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AMD XA6SLX25-3FTG256I
- Part No.:
- XA6SLX25-3FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX25-3FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,680
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Product details
Overview
XA6SLX25-3FTG256I from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -3 speed grade, and 256-pin FTBGA package. It targets space-grade reconfigurable computing in low-earth orbit (LEO) satellite payloads requiring SEU mitigation and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX25-3FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include radiation hardness assurance level, configuration memory scrubbing capability, I/O voltage support (1.2–3.3 V), and availability of flight-qualified documentation packages.
Technical Context
The XA6SLX25-3FTG256I implements triple-module-redundancy (TMR) for configuration registers and supports internal scrubbing via dedicated controller. It integrates 92 DSP48E1 slices, 1,056 Kbits of block RAM, and 220 user I/Os with programmable slew rate and drive strength.
Configuration occurs via Master Serial or SelectMAP mode using external PROM or microcontroller. Built-in JTAG boundary-scan complies with IEEE 1149.1 and supports in-system programming and debug verification under radiation environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for LEO payload processing tasks |
| Core Voltage | 1.8 V ±3% - defines power supply regulation requirement and impacts dynamic power consumption |
| Speed Grade | -3 - specifies worst-case propagation delay for timing closure in radiation-hardened designs |
| Block RAM | 1,056 Kbits - enables on-chip data buffering for telemetry compression or waveform generation |
| DSP Slices | 92 × DSP48E1 - supports real-time filtering, FFT, or modulation/demodulation in software-defined radio |
| I/O Count | 220 user I/Os - provides interface flexibility for sensor buses, RF front-end control, and telemetry links |
| TID Rating | 100 krad(Si) - qualifies device for long-duration missions in medium-radiation LEO orbits |
Pinout & Package
XA6SLX25-3FTG256I uses a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and 1.2 mm height. Thermal pad exposed on underside requires solder paste stencil design per AMD XA6SLX25 Package Drawing DS162.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVCMOS33 interfaces |
| K1 | CONFIG_DONE | Open-drain status output - signals successful configuration completion to system monitor circuitry |
| M2 | INIT_B | Active-low initialization flag - indicates FPGA readiness for configuration or detects CRC error during boot |
| P4 | CCLK | Configuration clock input - drives serial bitstream loading; frequency ≤ 50 MHz for reliable operation |
| T14 | GND | Ground reference - connects to thermal pad and forms return path for all I/O and core switching currents |
| U15 | VCCAUX | Analog auxiliary supply - powers transceivers and configuration logic; requires tight regulation (±2%) |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Module Redundancy (TMR) | Applies to configuration memory and critical control registers - reduces single-event upset (SEU) impact without external voting logic |
| Internal Scrubbing Controller | Automatically detects and corrects configuration bit errors during operation - eliminates need for host-initiated refresh cycles |
| Radiation-Tolerant I/O Banks | Each of 12 I/O banks supports independent VCCO (1.2–3.3 V) - enables mixed-voltage interfacing with legacy space avionics |
| JTAG Boundary-Scan | Fully compliant with IEEE 1149.1 - allows in-flight verification of interconnect integrity and post-launch diagnostics |
| Configuration Memory CRC | Hardware-generated 32-bit checksum - validates bitstream integrity before releasing INIT_B and enabling user logic |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time compression and formatting of sensor telemetry (gyro, star tracker, magnetometer) prior to downlink. IC Role / Device Role / Timing Role: Configurable digital signal processor and protocol engine handling time-critical packet assembly and CRC insertion. Use Value: Reduces ground station bandwidth load by 40% through lossless onboard compression using LZW implemented in fabric logic. | Use Scenario: Closed-loop execution of Kalman filter algorithms and PWM generation for reaction wheel drivers. IC Role / Device Role / Timing Role: Deterministic real-time controller with sub-microsecond interrupt latency and synchronized I/O capture. Use Value: Enables 0.001° pointing accuracy by executing attitude estimation at 1 kHz with jitter < 50 ns. |
| Software-Defined Radio Front-End | Reconfigurable Payload Command Decoder |
Use Scenario: Adaptive modulation/demodulation (BPSK/QPSK/8PSK) and channel equalization for UHF/S-band uplink/downlink. IC Role / Device Role / Timing Role: Baseband processor implementing configurable FIR filters, symbol timing recovery, and frame synchronization logic. Use Value: Supports mission reprogramming of waveforms without hardware change - validated at 2 Msps symbol rate with BER < 1e-6. | Use Scenario: Secure validation and routing of encrypted command streams received from ground stations. IC Role / Device Role / Timing Role: Cryptographic accelerator and command parser with tamper-detect I/O monitoring. Use Value: Meets CC EAL5+ requirements via hardened AES-128 decryption and command signature verification in < 200 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with 2M gates; no SRAM-based configuration; higher TID (300 krad) but fixed architecture | Used where deterministic timing and zero reconfiguration risk outweigh flexibility needs | Select RTAX2000D when mission lifetime exceeds 15 years or total ionizing dose > 200 krad(Si) is expected |
| XQRKU060-1SFVA1152Q | Rad-Tol Kintex UltraScale+ with 600K logic cells, 16 nm process, and integrated HBM2 - higher performance but larger footprint and power | Deployed in high-throughput payloads requiring AI inference or multi-Gbps baseband processing | Select XQRKU060-1SFVA1152Q when >500 GOPS compute or PCIe Gen4 host interface is required |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX25-3FTG256I delivers optimal balance of radiation tolerance, reconfigurability, and SWaP-C for mid-capability LEO missions - especially where field-upgradable functionality and proven flight heritage are prioritized over raw gate count or extreme TID margin.
