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AMD XA6SLX25T-2FGG484Q
- Part No.:
- XA6SLX25T-2FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX25T-2FGG484Q.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,566
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Product details
Overview
XA6SLX25T-2FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It integrates dual 18×18 multipliers, 18 Kb block RAMs, and supports LVDS, SSTL, and HSTL I/O standards for space-grade digital processing.
For engineers reviewing the XA6SLX25T-2FGG484Q datasheet, pinout, applications, or equivalent options, key selection factors include total logic capacity, radiation tolerance level (up to 100 krad(Si) TID), single-event latch-up (SEL) immunity, and qualification per QML-V Class V standards.
Technical Context
The XA6SLX25T-2FGG484Q implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It includes 192 DSP48A1 slices supporting 18×18 signed/unsigned multiplication and accumulation, and 128 block RAMs each configurable as 18 Kb dual-port memory.
Configuration is performed via serial or parallel mode using an external PROM or processor interface. The device supports JTAG boundary-scan testing per IEEE 1149.1 and includes internal configuration monitoring with CRC error detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational and sequential logic density for system-on-chip integration |
| Block RAM | 2,304 Kb - provides on-die memory for FIFOs, buffers, and data tables without external SRAM |
| DSP Slices | 192 - enables real-time filtering, FFT, and control loop computation in radiation-hardened environments |
| I/O Standards | LVDS, SSTL-18, HSTL-I - supports high-speed differential and single-ended interfaces to ADCs, DACs, and FPGAs |
| Speed Grade | -2 - guarantees timing closure at worst-case radiation-burdened temperature and voltage conditions |
| TID Rating | 100 krad(Si) - qualified for long-duration missions in medium Earth orbit and deep space |
| SEL Immunity | ≥ 75 MeV·cm²/mg - prevents catastrophic latch-up during proton and heavy-ion exposure |
Pinout & Package
Package: 484-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial mode; requires external oscillator or microcontroller clock source |
| DIN | Configuration Data Input | Serial bitstream input for FPGA programming; synchronized to CCLK edge |
| PROGRAM_B | Active-Low Configuration Reset | Forces reinitialization of configuration logic and clears internal state prior to reload |
| INIT_B | Configuration Status Output | Open-drain signal indicating successful CRC check or configuration failure |
| Done | Configuration Completion Indicator | High-Z open-drain output pulled up externally; asserts high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Radiation Hardness Assurance (RHA) | Qualified to QML-V Class V per MIL-PRF-38535; includes lot acceptance testing for TID and SEL |
| Configurable I/O Banks | Eight independent banks support mixed-voltage operation (1.2 V to 3.3 V) and per-bank I/O standard selection |
| Internal Oscillator | ~50 MHz RC oscillator for configuration and debug timing; not rated for mission-critical timing paths |
| MultiBoot Support | Enables dual-bitstream storage and runtime selection between primary and fallback configurations |
| System Monitor | On-die analog-to-digital converter for real-time monitoring of die temperature and supply voltages (VCCINT, VCCAUX) |
Applications
| Spacecraft Onboard Computer | Satellite Payload Controller |
|---|---|
Use Scenario: Real-time command decoding, telemetry formatting, and fault management in LEO smallsats. IC Role / Device Role / Timing Role: Configurable system controller managing CAN bus, UART, and SPI peripherals while executing autonomous health checks. Use Value: Radiation tolerance eliminates need for triple modular redundancy (TMR) overhead in non-safety-critical subsystems, reducing power and area. | Use Scenario: Image sensor interface and preprocessing unit for Earth observation payloads. IC Role / Device Role / Timing Role: High-speed LVDS receiver for CMOS image sensors, followed by pixel correction, histogram equalization, and JPEG compression acceleration. Use Value: Integrated DSP48A1 slices enable real-time image enhancement without offloading to external processors, minimizing latency and radiation-sensitive interconnects. |
| Deep Space Probe Interface | Radiation Monitoring Unit |
Use Scenario: Command interface and telemetry aggregator for Mars rover subsystems operating beyond 1 AU. IC Role / Device Role / Timing Role: Protocol bridge converting RS-422 commands to internal AXI-lite bus; handles time-tagged event logging with internal 32-bit counter. Use Value: QML-V qualification ensures reliable operation under cumulative dose and single-event effects expected during multi-year transit. | Use Scenario: In-situ TID and LET measurement using embedded current-sensing circuits and pulse-height analysis. IC Role / Device Role / Timing Role: Reconfigurable front-end digitizer capturing transient current spikes from RADFETs and silicon detectors. Use Value: Programmable logic allows adaptation to new sensor types and calibration algorithms without hardware redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA6SLX45T-2FGG676Q | Higher logic capacity (43,661 LC), larger 676-pin FBGA, increased block RAM (3,744 Kb) | Better suited for complex avionics functions requiring multiple protocol stacks and large buffer memory | Select when XA6SLX25T-2FGG484Q logic or memory resources are insufficient for full system integration |
| RTAX2000D-1CQG896B | Rad-Hard anti-fuse FPGA (non-volatile), 2M system gates, no configuration memory vulnerability | Preferred for ultra-high-reliability systems where configuration corruption must be physically impossible | Choose when zero-risk configuration SEU is mandatory, accepting higher static power and lack of in-field reprogrammability |
Compared with XA6SLX25T-2FGG484Q, the XA6SLX45T-2FGG676Q offers scalability within the same architecture family, while the RTAX2000D-1CQG896B trades SRAM-based flexibility for absolute configuration integrity-critical for fail-operational spacecraft subsystems.
