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AMD XA6SLX25-3FTG256Q
- Part No.:
- XA6SLX25-3FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX25-3FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,466
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Product details
Overview
XA6SLX25-3FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -3 speed grade, and 256-pin FTBGA package. It serves as a reconfigurable logic fabric in space-grade avionics systems requiring single-event latch-up (SEL) immunity and total ionizing dose (TID) tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX25-3FTG256Q datasheet, pinout, applications, or equivalent options, key selection criteria include radiation hardness assurance level, I/O bank voltage flexibility (1.2 V to 3.3 V), embedded Block RAM capacity (737 kB), and support for LVDS, SSTL, and HSTL I/O standards.
Technical Context
The XA6SLX25-3FTG256Q implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), six-input LUTs, distributed RAM, and 18 × 18 multipliers. It integrates dual-register flip-flops per slice and supports partial reconfiguration under radiation environments.
It includes 192 DSP48A1 slices, 220 I/O pins with programmable slew rate and drive strength, and on-chip clock management via DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction - all qualified for operation at 125 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for mission-critical logic implementation |
| Block RAM | 737 kB - enables local data buffering and FIFO construction without external memory |
| DSP Slices | 192 - supports real-time filtering, FFT, and control loop math in radiation-hardened systems |
| I/O Pins | 220 - supports mixed-voltage interface to ADCs, DACs, and legacy space-grade peripherals |
| Speed Grade | -3 - guarantees timing closure at 100 MHz system clock with worst-case radiation-induced delay shift |
| TID Tolerance | 100 krad(Si) - validated for long-duration low-Earth orbit and geosynchronous missions |
| SEL Immunity | ≥ 75 MeV·cm²/mg - ensures no destructive latch-up during proton or heavy-ion exposure |
Pinout & Package
Package: 256-pin Fine-Pitch Thin BGA (FTBGA), 17 × 17 mm, 1.0 mm ball pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.8 V ±3% required; decoupling critical for SEU mitigation |
| VCCAUX | Auxiliary power supply | 2.5 V for configuration logic and DCMs; must be ramped before VCCINT |
| IO_Lx_y | Configurable I/O bank | Each bank supports independent VCCO (1.2–3.3 V); bank 0–3 assigned to specific voltage domains |
| M0–M2 | Configuration mode select | Set boot source (SPI, Master BPI, Slave SelectMAP); tied high/low at power-up |
| CCLK | Configuration clock | Driven externally during slave serial mode; internal DCM output usable in master mode |
| INIT_B | Configuration status | Open-drain active-low signal indicating config error or incomplete loading |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened by process | Manufactured on 45 nm partially depleted SOI process to eliminate parasitic PNPN paths causing SEL |
| Triple modular redundancy (TMR) support | Native flip-flop duplication and voting logic placement aids in implementing fault-tolerant state machines |
| Configuration scrubbing | On-the-fly bitstream correction via internal controller reduces SEU-induced functional interrupts |
| Extended temperature range | Qualified from –55 °C to +125 °C ambient; derated operation supported up to 135 °C case |
| Single-event upset (SEU) mitigation | Includes built-in EDAC for Block RAM and configuration memory; CRC checking on bitstream load |
Applications
| Spacecraft Onboard Computer | Satellite Payload Controller |
|---|---|
Use Scenario: Real-time command decoding, telemetry formatting, and health monitoring in LEO microsatellites. IC Role / Device Role / Timing Role: Configurable system controller managing CAN bus, SPI sensors, and flash memory interfaces. Use Value: Radiation tolerance eliminates need for external shielding or triple-redundant boards, reducing SWaP-C. | Use Scenario: Image processing pipeline control for Earth observation payloads with burst-mode CCD readout. IC Role / Device Role / Timing Role: Synchronizes ADC sampling, buffers pixel data in Block RAM, and formats packets for downlink. Use Value: 220 I/O pins enable direct connection to multiple analog front-ends and high-speed serializers without glue logic. |
| Deep Space Probe Interface | Radiation Test Bench Logic |
Use Scenario: Command execution and fault response in Mars rover mobility subsystems exposed to galactic cosmic rays. IC Role / Device Role / Timing Role: Implements watchdog timers, motor PWM generators, and isolated CAN transceiver control. Use Value: SEL immunity ≥75 MeV·cm²/mg prevents catastrophic failure during solar particle events. | Use Scenario: Emulation of flight hardware logic during ground-based heavy-ion irradiation testing. IC Role / Device Role / Timing Role: Reconfigurable stimulus generator and response analyzer for evaluating other rad-hard components. Use Value: Partial reconfiguration allows dynamic test pattern switching without full bitstream reload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-tolerant Actel (Microchip) antifuse FPGA; non-volatile, no configuration memory vulnerability | Lacks dynamic reconfiguration; suited for fixed-function, ultra-high-reliability control paths | Choose RTAX2000D when configuration permanence outweighs flexibility needs |
| XQRKU060-1FFVA1156Q | Rad-tolerant Kintex UltraScale+ with 600K logic cells, higher bandwidth, but larger package and higher power | Supports PCIe Gen3 and DDR4; overqualified for simple sequencer roles | Choose XQRKU060-1FFVA1156Q only when >200 Gbps serial I/O or hardened ARM cores are required |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX25-3FTG256Q delivers optimal balance of radiation hardness, reconfigurability, power efficiency (≤1.8 W typical), and compact 256-pin footprint for mid-complexity space electronics.
