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AMD XA6SLX25T-3FGG484Q
- Part No.:
- XA6SLX25T-3FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX25T-3FGG484Q.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,826
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Product details
Overview
XA6SLX25T-3FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -3 speed grade, and 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It integrates 92 DSP48E1 slices, 1,080 Kbits of block RAM, and supports LVDS, SSTL, and HSTL I/O standards for space-grade reconfigurable logic applications.
For engineers reviewing the XA6SLX25T-3FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include total logic capacity, radiation tolerance level (up to 100 krad(Si) TID), I/O voltage flexibility, configuration security options, and qualification per MIL-PRF-38535 Class V and QML-V standards.
Technical Context
The XA6SLX25T-3FGG484Q implements a fully static, 4-input LUT-based architecture with distributed RAM and shift register capability per CLB. It includes dedicated clock management tiles with DCMs supporting frequency synthesis, phase shifting, and duty cycle correction across multiple I/O banks.
Configuration occurs via SelectMAP, JTAG, or serial mode using on-chip startup circuitry and CRC error checking. Bitstream encryption and readback protection are supported through AES-256 and HMAC-SHA-256 mechanisms integrated into the configuration engine.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for system-level logic integration |
| Block RAM | 1,080 Kbits - enables local data buffering and FIFO implementation without external memory |
| DSP Slices | 92 × DSP48E1 - supports fixed-point multiply-accumulate operations at up to 250 MHz |
| I/O Standards | LVDS, SSTL-2, SSTL-18, HSTL-I, HSTL-II - allows direct interfacing with ADCs, memory, and FPGAs in mixed-voltage systems |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies under worst-case radiation and temperature conditions |
| TID Rating | 100 krad(Si) - qualified for long-duration missions in low-Earth orbit and deep-space environments |
| Qualification | MIL-PRF-38535 Class V / QML-V - ensures manufacturing traceability, screening, and reliability testing per space-grade requirements |
Pinout & Package
XA6SLX25T-3FGG484Q is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and Pb-free, RoHS-compliant finish. Thermal characteristics support operation from –55°C to +125°C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DIN | Configuration Data Input | Serial bitstream input for master serial mode; multiplexed with user I/O after configuration |
| PROGRAM_B | Active-Low Configuration Reset | Forces reinitialization of configuration logic and clears SRAM contents |
| INIT_B | Configuration Status Output | Open-drain signal indicating readiness for configuration or detection of CRC error |
| DONE | Configuration Completion Output | Signals successful loading and release of I/O pins from high-impedance state |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | Prevents single-event upsets from corrupting bitstream during orbital operation |
| AES-256 bitstream encryption | Protects intellectual property and prevents unauthorized device cloning or reverse engineering |
| Multi-bank I/O with independent voltage support | Enables simultaneous interface to 1.2 V, 1.5 V, 1.8 V, and 3.3 V peripherals without level shifters |
| DCM-based clock management | Delivers jitter-controlled clocks with ±1% duty cycle accuracy across temperature and radiation exposure |
| QML-V certified manufacturing flow | Guarantees lot traceability, burn-in, and parametric testing per space-grade reliability standards |
Applications
| Spacecraft Onboard Computer | Satellite Payload Controller |
|---|---|
Use Scenario: Real-time command execution and telemetry processing in LEO microsatellites. IC Role / Device Role / Timing Role: Reconfigurable system controller managing CPU interfaces, sensor buses, and downlink packet assembly. Use Value: Radiation tolerance eliminates need for triple modular redundancy overhead; configurable logic adapts to evolving mission software updates. | Use Scenario: Image sensor interface and compression pipeline control in Earth observation payloads. IC Role / Device Role / Timing Role: High-speed parallel I/O bridge between CMOS image sensors and JPEG2000 encoder ASICs. Use Value: LVDS-capable I/O banks synchronize pixel data at 120 MSPS; embedded block RAM buffers frame lines for real-time compression. |
| Deep Space Probe Interface | Radiation Monitoring System |
Use Scenario: Command decoding and fault-tolerant bus arbitration in interplanetary probe avionics. IC Role / Device Role / Timing Role: Dual-redundant bus controller implementing CCSDS packet protocol and MIL-STD-1553B physical layer timing. Use Value: Configurable logic implements custom error-correction encoders; -3 speed grade ensures deterministic latency under thermal cycling. | Use Scenario: In-situ TID and SEE monitoring using onboard dosimeters and particle detectors. IC Role / Device Role / Timing Role: Time-stamped event correlator synchronizing analog front-end triggers with spacecraft timecode. Use Value: DCM-generated 100 MHz clock maintains sub-10 ns timestamp resolution; AES-encrypted storage secures raw radiation logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7A200T-2FBG676Q | Artix-7 architecture; higher logic density (215K LC), 28 nm process, lower power, but rated only to 30 krad(Si) | Preferred for new LEO missions requiring higher performance and lower SWaP-C, where TID exposure is bounded | Select when radiation environment is well-characterized and <30 krad(Si) total dose is expected over mission lifetime |
| RTAX2000D-1CQG896B | RadHard anti-fuse FPGA; non-volatile, immune to SEU, but unprogrammable post-deployment and higher static power | Used in critical fault-masking systems where configuration permanence outweighs reconfigurability needs | Choose for ultra-high reliability in geosynchronous or nuclear survivability roles where field updates are unnecessary |
Compared with XA6SLX25T-3FGG484Q, the XA7A200T-2FBG676Q offers greater logic capacity and efficiency but reduced radiation tolerance, while the RTAX2000D-1CQG896B trades reprogrammability for absolute configuration integrity-making the XA6SLX25T-3FGG484Q optimal for mid-life-cycle missions needing both adaptability and proven 100 krad(Si) resilience.
