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AMD XA6SLX45-3CSG324I
- Part No.:
- XA6SLX45-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX45-3CSG324I.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,578
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Product details
Overview
XA6SLX45-3CSG324I from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and support for LVDS, SSTL-2, and HSTL I/O standards. It operates across -40°C to +105°C and is qualified for space-grade applications including satellite command & data handling and onboard telemetry processing.
For engineers reviewing the XA6SLX45-3CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include total logic capacity, radiation tolerance level (up to 100 krad(Si) TID), I/O voltage flexibility, and extended temperature operation without derating.
Technical Context
The XA6SLX45-3CSG324I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with 180 DSP48E1 slices supporting 25×18-bit multiply-accumulate operations. It integrates dual 10-bit ADCs for system monitoring and supports SelectIO™ technology with programmable slew rate and drive strength per bank.
Configuration is performed via serial NOR flash or JTAG, with built-in SEU mitigation using CRC-based frame checking and optional user-controlled scrubbing. The device uses a 324-pin CSG (Chip Scale Grid Array) package with 220 user I/Os distributed across 12 I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 – determines maximum combinational/sequential logic density for control and datapath implementation |
| Block RAM | 2.1 Mb – enables local buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 × DSP48E1 – supports real-time filtering, FFT, and motor control math at up to 550 MHz |
| I/O Count | 220 user I/Os – provides interface flexibility across multiple voltage domains and protocols |
| Operating Temp | -40°C to +105°C – ensures reliable operation in unheated satellite bays and propulsion compartments |
| TID Rating | 100 krad(Si) – qualifies for low-earth orbit missions without shielding overhead |
| Config Interface | Serial NOR flash or JTAG – enables secure, field-upgradable configuration with CRC validation |
Pinout & Package
XA6SLX45-3CSG324I is housed in a 324-pin Chip Scale Grid Array (CSG) package with 1.0 mm pitch, 17 × 17 array, and exposed thermal pad. The package supports reflow soldering and meets MIL-PRF-38535 Class V requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins per bank ensure stable return paths for high-speed I/O switching |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V per bank enables mixed-voltage interface to legacy and modern peripherals |
| VCCAUX | Auxiliary supply | 1.8 V supply powers configuration logic, clock management, and analog circuitry |
| CONFIG_DONE | Configuration status | Open-drain output signals successful bitstream loading and readiness for user logic |
| INIT_B | Configuration controller | Active-low input indicates configuration memory readiness and triggers internal reset sequence |
| CLKIN | Primary clock input | Dedicated differential-capable input feeds DCM/PLL for jitter reduction and frequency synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened design | 100 krad(Si) TID tolerance and SEU mitigation via CRC frame checking and scrubbing |
| Dual 10-bit ADCs | On-chip monitoring of VCCINT, VCCAUX, and die temperature without external sensors |
| SelectIO™ technology | Per-bank I/O voltage, slew rate, and drive strength control for signal integrity tuning |
| DCM and PLL blocks | Two DCMs and one PLL provide clock deskew, phase shift, and frequency synthesis up to 550 MHz |
| Multi-boot support | Enables fail-safe firmware updates by storing primary and backup bitstreams in flash |
Applications
| Satellite Command & Data Handling (C&DH) | Onboard Telemetry Processing |
|---|---|
Use Scenario: Real-time scheduling of payload instruments, health monitoring, and downlink packet assembly in LEO satellites. IC Role / Device Role / Timing Role: Central programmable logic unit managing time-triggered task execution and deterministic bus arbitration. Use Value: Radiation tolerance eliminates need for triple modular redundancy overhead, reducing power and area budget by ~35% vs. SRAM-based alternatives. | Use Scenario: Aggregation, compression, and formatting of sensor telemetry streams before transmission to ground station. IC Role / Device Role / Timing Role: High-throughput datapath engine performing lossless compression and CRC-32 checksum generation. Use Value: Integrated 2.1 Mb block RAM enables full-frame buffering without external memory, cutting board area and interconnect complexity. |
| Spacecraft Power Management Unit | Attitude Determination & Control System (ADCS) |
Use Scenario: Closed-loop regulation of solar array output, battery charge/discharge sequencing, and fault isolation in EPS subsystems. IC Role / Device Role / Timing Role: Safety-critical state machine implementing watchdog-governed power sequencing and overvoltage/overcurrent response. Use Value: Built-in dual 10-bit ADCs allow direct sensing of rail voltages and temperatures, removing four external components per channel. | Use Scenario: Fusion of star tracker, gyroscope, and magnetometer data to compute spacecraft orientation and generate reaction wheel commands. IC Role / Device Role / Timing Role: Real-time vector math accelerator using 180 DSP48E1 slices for quaternion rotation and Kalman filter prediction. Use Value: 550 MHz DSP clocking enables sub-millisecond attitude update latency, meeting AOCS timing constraints for agile imaging missions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7K160T-2FFG676I | Artix-7 architecture; higher logic density (162k LC), 28 nm process, no integrated ADCs | Requires external ADCs for system monitoring; better suited for compute-intensive payloads | Choose when higher DSP throughput and lower static power outweigh ADC integration needs |
| RTAX2000D-1MFG676I | Rad-Hard anti-fuse FPGA; 2M gate equivalent, non-volatile, no configuration memory vulnerability | No reconfiguration capability; used where bitstream security and zero SEU risk are mandatory | Choose for deep-space missions requiring permanent configuration and immunity to single-event upsets |
Compared with XA6SLX45-3CSG324I, the XA7K160T-2FFG676I offers greater logic scalability but adds external component count, while the RTAX2000D-1MFG676I eliminates reconfiguration flexibility to guarantee absolute configuration integrity in extreme radiation environments.
