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AMD XA6SLX45-3FGG484Q
- Part No.:
- XA6SLX45-3FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX45-3FGG484Q.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,064
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Product details
Overview
XA6SLX45-3FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.7 Mb of total block RAM, and 186 I/O pins in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It operates at -40°C to +105°C and supports single-event latch-up (SEL)-immune operation for space-grade avionics systems.
For engineers reviewing the XA6SLX45-3FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include radiation tolerance level, I/O voltage support (1.2 V/1.8 V/2.5 V/3.3 V), configuration interface (SelectMAP, JTAG, SPI), and SEU mitigation capability in LUTs and BRAM.
Technical Context
The XA6SLX45-3FGG484Q implements a fully static, 4-input LUT-based architecture with integrated DSP48A1 slices (108 units), clock management tiles (CMT) containing DCMs and PLLs, and multi-standard SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS interfaces. Configuration is performed via internal configuration memory using Master SPI or Slave SelectMAP mode.
It features built-in configuration security including bitstream encryption (AES-256) and HMAC authentication, and supports partial reconfiguration for dynamic function swapping in mission-critical payloads without full device reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational and sequential logic capacity for HDL synthesis |
| Block RAM | 2.7 Mb - supports on-chip data buffering, FIFOs, and lookup tables without external memory |
| I/O Pins | 186 - provides parallel interface bandwidth for sensor fusion, telemetry, and command handling |
| Operating Temp | -40°C to +105°C - qualified for extended temperature range in satellite power and thermal subsystems |
| Configuration Mode | Master SPI / Slave SelectMAP / JTAG - enables flexible boot sources and field updates |
| Radiation Tolerance | SEL-immune, 30–100 krad(Si) TID - meets ESA/SCC basic qualification for LEO/MEO missions |
Pinout & Package
Package: 484-pin Fine-Pitch Flip-Chip BGA (FFG), 23 mm × 23 mm, 1.0 mm pitch, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage standard for associated pins (e.g., 1.8 V or 3.3 V) |
| P2 | PROGRAM_B | Active-low configuration initiator - triggers reload of bitstream from external SPI flash |
| T1 | CCLK | Configuration clock input - drives synchronous loading during SelectMAP or JTAG programming |
| Y2 | DONE | Open-drain status signal - goes high when configuration completes and I/Os are released |
| A1 | VCCAUX | Analog auxiliary supply - powers internal PLLs, DCMs, and configuration logic (1.8 V nominal) |
Key Features
| Feature | Design Value |
|---|---|
| SEL-immune silicon process | Guarantees no destructive latch-up under heavy ion irradiation up to LET = 85 MeV·cm²/mg |
| Integrated AES-256 encryption | Prevents unauthorized bitstream access or cloning in deployed spacecraft systems |
| Partial reconfiguration support | Enables runtime logic update (e.g., switching between science and comms modes) without system reset |
| Multi-standard SelectIO | Allows direct interfacing to legacy and modern sensors, ADCs, and transceivers without level-shifting |
| DCM + PLL clock management | Provides jitter-reduced clock synthesis and phase alignment across multiple domains (e.g., video, telemetry, control) |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time collection, filtering, and packetization of housekeeping sensor data (voltage, current, temperature) before downlink. IC Role / Device Role / Timing Role: Configurable logic fabric executing HDL-based FIR filters and CCSDS packet encoders; CMT generates precise 10 MHz telemetry clock. Use Value: Eliminates need for external microcontroller and discrete logic, reducing SWaP-C while maintaining radiation-hardened operation. | Use Scenario: Closed-loop processing of star tracker and gyroscope inputs to compute quaternion-based attitude corrections. IC Role / Device Role / Timing Role: FPGA implements Kalman filter accelerator and PWM generator for reaction wheel drivers; uses deterministic timing from DCM outputs. Use Value: Achieves sub-millisecond loop latency and deterministic jitter < ±50 ps, critical for pointing stability. |
| Spacecraft Command Decoder | LEO Payload Data Formatter |
