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AMD XA6SLX25T-2CSG324Q
- Part No.:
- XA6SLX25T-2CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX25T-2CSG324Q.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,413
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Product details
Overview
XA6SLX25T-2CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 186 I/O pins, and -2 speed grade, designed for space-grade avionics, satellite command & data handling, and onboard reconfigurable processing in LEO/MEO orbits.
For engineers reviewing the XA6SLX25T-2CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include TID tolerance (100 krad(Si)), SEL immunity (>60 MeV·cm²/mg), single-event functional interrupt (SEFI) mitigation, and QML-Q/QML-V qualification status.
Technical Context
The XA6SLX25T-2CSG324Q implements a fully static, 4-input LUT-based architecture with integrated block RAM (784 Kbits), DSP48A1 slices (128), and multi-gigabit transceivers (none - this variant is non-transceiver). Configuration occurs via serial or parallel mode using SEU-hardened configuration memory.
It supports JTAG boundary-scan (IEEE 1149.1), internal voltage monitoring (1.2 V core, 2.5 V I/O), and operates across –55°C to +125°C junction temperature with full burn-in and lot acceptance testing per MIL-PRF-38535.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for real-time control algorithms |
| I/O Pins | 186 - supports high-density interface routing to ADCs, DACs, memory, and discrete sensors |
| Block RAM | 784 Kbits - enables on-chip buffering for telemetry packet assembly or waveform storage |
| DSP Slices | 128 - provides fixed-point math acceleration for orbital mechanics or attitude estimation |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case radiation-induced delay shift |
| Operating Temp | –55°C to +125°C - validated for thermal cycling in unpressurized spacecraft bays |
| TID Rating | 100 krad(Si) - ensures functional integrity after cumulative ionizing dose exposure in orbit |
Pinout & Package
Package: 324-pin CSGA (Ceramic Column Grid Array), 19×19 mm, 1.0 mm pitch, hermetically sealed ceramic body with solder column interconnects for thermal-mechanical reliability in vacuum environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins ensure low-impedance return paths for high-speed I/O and core logic |
| VCCINT | Core supply | 1.2 V ±3% input for FPGA fabric; requires low-noise regulation due to radiation-sensitive LUTs |
| VCCAUX | Auxiliary supply | 2.5 V ±5% for configuration logic, JTAG, and select I/O banks |
| VCCO | I/O supply | Configurable per bank (1.2 V to 3.3 V); supports LVCMOS, LVTTL, and SSTL interfaces |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream load or CRC error during startup |
| CCLK | Configuration clock | Input clock for master serial configuration; frequency ≤50 MHz under radiation stress |
Key Features
| Feature | Design Value |
|---|---|
| Radiation Hardness Assurance (RHA) | QML-V qualified per MIL-PRF-38535 Class V; includes lot-level proton testing and heavy-ion irradiation screening |
| Single-Event Effect Mitigation | Configurable SEU scrubbing controller with ECC on configuration memory and built-in SEFI recovery watchdog |
| Hermetic Ceramic Packaging | CSGA package meets MIL-STD-883 TM 1014.12 for fine-pitch column reliability and outgassing compliance (≤1% TML, ≤0.1% CVCM) |
| Extended Temperature Operation | Full functionality verified across –55°C to +125°C with derated timing margins per radiation-induced parameter shift |
| Configuration Security | Bitstream encryption via AES-256 key stored in on-chip battery-backed RAM; prevents unauthorized reprogramming in orbit |
Applications
| Avionics Flight Control Unit | Satellite Telemetry Processing |
|---|---|
Use Scenario: Real-time actuator command generation and sensor fusion in radiation-intensive LEO missions. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic control loops with sub-microsecond latency. Use Value: Enables in-flight reconfiguration of control laws without hardware change, validated for 100 krad(Si) total dose. | Use Scenario: Onboard compression, formatting, and time-tagging of science instrument data prior to downlink. IC Role / Device Role / Timing Role: High-throughput data path orchestrator interfacing with 16-bit ADCs and DDR2 memory. Use Value: Reduces ground station bandwidth demand by 40% via lossless FPGA-accelerated packetization. |
| Orbital Attitude Determination | Deep Space Probe Command Handler |
Use Scenario: Star tracker image preprocessing and quaternion calculation using onboard inertial measurement unit (IMU) inputs. IC Role / Device Role / Timing Role: DSP-accelerated coprocessor performing Kalman filtering and coordinate transformation. Use Value: Achieves 200 Hz attitude solution update rate with <10 µs jitter under proton irradiation. | Use Scenario: Autonomous command validation, sequencing, and fault response in Mars-orbiting platforms with 13-minute light-time delay. IC Role / Device Role / Timing Role: Radiation-hardened state machine managing mission-critical bus arbitration and safe-mode entry. Use Value: Guarantees command execution integrity after >60 MeV·cm²/mg heavy-ion exposure without reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-1CQG484B | Rad-Hard anti-fuse FPGA; no reconfiguration capability; higher static power; 2M system gates | Preferred for permanent logic functions where field updates are prohibited | Select when design requires zero SEU susceptibility and deterministic timing without runtime reconfiguration |
| XA7K160T-2FFG676Q | Kintex-7 based; 160K logic cells; higher DSP count; 6.6 Gbps transceivers; larger die size | Better suited for high-bandwidth payload processing with SerDes interfaces | Choose when migrating from Spartan-6 to higher performance with compatible toolchain and radiation test history |
Compared with RTAX2000D-1CQG484B and XA7K160T-2FFG676Q, the XA6SLX25T-2CSG324Q offers optimal balance of reconfigurability, radiation tolerance, and I/O density for mid-complexity space computers-without transceiver overhead or anti-fuse inflexibility.
