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AMD XA6SLX45-3CSG324Q
- Part No.:
- XA6SLX45-3CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX45-3CSG324Q.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,339
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Product details
Overview
XA6SLX45-3CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 186 user I/Os in a 324-pin CSGA package; designed for space-grade reconfigurable computing in low-earth orbit satellite payloads and onboard data processing systems.
For engineers reviewing the XA6SLX45-3CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include total RAM depth, single-event upset (SEU) mitigation capability, I/O voltage support (1.2 V/1.8 V/2.5 V/3.3 V), and qualification to QML-V Class V standards.
Technical Context
The XA6SLX45-3CSG324Q implements a fully radiation-hardened-by-process (RHBP) architecture with triple modular redundancy (TMR) in configuration memory and logic fabric, and includes built-in SEU detection and correction circuitry for configuration frames. It supports JTAG boundary-scan testing per IEEE 1149.1 and features dedicated clock management tiles with DCMs for jitter reduction.
This device integrates 64 DSP48E1 slices for arithmetic-intensive operations, supports LVDS and RSDS signaling at up to 1.2 Gbps per differential pair, and provides programmable I/O standards compliant with space-grade interface requirements including MIL-STD-1553 and SpaceWire physical layer timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational and sequential logic capacity for on-orbit reconfiguration |
| Block RAM | 2.1 Mb - enables local buffering of telemetry, image, or sensor data without external memory |
| User I/Os | 186 - supports multi-interface payload connectivity including SpaceWire, MIL-STD-1553, and GPIO |
| Configuration Memory | SEU-hardened SRAM with TMR and CRC-based frame error correction - ensures reliable bitstream integrity after radiation exposure |
| Operating Temperature | –55°C to +125°C - qualified for extended thermal cycling in LEO spacecraft environments |
| Qualification Standard | QML-V Class V - meets NASA and DoD requirements for high-reliability space applications |
| DSP Slices | 64 × DSP48E1 - accelerates real-time signal processing tasks such as FFT, filtering, and modulation |
Pinout & Package
XA6SLX45-3CSG324Q is housed in a 324-pin Ceramic Column Grid Array (CSGA) package with 2.0 mm pitch, qualified to MIL-PRF-38535 Class K and suitable for hermetic sealing in space-grade modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins ensure low-impedance return paths for analog and digital domains |
| VCCINT | Core supply | 1.2 V ±3% supply for FPGA logic fabric; requires tight regulation due to radiation-induced leakage sensitivity |
| VCCAUX | Auxiliary supply | 2.5 V supply for configuration, clocking, and transceivers; supports hot-swap tolerance |
| IO_Lx_y | Configurable I/O bank | Each bank independently supports 1.2 V/1.8 V/2.5 V/3.3 V signaling; critical for mixed-voltage payload interfaces |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 500 MHz; feeds DCM for low-jitter system timing |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Applied to configuration memory and critical control logic to detect and mask single-event upsets without functional interruption |
| SEU Detection & Correction | Real-time CRC-based frame checking with automatic reload of corrupted configuration frames from internal backup storage |
| QML-V Class V Qualification | Full radiation test suite including TID up to 100 krad(Si), proton SEE testing, and thermal vacuum life testing |
| Programmable I/O Standards | Supports LVDS, RSDS, HSTL, SSTL, and PCI-compatible signaling - enables direct interfacing with legacy and modern space avionics |
| Dedicated Clock Management | Two DCMs per bank provide frequency synthesis, phase shifting, and duty-cycle correction for deterministic timing closure |
Applications
| Satellite Onboard Data Processing | Spacecraft Command & Data Handling (C&DH) |
|---|---|
Use Scenario: Real-time compression and formatting of Earth observation imagery prior to downlink. IC Role / Device Role / Timing Role: Reconfigurable compute engine performing pixel-level filtering, JPEG2000 encoding, and packetization using embedded DSP slices and block RAM. Use Value: Eliminates need for external ASICs or processors; reduces SWaP-C while enabling post-launch algorithm updates via partial reconfiguration. | Use Scenario: Centralized telemetry aggregation, health monitoring, and command execution across multiple subsystems. IC Role / Device Role / Timing Role: Configurable I/O hub and state machine controller interfacing with MIL-STD-1553 buses, discrete sensors, and solid-state power controllers. Use Value: Provides deterministic latency and fault-isolated I/O banks to meet C&DH reliability and response time requirements. |
| Reconfigurable Payload Controllers | Radiation Monitoring & Mitigation Systems |
Use Scenario: Adaptive control of scientific instrument sequencing based on orbital position and sensor feedback. IC Role / Device Role / Timing Role: Runtime-reconfigurable state machine managing instrument power-up, calibration, and data acquisition windows. Use Value: Enables mission flexibility through field-upgradable logic; supports multiple instrument modes without hardware change. | Use Scenario: Continuous in-situ detection of single-event effects and autonomous recovery actions. IC Role / Device Role / Timing Role: Embedded monitor core tracking configuration frame CRC errors and triggering scrubbing or reconfiguration. Use Value: Provides closed-loop radiation resilience without ground intervention; meets NASA NPR 7150.2 software safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-tolerant Actel (Microchip) antifuse FPGA; non-volatile, no configuration reload risk but unprogrammable post-deployment | Preferred for fixed-function, ultra-high-reliability roles where reconfiguration is unnecessary | Choose RTAX2000D when design stability outweighs need for in-orbit updates |
| XA7VX415T-1RF1760Q | Virtex-7 radiation-tolerant FPGA with higher logic density (415K LC), 28 nm process, and integrated transceivers supporting >3.125 Gbps serial links | Better suited for high-bandwidth payloads requiring PCIe Gen2 or 10GBase-KR interfaces | Choose XA7VX415T-1RF1760Q when bandwidth or logic scale exceeds XA6SLX45-3CSG324Q capacity |
Compared with RTAX2000D and XA7VX415T-1RF1760Q, the XA6SLX45-3CSG324Q delivers optimal balance of reconfigurability, radiation tolerance, and power efficiency for mid-complexity LEO missions-offering proven heritage, lower static power, and mature toolchain support without over-provisioning resources.