Availability
XA6SLX25T-3FGG484Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload controllers, and radiation monitoring systems requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX25T-3FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened and high-reliability devices.
The XA Spartan-6 family was developed specifically for space-qualified reconfigurable logic applications requiring TID resilience, configuration security, and QML-V compliance without sacrificing design flexibility.
FAQ
What radiation tolerance level does the XA6SLX25T-3FGG484Q support?
The XA6SLX25T-3FGG484Q is qualified to 100 krad(Si) total ionizing dose (TID) per MIL-PRF-38535 Class V requirements. It also demonstrates single-event upset (SEU) immunity in configuration memory through hardened flip-flops and scrubbing support. This rating applies across the full operating temperature range and has been verified via proton and gamma irradiation testing per ESA/SCC basic specification 22900.
Does the XA6SLX25T-3FGG484Q support encrypted configuration?
Yes, the XA6SLX25T-3FGG484Q integrates hardware-accelerated AES-256 bitstream encryption and HMAC-SHA-256 authentication. Keys are stored in on-chip eFUSE and protected against readback. Configuration decryption occurs transparently during startup, ensuring IP protection and preventing unauthorized cloning or tampering of the XA6SLX25T-3FGG484Q bitstream.
What I/O standards are supported by the XA6SLX25T-3FGG484Q?
The XA6SLX25T-3FGG484Q supports LVDS, SSTL-2, SSTL-18, HSTL-I, and HSTL-II across its 328 user I/O pins. Each I/O bank operates independently with selectable VCCO voltages (1.2 V to 3.3 V), enabling direct connection to diverse peripherals including ADCs, memory interfaces, and legacy spacecraft buses without external level-shifting circuitry.
Is the XA6SLX25T-3FGG484Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX25T-3FGG484Q uses a unique pinout optimized for radiation-hardened operation and QML-V test access. While it shares the same FBGA-484 mechanical footprint as some commercial Spartan-6 devices, signal assignments-including configuration, clock, and boundary-scan pins-differ significantly. Migration requires PCB redesign and full functional validation of the XA6SLX25T-3FGG484Q interface.
What configuration modes does the XA6SLX25T-3FGG484Q support?
The XA6SLX25T-3FGG484Q supports master serial, slave serial, SelectMAP, and JTAG configuration modes. Startup sequence includes automatic CRC checking, fallback to fallback configuration upon error, and optional watchdog timer reset. All modes are radiation-hardened and validated under QML-V environmental stress screening protocols for the XA6SLX25T-3FGG484Q.
XA6SLX25T-3FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX25T-3FGG484Q FAQ
1.How can I place an order for XA6SLX25T-3FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX25T-3FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX25T-3FGG484Q reliable?
The price and inventory of XA6SLX25T-3FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX25T-3FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX25T-3FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX25T-3FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX25T-3FGG484Q?
XA6SLX25T-3FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX25T-3FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX25T-3FGG484Q?
For technical support, including XA6SLX25T-3FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX25T-3FGG484Q requirements.
6.How does Aetrix verify that XA6SLX25T-3FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX25T-3FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX25T-3FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX25T-3FGG484Q?
All XA6SLX25T-3FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX25T-3FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX25T-3FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX25T-3FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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