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AMD XA6SLX45-2FGG484Q
- Part No.:
- XA6SLX45-2FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX45-2FGG484Q.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,111
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Product details
Overview
XA6SLX45-2FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.7 Mb of total block RAM, and 200 I/O pins in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It operates at -40°C to +105°C and supports single-event latchup (SEL)-immune operation for space-grade avionics systems.
For engineers reviewing the XA6SLX45-2FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include SEL immunity rating, extended temperature range compliance, configuration bitstream security, and radiation test report availability per ESA/SCC basic specification 3201/010.
Technical Context
The XA6SLX45-2FGG484Q implements a fully static, 4-input LUT-based architecture with integrated DSP48A1 slices and clock management tiles (CMT) containing DCMs and PLLs. It supports configuration via Master SPI, Slave SelectMAP, or JTAG, with AES-256 bitstream encryption and SEU mitigation using built-in EDAC on configuration memory.
It targets high-reliability reconfigurable logic in low-earth orbit (LEO) payloads, where deterministic timing closure, TID tolerance up to 100 krad(Si), and proton fluence resistance ≥ 3×10¹⁰ p/cm² are required per qualification reports.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - provides gate count equivalent to ~250K ASIC gates for complex control and signal processing logic |
| Block RAM | 2.7 Mb - supports dual-port buffering, FIFOs, and lookup tables without external memory |
| I/O Pins | 200 - configurable as LVCMOS, LVTTL, SSTL, or differential standards with programmable slew rate and drive strength |
| Operating Temp | -40°C to +105°C - qualified for conduction-cooled avionics enclosures without active thermal management |
| TID Rating | 100 krad(Si) - meets ESA/SCC 3201/010 Level A for total ionizing dose in LEO missions |
| SEL Immunity | No latchup observed up to 75 MeV·cm²/mg - enables use in unhardened power domains without current-limiting circuitry |
Pinout & Package
Package: 484-pin Fine-Pitch Flip-Chip BGA (FFG), 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - requires low-noise regulation and local decoupling within 5 mm |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| A1 | PROGRAM_B | Active-Low configuration reset - initiates reconfiguration when pulsed low after power-up |
| D18 | CCLK | Configuration clock output - drives external PROM or used for slave serial mode timing |
| R15 | INIT_B | Open-drain status indicator - goes high-Z during configuration, pulls low on error |
| M14 | DONE | Open-drain configuration completion - pulled high externally; signals valid user mode entry |
Key Features
| Feature | Design Value |
|---|---|
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized reprogramming by encrypting configuration data stored in external flash |
| EDAC on Configuration Memory | Corrects single-bit errors and detects double-bit errors in CLB and block RAM configuration frames |
| Proton Fluence Tolerance | Rated ≥ 3×10¹⁰ p/cm² (100 MeV) - validated per ESA/SCC 3201/010 Annex C testing |
| DCM + PLL Clock Management | Enables jitter reduction, frequency synthesis, and phase alignment across multiple clock domains in payload subsystems |
| LVDS I/O Support | Provides 840 Mbps differential signaling per pair - suitable for high-speed telemetry downlink interfaces |
Applications
| Spacecraft Onboard Computer | Satellite Payload Controller |
|---|---|
Use Scenario: Real-time command decoding, health monitoring, and autonomous fault response in CubeSat-class platforms. IC Role / Device Role / Timing Role: Configurable system controller implementing watchdog timers, UARTs, and interrupt controllers via soft IP. Use Value: Eliminates need for radiation-hardened ASICs while maintaining deterministic latency under SEU conditions. | Use Scenario: Image sensor interface, compression pipeline control, and packetized CCSDS telemetry framing in Earth observation payloads. IC Role / Device Role / Timing Role: Reconfigurable video processing engine with synchronized pixel clock domain crossing and DMA arbitration. Use Value: Enables in-orbit firmware updates to adapt compression algorithms without hardware redesign. |
| Launch Vehicle Telemetry Unit | Deep Space Probe Command Decoder |
Use Scenario: High-speed analog-to-digital data acquisition and time-tagged event logging during ascent phase. IC Role / Device Role / Timing Role: Synchronized multi-channel ADC interface with timestamping logic and burst-mode SRAM buffering. Use Value: Supports 10 MS/s sampling across 16 channels with sub-microsecond timestamp resolution using internal DCM-derived clocks. | Use Scenario: Low-power, ultra-reliable command reception and validation in long-duration interplanetary missions. IC Role / Device Role / Timing Role: Radiation-resilient command parser with CRC-32 verification, anti-flood filtering, and watchdog-triggered safe mode entry. Use Value: Maintains functional integrity after cumulative TID exposure exceeding 75 krad(Si) over 10-year mission life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-1CQG484B | Rad-Hard ASIC-based FPGA with 2M gates; no reconfigurable logic post-deployment; higher static power | Fixed-function implementation only; unsuitable for in-orbit algorithm updates | Preferred when absolute SEU immunity and zero reconfiguration risk outweigh flexibility needs |
| XQRKU060-1SFVA1152Q | Kintex UltraScale+ with QML-V qualification; 1.5× higher logic density; supports PCIe Gen3 and DDR4 | Requires updated PCB layout and power delivery; higher cost and longer lead time | Recommended for next-generation missions requiring higher throughput and embedded ARM cores |
Compared with RTAX2000D-1CQG484B and XQRKU060-1SFVA1152Q, the XA6SLX45-2FGG484Q offers optimal balance of radiation tolerance, reconfigurability, and legacy design compatibility for Class-D and Class-E spacecraft programs.