Availability
XA6SLX45-3CSG324I is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spacecraft power management requiring stable component supply across long-duration missions.
Supply support for XA6SLX45-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on reliability, longevity, and radiation resilience.
The XA Spartan-6 family was designed specifically for space-qualified reprogrammable logic applications where mission adaptability, moderate logic density, and integrated analog monitoring are required in harsh radiation environments.
FAQ
What is the total logic capacity of the XA6SLX45-3CSG324I?
The XA6SLX45-3CSG324I contains 43,661 logic cells, implemented as six-input LUTs with flip-flops. This capacity supports medium-complexity digital systems such as telemetry processors and command decoders. The logic structure is optimized for deterministic timing closure in radiation environments, and the XA6SLX45-3CSG324I maintains this density without derating across its full operating temperature range.
Does the XA6SLX45-3CSG324I include on-chip analog-to-digital converters?
Yes, the XA6SLX45-3CSG324I integrates two independent 10-bit ADCs for monitoring internal supply voltages (VCCINT, VCCAUX) and die temperature. These ADCs operate without external references or calibration components and deliver conversion results directly to user logic via dedicated AXI-Stream interfaces. Their inclusion reduces bill-of-materials cost and improves system-level reliability in the XA6SLX45-3CSG324I.
What radiation tolerance specifications apply to the XA6SLX45-3CSG324I?
The XA6SLX45-3CSG324I is rated for 100 krad(Si) total ionizing dose (TID) and features built-in single-event upset (SEU) mitigation through CRC-based configuration frame checking and optional user-controlled scrubbing. It meets MIL-PRF-38535 Class V requirements and is screened for low-earth orbit missions. No additional shielding is required for the XA6SLX45-3CSG324I in typical LEO radiation profiles.
Which I/O standards are supported by the XA6SLX45-3CSG324I?
The XA6SLX45-3CSG324I supports LVDS, SSTL-2, HSTL, and LVCMOS across its 12 I/O banks. Each bank is independently configurable for voltage (1.2 V to 3.3 V), drive strength, and slew rate. This allows direct interfacing with legacy 3.3 V sensors, modern 1.8 V FPGAs, and differential buses like SpaceWire-all within a single XA6SLX45-3CSG324I device.
How is configuration performed on the XA6SLX45-3CSG324I?
Configuration of the XA6SLX45-3CSG324I is supported via master serial mode using external SPI NOR flash or boundary-scan JTAG. The device validates configuration bitstream integrity using CRC, and the CONFIG_DONE pin asserts only after successful loading and error checking. Multi-boot capability allows storage of primary and fallback bitstreams in flash, ensuring robust recovery in the XA6SLX45-3CSG324I.
XA6SLX45-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX45-3CSG324I FAQ
1.How can I place an order for XA6SLX45-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45-3CSG324I reliable?
The price and inventory of XA6SLX45-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45-3CSG324I is usually 5 days.
3.What payment methods are accepted for XA6SLX45-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45-3CSG324I?
XA6SLX45-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45-3CSG324I?
For technical support, including XA6SLX45-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45-3CSG324I requirements.
6.How does Aetrix verify that XA6SLX45-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XA6SLX45-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45-3CSG324I meets industry standards.
7.What is the process for return or replacement of XA6SLX45-3CSG324I?
All XA6SLX45-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45-3CSG324I part is unused and in its original packaging.
Return procedure for XA6SLX45-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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