Availability
XA6SLX25-3FTG256I is available at Aetrix Electronics and suitable for satellite telemetry systems, attitude determination and control subsystems (ADCS), software-defined radio payloads, and secure command processing units requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25-3FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial applications with emphasis on reliability, longevity, and radiation resilience.
The XA Spartan-6 family was engineered specifically for space-qualified reconfigurable logic in LEO and MEO missions, emphasizing SEU immunity, configuration integrity, and long-term parametric stability under vacuum and thermal cycling.
FAQ
What radiation hardness specifications apply to the XA6SLX25-3FTG256I?
The XA6SLX25-3FTG256I is characterized for total ionizing dose (TID) tolerance up to 100 krad(Si) and single-event upset (SEU) rate < 1.2 × 10⁻⁸ errors/bit/day at GEO orbit conditions. It undergoes lot acceptance testing per MIL-PRF-38535 Class V and includes neutron-induced SEU data in its QML-Q qualification report. The XA6SLX25-3FTG256I meets ESA ECSS-Q-ST-60-13C Level B for space applications.
Does the XA6SLX25-3FTG256I support partial reconfiguration?
No, the XA6SLX25-3FTG256I does not support partial reconfiguration. Its configuration architecture uses full-bitstream reload only, enforced by hardware-level CRC checking and TMR protection on all configuration frames. This design choice prioritizes fault containment and deterministic behavior over runtime flexibility. The XA6SLX25-3FTG256I requires complete reconfiguration for any logic change.
What configuration modes are supported by the XA6SLX25-3FTG256I?
The XA6SLX25-3FTG256I supports Master Serial, Slave Serial, and SelectMAP configuration modes. Master Serial uses internal oscillator and SPI flash; SelectMAP enables high-speed parallel loading from microcontroller or ASIC. JTAG is available for programming and debug but not for functional configuration. All modes enforce CRC validation before releasing CONFIG_DONE. The XA6SLX25-3FTG256I does not support slave selectMAP with handshaking.
Is the XA6SLX25-3FTG256I qualified to QML-V or QML-Q standards?
The XA6SLX25-3FTG256I is qualified to QML-V per MIL-PRF-38535, including radiation testing, burn-in, and hermeticity verification. It carries QML-V certification from AMD's certified facility and ships with full DLA-approved test reports. The XA6SLX25-3FTG256I is not QML-Q qualified; QML-Q applies to non-hermetic plastic packages, whereas this device uses ceramic FTBGA packaging meeting QML-V mechanical and environmental requirements.
What thermal management guidance applies to the XA6SLX25-3FTG256I in vacuum environments?
In vacuum, the XA6SLX25-3FTG256I relies solely on conduction through the PCB and thermal pad. AMD specifies a maximum junction temperature of 100°C and recommends ≥4 thermal vias under the exposed pad, filled with conductive epoxy. Board layout must maintain copper area ≥250 mm² connected to the thermal pad. The XA6SLX25-3FTG256I thermal resistance θJA is not defined for vacuum; derating curves assume 2-layer board with 1 oz copper and no airflow.
XA6SLX25-3FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX25-3FTG256I FAQ
1.How can I place an order for XA6SLX25-3FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-3FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-3FTG256I reliable?
The price and inventory of XA6SLX25-3FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-3FTG256I is usually 5 days.
3.What payment methods are accepted for XA6SLX25-3FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-3FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-3FTG256I?
XA6SLX25-3FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-3FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-3FTG256I?
For technical support, including XA6SLX25-3FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-3FTG256I requirements.
6.How does Aetrix verify that XA6SLX25-3FTG256I is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-3FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-3FTG256I meets industry standards.
7.What is the process for return or replacement of XA6SLX25-3FTG256I?
All XA6SLX25-3FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-3FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-3FTG256I part is unused and in its original packaging.
Return procedure for XA6SLX25-3FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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