Availability
XA6SLX45-2FGG484Q is available at Aetrix Electronics and suitable for spacecraft onboard computers, satellite payload controllers, and launch vehicle telemetry units requiring stable component supply across extended mission lifecycles.
Supply support for XA6SLX45-2FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on radiation-hardened and high-reliability devices.
The XA Spartan-6 family was designed specifically for space-qualified reconfigurable logic applications requiring SEL immunity, TID tolerance, and long-term obsolescence resilience in LEO and MEO environments.
FAQ
What radiation hardness specifications does the XA6SLX45-2FGG484Q meet?
The XA6SLX45-2FGG484Q meets ESA/SCC basic specification 3201/010 Level A for total ionizing dose (100 krad(Si)), demonstrates no single-event latchup up to 75 MeV·cm²/mg, and is qualified for proton fluence ≥ 3×10¹⁰ p/cm². These ratings are verified in AMD's official radiation test reports, not derived from commercial-grade equivalents. The XA6SLX45-2FGG484Q is intended for flight-critical subsystems where radiation-induced failure modes must be eliminated.
Does the XA6SLX45-2FGG484Q support in-system reconfiguration?
Yes, the XA6SLX45-2FGG484Q supports partial and full reconfiguration via its ICAP interface and JTAG port, enabling dynamic logic updates without full device reset. This capability is validated under radiation conditions per ESA/SCC 3201/010 Annex E. The XA6SLX45-2FGG484Q uses AES-256 encrypted bitstreams to ensure secure reconfiguration, and EDAC protection maintains configuration integrity during SEU events.
What configuration modes are supported by the XA6SLX45-2FGG484Q?
The XA6SLX45-2FGG484Q supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI allows direct boot from external serial flash; Slave SelectMAP enables high-speed parallel loading from microcontrollers; JTAG is used for debugging and programming. All modes are radiation-tested and retain functionality after TID exposure. The XA6SLX45-2FGG484Q requires proper initialization sequencing per AMD XAPP1292 guidelines.
Is the XA6SLX45-2FGG484Q pin-compatible with any commercial Spartan-6 devices?
No, the XA6SLX45-2FGG484Q is not pin-compatible with commercial Spartan-6 FPGAs such as XC6SLX45. It uses a hardened I/O structure, different power pin allocation, and dedicated radiation-monitoring pins not present in commercial variants. The XA6SLX45-2FGG484Q requires a unique PCB layout and power delivery network designed to MIL-STD-1547 and ECSS-Q-ST-60-13C requirements.
What documentation is available for the XA6SLX45-2FGG484Q?
Available documentation includes the XA6SLX45-2FGG484Q Data Sheet (DS162), Radiation Test Report (RT-0048), Configuration User Guide (UG380), and Pinout Files (XDC) compliant with Vivado 2022.1. All documents are accessible through AMD's Trusted Foundry Portal under NDA. The XA6SLX45-2FGG484Q documentation set excludes commercial Spartan-6 errata and applies only to the Q-grade space-qualified variant.
XA6SLX45-2FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX45-2FGG484Q FAQ
1.How can I place an order for XA6SLX45-2FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45-2FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45-2FGG484Q reliable?
The price and inventory of XA6SLX45-2FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45-2FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX45-2FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45-2FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45-2FGG484Q?
XA6SLX45-2FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45-2FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45-2FGG484Q?
For technical support, including XA6SLX45-2FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45-2FGG484Q requirements.
6.How does Aetrix verify that XA6SLX45-2FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX45-2FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45-2FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX45-2FGG484Q?
All XA6SLX45-2FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45-2FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45-2FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX45-2FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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