AMD XA6SLX45-2FGG484I
- Part No.:
- XA6SLX45-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX45-2FGG484I.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,387
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XA6SLX45-2FGG484I from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and support for LVDS I/O at up to 1.25 Gbps. It operates across -40°C to +100°C and is qualified for space applications including satellite command/data handling and payload interface control.
For engineers reviewing the XA6SLX45-2FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include total logic capacity, radiation tolerance level (up to 100 krad(Si)), I/O voltage flexibility (1.2 V to 3.3 V), and extended temperature operation without derating.
Technical Context
The XA6SLX45-2FGG484I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48E slices supporting 18×25-bit multiply-accumulate operations. It includes dual 12-bit ADCs with 1 MSPS sampling rate and dedicated clock management tiles with DCMs and PLLs.
Configuration is performed via serial NOR flash or JTAG, with SEU mitigation using built-in EDAC on configuration memory and optional user-implemented TMR logic. The device supports SelectIO standards including LVCMOS, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - usable for complex state machines, protocol stacks, or real-time signal processing pipelines |
| Block RAM | 2.1 Mb - supports dual-port buffering, FIFOs, or lookup tables for telemetry processing |
| Max I/O Speed | 1.25 Gbps LVDS - enables high-speed sensor data capture or inter-FPGA links |
| Operating Temp | -40°C to +100°C - rated for uncooled operation in LEO satellite payloads |
| Radiation Tolerance | 100 krad(Si) TID - qualified for long-duration missions beyond low Earth orbit |
| ADC Channels | 2 × 12-bit @ 1 MSPS - provides onboard health monitoring without external converters |
Pinout & Package
XA6SLX45-2FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 29 mm × 29 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant finish. Thermal pad exposed on underside for enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| K1 | CLKIN_0 | Dedicated global clock input - routed through low-skew network to all clock regions |
| T1 | M0 | Configuration mode select - sets boot source (SPI flash or JTAG) |
| V2 | INIT_B | Open-drain status output - indicates configuration completion or error |
| W3 | PROGRAM_B | Active-low reset - forces reconfiguration and clears internal state |
| Y4 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic and transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | EDAC protection on bitstream storage prevents single-event upsets during orbital operation |
| Dual 12-bit ADCs | On-chip analog monitoring eliminates need for external ADCs in power or thermal sensing |
| SelectIO technology | Per-bank I/O voltage and standard selection enables mixed-voltage board design |
| DCM and PLL clock managers | Supports jitter reduction, frequency synthesis, and phase alignment for synchronous interfaces |
| Configurable logic fabric | 6-LUT architecture allows efficient implementation of both combinatorial and sequential logic |
Applications
| Spacecraft Onboard Computer | Satellite Payload Interface |
|---|---|
Use Scenario: Real-time command decoding, telemetry formatting, and bus arbitration in CubeSat-class avionics. IC Role / Device Role / Timing Role: Central programmable logic unit managing MIL-STD-1553, CAN, and UART interfaces with deterministic latency. Use Value: Radiation tolerance and extended temperature range eliminate need for shielding or thermal control subsystems. | Use Scenario: High-speed image data aggregation from CMOS sensors and compression preprocessing before downlink. IC Role / Device Role / Timing Role: Data path controller with embedded FIFOs and parallel-to-serial conversion for SpaceWire or LVDS links. Use Value: 1.25 Gbps LVDS I/O supports full-frame 10-bit sensor output at 60 fps without external serializers. |
| Launch Vehicle Telemetry Unit | Radiation Monitoring System |
Use Scenario: Sensor fusion and fault detection during ascent phase using accelerometers, gyros, and pressure transducers. IC Role / Device Role / Timing Role: Time-critical processing node with deterministic interrupt response under vibration and EMI stress. Use Value: -40°C to +100°C rating ensures stable operation during cryogenic fuel loading and aerodynamic heating. | Use Scenario: In-situ TID and SEU event logging using on-die dosimeters and configuration scrubbing counters. IC Role / Device Role / Timing Role: Autonomous radiation effects monitor with self-checking logic and nonvolatile event storage. Use Value: Integrated 100 krad(Si) qualification and EDAC enable direct deployment without external hardening components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with lower logic density (1.7K gates), no embedded ADC, and fixed I/O voltage | Targeted for simpler timing-critical functions like sequencers; lacks programmable DSP blocks | Prefer XA6SLX45-2FGG484I when algorithmic processing or mixed-signal integration is required |
| XA7A200T-2FBG676I | Higher logic count (202K LUTs), 28 nm process, 50 krad(Si) TID rating, no on-die ADC | Used in newer LEO platforms where higher compute density offsets reduced radiation margin | Choose XA6SLX45-2FGG484I for missions requiring >75 krad(Si) margin and onboard analog monitoring |
Compared with RTAX2000D and XA7A200T-2FBG676I, the XA6SLX45-2FGG484I uniquely balances mid-density programmability, radiation hardness, and integrated analog capability-making it optimal for cost-constrained, long-life missions where ADC offload and TID margin are critical.