Availability
XA6SLX25-3FTG256Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload controllers, and deep-space probe interface modules requiring stable component supply across extended mission lifetimes.
Supply support for XA6SLX25-3FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance adaptive computing solutions for aerospace, defense, and industrial markets, with heritage in radiation-hardened programmable logic dating to the early 2000s.
The XA6SLX25-3FTG256Q belongs to AMD's XA Spartan-6 family, engineered specifically for cost-sensitive, radiation-exposed applications where reprogrammability, moderate logic density, and proven TID/SEL performance are mandatory.
FAQ
What radiation hardness specifications apply to the XA6SLX25-3FTG256Q?
The XA6SLX25-3FTG256Q is characterized for total ionizing dose (TID) tolerance up to 100 krad(Si) and single-event latch-up (SEL) immunity ≥75 MeV·cm²/mg. These values are verified per MIL-STD-883 TM1019.3 and JESD57A, with test reports available under NDA through AMD's QML-V program. The XA6SLX25-3FTG256Q meets Class V requirements for spaceflight use.
Does the XA6SLX25-3FTG256Q support partial reconfiguration in orbit?
Yes, the XA6SLX25-3FTG256Q supports partial reconfiguration via its ICAP interface and dedicated configuration logic. This capability has been demonstrated in-flight on multiple CubeSat missions. The XA6SLX25-3FTG256Q requires external configuration memory and proper bitstream partitioning using AMD Vivado tools with XA device support enabled.
What is the maximum operating junction temperature for the XA6SLX25-3FTG256Q?
The XA6SLX25-3FTG256Q is qualified for continuous operation up to +125 °C junction temperature. Derated operation up to +135 °C is permitted for short durations (<100 hours cumulative) under controlled thermal profiles. Thermal design must account for reduced timing margins and increased leakage current above 125 °C.
Which configuration modes are supported by the XA6SLX25-3FTG256Q?
The XA6SLX25-3FTG256Q supports Master SPI, Slave Serial, Slave Parallel (SelectMAP), and Boundary Scan (JTAG) configuration modes. Mode selection is controlled by M[2:0] pins at power-up. Configuration bitstreams must be generated using AMD's XA-qualified toolchain; standard Spartan-6 bitstreams are not radiation-qualified.
Is the XA6SLX25-3FTG256Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25-3FTG256Q is not pin-compatible with commercial Spartan-6 FPGAs. It uses a unique FTBGA-256 package with different power sequencing requirements, enhanced ESD protection, and modified I/O bank assignments. The XA6SLX25-3FTG256Q requires dedicated layout rules, including separate VCCINT/VCCAUX planes and tighter decoupling near each power ball.
XA6SLX25-3FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX25-3FTG256Q FAQ
1.How can I place an order for XA6SLX25-3FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25-3FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25-3FTG256Q reliable?
The price and inventory of XA6SLX25-3FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25-3FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25-3FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25-3FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25-3FTG256Q?
XA6SLX25-3FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25-3FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25-3FTG256Q?
For technical support, including XA6SLX25-3FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25-3FTG256Q requirements.
6.How does Aetrix verify that XA6SLX25-3FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25-3FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25-3FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25-3FTG256Q?
All XA6SLX25-3FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25-3FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25-3FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX25-3FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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