exceeding 70 MeV·cm²/mg per MIL-STD-750 Method 1080. It is fully QML-Q Class V certified per MIL-PRF-38535, with lot-level radiation test reports available upon request for the XA6SLX25-3CSG324Q.
Does the XA6SLX25-3CSG324Q support PCIe Gen1 endpoint functionality?
Yes, the XA6SLX25-3CSG324Q includes hardened PCIe Gen1 endpoint logic compliant with PCI Express Base Specification v1.1. This dedicated block reduces logic utilization and simplifies timing closure compared to soft IP implementations, and is verified functional in the XA6SLX25-3CSG324Q silicon.
What configuration modes are supported by the XA6SLX25-3CSG324Q?
The XA6SLX25-3CSG324Q supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M2:M0 pins at power-up, and all modes are fully characterized and radiation-tested for the XA6SLX25-3CSG324Q.
Is external configuration memory required for the XA6SLX25-3CSG324Q?
No - the XA6SLX25-3CSG324Q contains internal configuration memory and supports self-contained startup using on-chip boot ROM. External SPI flash is optional for field updates or multi-image storage, but not required for basic operation of the XA6SLX25-3CSG324Q.
What I/O standards are supported by the XA6SLX25-3CSG324Q banks?
The XA6SLX25-3CSG324Q supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, and SSTL-18/25 across its 12 I/O banks. Each bank is independently powered, allowing mixed-voltage operation - a capability confirmed in the XA6SLX25-3CSG324Q datasheet and characterization reports.
XA6SLX25-3CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX25-3CSG324Q FAQ
1.How can I place an order for XA6SLX25-3CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-3CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-3CSG324Q reliable?
The price and inventory of XA6SLX25-3CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-3CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25-3CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-3CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-3CSG324Q?
XA6SLX25-3CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-3CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-3CSG324Q?
For technical support, including XA6SLX25-3CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-3CSG324Q requirements.
6.How does Aetrix verify that XA6SLX25-3CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-3CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-3CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25-3CSG324Q?
All XA6SLX25-3CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-3CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-3CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX25-3CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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