Availability
XA6SLX45-2FGG484I is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload interfaces, and launch vehicle telemetry units requiring stable component supply across extended mission lifetimes.
Supply support for XA6SLX45-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance adaptive computing solutions for aerospace, defense, and industrial applications, with heritage in radiation-tolerant programmable logic dating to the early 2000s.
The XA6SLX45-2FGG484I belongs to the Spartan-6 XA family, engineered specifically for space-qualified reconfigurable computing where reliability, power efficiency, and mixed-signal integration are mandatory.
FAQ
What is the total usable logic capacity of the XA6SLX45-2FGG484I?
The XA6SLX45-2FGG484I contains 43,661 logic cells, each composed of a 6-input LUT and associated flip-flop. This capacity supports implementations such as triple-modular-redundant controllers, multi-channel communication stacks, or real-time image preprocessing pipelines. The XA6SLX45-2FGG484I delivers deterministic timing closure up to 300 MHz for synchronous logic paths.
Does the XA6SLX45-2FGG484I include on-chip analog-to-digital conversion capability?
Yes, the XA6SLX45-2FGG484I integrates two independent 12-bit analog-to-digital converters, each capable of 1 MSPS sampling. These ADCs support internal reference voltages and can monitor external sensor signals such as power rail voltages or thermal diodes. The XA6SLX45-2FGG484I uses these converters for autonomous health monitoring without requiring external ADC components.
What radiation tolerance specifications apply to the XA6SLX45-2FGG484I?
The XA6SLX45-2FGG484I is qualified to 100 krad(Si) total ionizing dose (TID) and features EDAC-protected configuration memory to mitigate single-event upsets. It undergoes lot-specific radiation testing per ESA/SCC basic specification 22900. The XA6SLX45-2FGG484I does not require external scrubbing controllers for configuration memory integrity in typical LEO or MEO orbits.
Which I/O standards are supported by the XA6SLX45-2FGG484I?
The XA6SLX45-2FGG484I supports LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards across its 316 user I/O pins. Each I/O bank operates independently at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. The XA6SLX45-2FGG484I achieves 1.25 Gbps differential data rates in LVDS mode with programmable termination and slew rate control.
What configuration methods are supported by the XA6SLX45-2FGG484I?
The XA6SLX45-2FGG484I supports master SPI, slave serial, and JTAG configuration modes. Configuration bitstream can be loaded from external serial NOR flash or boundary-scan tools. The XA6SLX45-2FGG484I includes an INIT_B pin to signal configuration success or failure and PROGRAM_B to initiate reconfiguration without power cycle.
XA6SLX45-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX45-2FGG484I FAQ
1.How can I place an order for XA6SLX45-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45-2FGG484I reliable?
The price and inventory of XA6SLX45-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45-2FGG484I is usually 5 days.
3.What payment methods are accepted for XA6SLX45-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45-2FGG484I?
XA6SLX45-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45-2FGG484I?
For technical support, including XA6SLX45-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45-2FGG484I requirements.
6.How does Aetrix verify that XA6SLX45-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XA6SLX45-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45-2FGG484I meets industry standards.
7.What is the process for return or replacement of XA6SLX45-2FGG484I?
All XA6SLX45-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45-2FGG484I part is unused and in its original packaging.
Return procedure for XA6SLX45-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XA6SLX45-2FGG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

