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AMD XA6SLX4-2CSG225I
- Part No.:
- XA6SLX4-2CSG225I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX4-2CSG225I.pdf
- Description:
- IC FPGA 132 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,329
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Product details
Overview
XA6SLX4-2CSG225I from AMD is a radiation-tolerant Spartan-6 FPGA with 3,840 logic cells, 18 Kbits of block RAM, and support for LVDS I/O at up to 1,050 Mbps. It operates across –55°C to +125°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX4-2CSG225I datasheet, pinout, applications, or equivalent options, key selection criteria include total logic capacity, radiation tolerance level (up to 100 krad(Si)), extended temperature operation, and LVDS I/O performance in harsh environments.
Technical Context
The XA6SLX4-2CSG225I implements a 45 nm triple-oxide process with hardened configuration memory and SEU mitigation via built-in scrubbing logic. It integrates six 18×18 multipliers and supports DDR2 SDRAM interfaces up to 400 MHz.
Configuration occurs via Master Serial or Slave SelectMAP modes using external PROM or processor-controlled interface. JTAG boundary-scan is IEEE 1149.1-compliant and supports in-system programming and verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,840 - provides sufficient resources for small-to-medium control and interface logic in radiation-hardened systems |
| Block RAM | 18 Kbits - enables local data buffering and state storage without external memory |
| LVDS Data Rate | 1,050 Mbps - supports high-speed sensor or telemetry link interfacing |
| Operating Temp | –55°C to +125°C - certified for deployment in orbital and deep-space thermal environments |
| Radiation Tolerance | 100 krad(Si) TID - meets ESA/SCC basic qualification for LEO/MEO missions |
| I/O Standards | LVCMOS, LVTTL, LVDS, SSTL - allows interoperability with legacy and modern space-grade peripherals |
Pinout & Package
XA6SLX4-2CSG225I is housed in a 225-pin Ceramic Column Grid Array (CSG) package with 172 user I/Os, 8 dedicated configuration pins, and thermal vias aligned to the die center for enhanced heat dissipation in vacuum-constrained environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply - must be decoupled locally per bank for signal integrity in mixed-voltage designs |
| D2 | IO_L0N_0 | Differential input pair - used for clock or data reception in LVDS links requiring sub-ns skew control |
| E3 | IO_L0P_0 | Differential input pair - paired with D2; requires matched trace length and controlled impedance routing |
| A1 | PROG_B | Active-low configuration reset - initiates reconfiguration sequence when asserted asynchronously |
| B2 | INIT_B | Open-drain status output - signals configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Triple-oxide 45 nm process | Reduces leakage current and improves parametric stability over temperature and radiation exposure |
| SEU scrubbing logic | Enables autonomous correction of single-event upsets in configuration memory without host intervention |
| Hardened configuration memory | Prevents bit corruption from ionizing radiation, eliminating need for external CRC validation circuitry |
| DDR2 controller support | Allows direct connection to radiation-tolerant DDR2 SDRAM up to 400 MHz, reducing system-level timing complexity |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Logic |
|---|---|
Use Scenario: Real-time collection and formatting of sensor telemetry (gyro, star tracker, magnetometer) before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic finite-state machines and packetization logic with cycle-accurate timing. Use Value: Radiation-hardened configuration memory ensures uninterrupted operation during solar particle events without reconfiguration. | Use Scenario: Closed-loop processing of attitude determination outputs and generation of reaction wheel or magnetorquer drive commands. IC Role / Device Role / Timing Role: Timing-critical control core implementing PID algorithms with fixed-point arithmetic and sub-microsecond loop latency. Use Value: 100 krad(Si) TID rating and –55°C to +125°C operation enable reliable execution in geostationary orbit thermal cycles. |
| Spacecraft Command Decoding | Inter-satellite Link Interface |
Use Scenario: Secure decoding and validation of encrypted uplinked commands prior to execution by on-board subsystems. IC Role / Device Role / Timing Role: Programmable logic implementing AES-128 decryption, CRC checking, and command dispatch with deterministic latency. Use Value: LVDS I/O at 1,050 Mbps supports high-throughput command stream ingestion while maintaining signal integrity over long harness runs. | Use Scenario: Physical layer bridging between spacecraft in formation-flying constellations using differential serial protocols. IC Role / Device Role / Timing Role: Serializer/deserializer interface managing clock/data recovery and frame alignment for inter-platform synchronization. Use Value: Six embedded 18×18 multipliers enable real-time phase error correction and Doppler compensation without external DSP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7S6-2CSG324I | Higher logic density (6,000 LUTs), 28 nm process, higher static power, supports PCIe Gen1 | Required for larger control firmware or integrated soft-CPU implementations | Select when additional logic resources or Gen1 PCIe endpoint capability is needed; board redesign required due to CSG324 footprint |
| RTAX2000D | Rad-tolerant antifuse-based FPGA, no configuration memory vulnerability, lower logic density (1,920 gates), no dynamic reconfiguration | Suitable for immutable, ultra-high-reliability boot logic only | Choose for mission-critical boot ROM replacement where zero SEU risk outweighs flexibility trade-off |
Compared with XA7S6-2CSG324I and RTAX2000D, the XA6SLX4-2CSG225I offers optimal balance of radiation tolerance, reconfigurability, and thermal margin for mid-complexity space payloads-without requiring PCIe or antifuse-level assurance.