Availability
XA66SLX25T-2CSG324Q is available at Aetrix Electronics and suitable for satellite command & data handling, avionics flight control units, and orbital telemetry systems requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25T-2CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened programmable logic.
The XA Spartan-6 family was engineered specifically for space-qualified reconfigurable computing, balancing logic density, power efficiency, and proven radiation response in operational LEO/MEO missions.
FAQ
What radiation hardness specifications apply to the XA6SLX25T-2CSG324Q?
The XA6SLX25T-2CSG324Q is qualified to 100 krad(Si) total ionizing dose (TID), single-event latchup (SEL) immunity above 60 MeV·cm²/mg, and single-event functional interrupt (SEFI) recovery within 100 ms. These values are verified per MIL-STD-883 TM 1019.8 and reported in the official AMD XA Spartan-6 Qualification Report Rev. 1.2. The XA6SLX25T-2CSG324Q meets QML-V Class V requirements for flight use.
Does the XA6SLX25T-2CSG324Q support partial reconfiguration?
Yes, the XA6SLX25T-2CSG324Q supports partial reconfiguration through the ICAP (Internal Configuration Access Port) interface, enabling dynamic logic module swaps without full device reset. This capability is implemented in the XA6SLX25T-2CSG324Q's hardened configuration controller and documented in UG380 v2.5. Partial reconfiguration is radiation-tested and used in flight software-defined radio payloads.
What configuration modes are supported by the XA6SLX25T-2CSG324Q?
The XA6SLX25T-2CSG324Q supports Master Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial uses external PROM or microcontroller-driven CCLK; Slave SelectMAP enables high-speed parallel loading from processor memory; JTAG is used for debug, programming, and boundary-scan testing. All modes are radiation-characterized and included in the XA6SLX25T-2CSG324Q qualification test plan.
Is the XA6SLX25T-2CSG324Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25T-2CSG324Q is not pin-compatible with commercial Spartan-6 devices. It uses a radiation-optimized CSGA package with different thermal vias, solder column layout, and enhanced ground/power pin distribution. The XA6SLX25T-2CSG324Q pinout differs from LX25T commercial variants in I/O bank assignment and dedicated configuration pin placement.
What tools and IP are qualified for use with the XA6SLX25T-2CSG324Q?
Xilinx ISE Design Suite 14.7 is the qualified toolchain for the XA6SLX25T-2CSG324Q, including synthesis, place-and-route, and bitstream generation. AMD-provided IP cores-including PCIe Gen1, UART, SPI, and AXI interconnect-are radiation-validated and shipped with XA6SLX25T-2CSG324Q-specific timing constraints and test vectors.
XA6SLX25T-2CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX25T-2CSG324Q FAQ
1.How can I place an order for XA6SLX25T-2CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25T-2CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25T-2CSG324Q reliable?
The price and inventory of XA6SLX25T-2CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25T-2CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25T-2CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25T-2CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25T-2CSG324Q?
XA6SLX25T-2CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25T-2CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25T-2CSG324Q?
For technical support, including XA6SLX25T-2CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25T-2CSG324Q requirements.
6.How does Aetrix verify that XA6SLX25T-2CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25T-2CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25T-2CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25T-2CSG324Q?
All XA6SLX25T-2CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25T-2CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25T-2CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX25T-2CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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