Availability
XA6SLX45-3CSG324Q is available at Aetrix Electronics and suitable for satellite payload development, spacecraft C&DH subsystems, and radiation-hardened avionics requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX45-3CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened and high-reliability devices.
The XA6SLX45-3CSG324Q belongs to AMD's Xilinx Aerospace (XA) Spartan-6 family, engineered specifically for cost-sensitive, power-constrained space missions requiring reconfigurable logic with certified radiation performance.
FAQ
What radiation hardness specifications does the XA6SLX45-3CSG324Q meet?
The XA6SLX45-3CSG324Q is qualified to QML-V Class V per MIL-PRF-38535 and tested for total ionizing dose (TID) up to 100 krad(Si), enhanced low-dose-rate sensitivity (ELDRS) immunity, and single-event effects (SEE) including latch-up, burnout, and functional interrupts. Its SEU mitigation relies on triple modular redundancy and CRC-based configuration scrubbing, validated under proton and heavy-ion irradiation.
Does the XA6SLX45-3CSG324Q support partial reconfiguration?
Yes, the XA6SLX45-3CSG324Q supports partial reconfiguration through its hardened configuration access port (CAP) and frame-based bitstream architecture. This allows dynamic logic updates in operational subsystems without resetting the entire device-enabling adaptive payload functions and in-flight algorithm upgrades while maintaining system uptime and deterministic timing behavior.
What I/O standards are supported by the XA6SLX45-3CSG324Q?
The XA6SLX45-3CSG324Q supports LVDS, RSDS, HSTL Class I/II, SSTL2/3 Class I/II, and PCI-compliant signaling across its 186 user I/Os. Each I/O bank operates independently at 1.2 V, 1.8 V, 2.5 V, or 3.3 V, enabling direct interface with legacy MIL-STD-1553 transceivers, SpaceWire PHYs, ADCs, DACs, and microcontrollers in mixed-voltage spacecraft architectures.
Is the XA6SLX45-3CSG324Q compatible with standard Spartan-6 development tools?
Yes, the XA6SLX45-3CSG324Q uses the same ISE Design Suite v14.7 toolchain as commercial Spartan-6 FPGAs, with additional radiation-specific simulation models and configuration bitstream validation utilities provided in AMD's Xilinx Aerospace software bundle. Pin compatibility with non-radiation-hardened LX45 variants is maintained, though voltage and timing constraints differ.
What thermal and mechanical qualifications apply to the CSGA package of the XA6SLX45-3CSG324Q?
The XA6SLX45-3CSG324Q's 324-pin Ceramic Column Grid Array package is qualified to MIL-PRF-38535 Class K, with thermal cycling from –55°C to +125°C (500 cycles), mechanical shock up to 1,500 g, and vibration endurance per MIL-STD-883 Method 2007. Its hermetic ceramic construction and column solder interconnects ensure long-term reliability under launch and orbital mechanical stress.
XA6SLX45-3CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX45-3CSG324Q FAQ
1.How can I place an order for XA6SLX45-3CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45-3CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45-3CSG324Q reliable?
The price and inventory of XA6SLX45-3CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45-3CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX45-3CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45-3CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45-3CSG324Q?
XA6SLX45-3CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45-3CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45-3CSG324Q?
For technical support, including XA6SLX45-3CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45-3CSG324Q requirements.
6.How does Aetrix verify that XA6SLX45-3CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX45-3CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45-3CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX45-3CSG324Q?
All XA6SLX45-3CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45-3CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45-3CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX45-3CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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