Availability
XA6SLX4-2CSG225I is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spacecraft attitude control systems requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX4-2CSG225I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on reliability, longevity, and radiation resilience.
The XA Spartan-6 family was designed specifically for space-qualified digital systems requiring reprogrammable logic, deterministic timing, and guaranteed operation under total ionizing dose and single-event effects.
FAQ
What is the maximum allowable junction temperature for XA6SLX4-2CSG225I?
The XA6SLX4-2CSG225I has a maximum junction temperature of +135°C under steady-state operation. This specification is validated across its full military-grade temperature range (–55°C to +125°C ambient) and accounts for internal power dissipation in vacuum conditions. Thermal design must ensure that the ceramic CSG package maintains adequate heat path to the PCB or cold plate to avoid exceeding this limit during peak activity.
Does XA6SLX4-2CSG225I support partial reconfiguration?
No, the XA6SLX4-2CSG225I does not support partial reconfiguration. Its configuration architecture is based on full-bitstream loading via Master Serial or SelectMAP modes. While it includes SEU scrubbing logic for runtime correction, the device requires complete reconfiguration to modify logic functionality. This limitation is inherent to the Spartan-6 architecture and applies uniformly across all XA6SLX variants including the XA6SLX4-2CSG225I.
What configuration memory technology is used in XA6SLX4-2CSG225I?
The XA6SLX4-2CSG225I uses SRAM-based configuration memory hardened through layout and process techniques to withstand up to 100 krad(Si) total ionizing dose. Unlike antifuse or flash-based FPGAs, it relies on external nonvolatile memory (e.g., rad-tolerant PROM) to store the bitstream, which is loaded at power-up. The XA6SLX4-2CSG225I itself contains no embedded nonvolatile configuration storage.
Can XA6SLX4-2CSG225I operate with a single 1.2 V supply?
No, the XA6SLX4-2CSG225I requires three separate supply rails: VCCINT = 1.2 V (core), VCCAUX = 2.5 V (auxiliary logic and JTAG), and VCCO = 1.8/2.5/3.3 V (I/O bank dependent). Each rail must be independently regulated and decoupled. Using only a 1.2 V supply will prevent configuration and cause functional failure. The XA6SLX4-2CSG225I datasheet specifies strict tolerances and sequencing requirements for all three supplies.
Is JTAG boundary-scan supported on XA6SLX4-2CSG225I?
Yes, XA6SLX4-2CSG225I fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, verification, and test. All four standard TAP signals (TCK, TMS, TDI, TDO) are implemented, and the device supports IDCODE, BYPASS, SAMPLE/PRELOAD, and EXTEST instructions. This capability is retained across the full operating temperature and radiation environment specified for the XA6SLX4-2CSG225I.
XA6SLX4-2CSG225I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 300
- Number of Logic Elements/Cells:
- 3840
- Total RAM Bits:
- 221184
- Number of I/O:
- 132
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 225-CSPBGA (13x13)
XA6SLX4-2CSG225I FAQ
1.How can I place an order for XA6SLX4-2CSG225I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX4-2CSG225I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX4-2CSG225I reliable?
The price and inventory of XA6SLX4-2CSG225I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX4-2CSG225I is usually 5 days.
3.What payment methods are accepted for XA6SLX4-2CSG225I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX4-2CSG225I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX4-2CSG225I?
XA6SLX4-2CSG225I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX4-2CSG225I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX4-2CSG225I?
For technical support, including XA6SLX4-2CSG225I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX4-2CSG225I requirements.
6.How does Aetrix verify that XA6SLX4-2CSG225I is sourced from the original manufacturer or authorized distributors?
All XA6SLX4-2CSG225I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX4-2CSG225I meets industry standards.
7.What is the process for return or replacement of XA6SLX4-2CSG225I?
All XA6SLX4-2CSG225I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX4-2CSG225I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX4-2CSG225I part is unused and in its original packaging.
Return procedure for XA6SLX4-2CSG225I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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