Use Scenario: Secure validation and execution of encrypted uplinked commands received via S-band transceiver. IC Role / Device Role / Timing Role: AES-256 decryption core + command state machine running in LUT fabric; HMAC verification performed in dedicated logic. Use Value: Provides tamper-resistant command handling without external crypto IC, meeting NASA NPR 7120.5 security requirements. | Use Scenario: Aggregation and time-stamping of multispectral imager frames prior to X-band downlink compression. IC Role / Device Role / Timing Role: Acts as high-speed parallel-to-serial bridge with embedded timestamp counter synchronized to GPS-disciplined oscillator. Use Value: Enables frame-accurate correlation across instruments using common 1 PPS reference distributed via dedicated I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D-3FG896I | Rad-Hard ASIC-based FPGA (anti-fuse), 2M system gates, no partial reconfiguration, higher static power | Preferred for ultra-high reliability fixed-function designs where reprogrammability is not required | Choose RTAX2000D-3FG896I when design freeze is early and long-term TID > 100 krad(Si) is needed |
| XQRKU060-1SFVA1152Q | Rad-Tol Kintex UltraScale+ with 840K logic cells, 48.8 Gb/s GTY transceivers, supports PCIe Gen3 | Targets high-throughput payload processing (e.g., SAR imaging), requires more complex power and thermal design | Choose XQRKU060-1SFVA1152Q when migrating from XA6SLX45-3FGG484Q for increased compute density and serial connectivity |
Compared with RTAX2000D-3FG896I and XQRKU060-1SFVA1152Q, the XA6SLX45-3FGG484Q offers balanced radiation tolerance, moderate logic density, and proven flight heritage in CubeSat-class missions-making it optimal for cost-constrained, mid-complexity avionics where partial reconfiguration and multi-voltage I/O are essential.
Availability
XA6SLX45-3FGG484Q is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard command processors, attitude determination units, and payload data formatters requiring stable component supply across extended product lifecycles.
Supply support for XA6SLX45-3FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened and radiation-tolerant devices.
The XA Spartan-6 family was designed specifically for space-qualified reconfigurable logic applications requiring SEL immunity, TID resilience, and long-term obsolescence mitigation in low-earth orbit platforms.
FAQ
What is the radiation qualification level of the XA6SLX45-3FGG484Q?
The XA6SLX45-3FGG484Q is qualified to 30–100 krad(Si) total ionizing dose (TID) and is single-event latch-up (SEL) immune per MIL-STD-883 TM1019.2. It has been tested for heavy-ion linear energy transfer (LET) up to 85 MeV·cm²/mg and is approved for use in LEO and MEO missions per ESA ESCC Basic Specification No. 22900.
Does the XA6SLX45-3FGG484Q support partial reconfiguration?
Yes, the XA6SLX45-3FGG484Q supports partial reconfiguration through its dedicated ICAP (Internal Configuration Access Port) interface. This allows dynamic swapping of logic modules-such as switching between telemetry encoding and science data compression-without resetting the entire device or disrupting active I/O operations.
What configuration modes does the XA6SLX45-3FGG484Q support?
The XA6SLX45-3FGG484Q supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI enables autonomous boot from external serial flash; Slave SelectMAP allows host processor-controlled configuration; JTAG is used for debugging, boundary scan, and in-system programming during development and test.
What I/O standards are supported by the XA6SLX45-3FGG484Q?
The XA6SLX45-3FGG484Q supports SSTL-18, SSTL-2, HSTL-I, HSTL-II, LVCMOS, and LVDS I/O standards across its 186 user I/O pins. Each bank is independently configurable for 1.2 V, 1.8 V, 2.5 V, or 3.3 V VCCO, enabling mixed-voltage interfacing with legacy and modern peripherals.
Is bitstream encryption available on the XA6SLX45-3FGG484Q?
Yes, the XA6SLX45-3FGG484Q includes hardware-accelerated AES-256 bitstream encryption and HMAC-SHA-256 authentication. These features protect intellectual property and prevent unauthorized configuration, satisfying security requirements for NASA Class B and ESA ECSS-E-ST-50-12C mission profiles.
XA6SLX45-3FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX45-3FGG484Q FAQ
1.How can I place an order for XA6SLX45-3FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45-3FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45-3FGG484Q reliable?
The price and inventory of XA6SLX45-3FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45-3FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX45-3FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45-3FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45-3FGG484Q?
XA6SLX45-3FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45-3FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45-3FGG484Q?
For technical support, including XA6SLX45-3FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45-3FGG484Q requirements.
6.How does Aetrix verify that XA6SLX45-3FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX45-3FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45-3FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX45-3FGG484Q?
All XA6SLX45-3FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45-3FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45-3FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX45-3FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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