Availability
XA6SLX25T-2FGG484Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload controllers, and deep space probe interfaces requiring stable component supply across extended mission lifecycles.
Supply support for XA6SLX25T-2FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on reliability, performance, and long-term support.
The XA6SLX25T-2FGG484Q belongs to AMD's Xilinx Aerospace Spartan-6 family, engineered specifically for radiation-hardened digital processing in space-constrained, mission-critical platforms.
FAQ
What radiation hardness specifications apply to the XA6SLX25T-2FGG484Q?
The XA6SLX25T-2FGG484Q is qualified to 100 krad(Si) total ionizing dose (TID) and exhibits single-event latch-up (SEL) immunity ≥ 75 MeV·cm²/mg. It meets QML-V Class V requirements per MIL-PRF-38535, including lot acceptance testing for radiation effects. These ratings are verified through standardized test protocols and documented in the official AMD XA6SLX25T-2FGG484Q qualification report.
Does the XA6SLX25T-2FGG484Q support in-system reconfiguration?
Yes, the XA6SLX25T-2FGG484Q supports partial and full reconfiguration via its ICAP (Internal Configuration Access Port) interface. This enables dynamic logic updates during operation-for example, switching between imaging algorithms or communication protocols-without resetting the entire device. The feature is implemented in hardware and validated under radiation-burdened conditions.
What is the maximum supported I/O voltage for XA6SLX25T-2FGG484Q banks?
The XA6SLX25T-2FGG484Q supports I/O voltages from 1.2 V to 3.3 V across eight independent banks. Each bank can be configured for a different VCCO voltage and I/O standard (e.g., LVDS, SSTL-18, HSTL-I). This allows direct interfacing with legacy and modern peripherals without level-shifting circuitry.
Is the XA6SLX25T-2FGG484Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25T-2FGG484Q is not pin-compatible with commercial Spartan-6 FPGAs. It uses a radiation-hardened process, different package construction (QML-V qualified FBGA), and modified I/O driver characteristics. PCB layout, thermal design, and power delivery must follow the XA6SLX25T-2FGG484Q-specific guidelines in the AMD XA6SLX25T-2FGG484Q Hardware User Guide.
What configuration modes does the XA6SLX25T-2FGG484Q support?
The XA6SLX25T-2FGG484Q supports Master Serial, Slave Serial, Master SelectMAP, and JTAG configuration modes. Configuration bitstreams may be loaded from external PROM, microcontroller, or host processor. All modes include CRC verification and INIT_B/ DONE status signaling to ensure robust startup in radiation environments.
XA6SLX25T-2FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX25T-2FGG484Q FAQ
1.How can I place an order for XA6SLX25T-2FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25T-2FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25T-2FGG484Q reliable?
The price and inventory of XA6SLX25T-2FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25T-2FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25T-2FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25T-2FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25T-2FGG484Q?
XA6SLX25T-2FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25T-2FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25T-2FGG484Q?
For technical support, including XA6SLX25T-2FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25T-2FGG484Q requirements.
6.How does Aetrix verify that XA6SLX25T-2FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25T-2FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25T-2FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25T-2FGG484Q?
All XA6SLX25T-2FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25T-2FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25T-2FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX25T-2FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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