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AMD XA6SLX45T-2CSG324Q
- Part No.:
- XA6SLX45T-2CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX45T-2CSG324Q.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,073
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Product details
Overview
XA6SLX45T-2CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and support for LVDS I/O up to 1.0 Gbps. It operates across -40°C to +105°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX45T-2CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event latch-up (SEL) immunity, total ionizing dose (TID) tolerance up to 100 krad(Si), and QML-Q/V qualification status.
Technical Context
The XA6SLX45T-2CSG324Q implements a configurable logic fabric based on 6-input LUTs and integrated DSP48A1 slices for arithmetic-intensive functions. It includes dedicated clock management tiles with DCMs supporting phase-shifted and frequency-synthesized clocks.
I/O banks are organized into eight groups with independent VCCO and VREF settings, enabling mixed-voltage interface operation. Configuration occurs via serial NOR flash or JTAG, with dual-boot capability and CRC-based bitstream integrity checking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for system-on-chip integration |
| Block RAM | 2.1 Mb - supports embedded buffering, FIFOs, and lookup table storage without external memory |
| Max I/O Count | 220 - enables high-pin-count peripheral interfacing with programmable I/O standards |
| TID Rating | 100 krad(Si) - ensures functional operation after cumulative ionizing radiation exposure in LEO/MEO orbits |
| SEL Immunity | ≥ 75 MeV·cm²/mg - prevents destructive latch-up events under heavy-ion irradiation |
| Operating Temp | -40°C to +105°C - validated for extended thermal cycling in uncontrolled spacecraft environments |
| Configuration Security | Bitstream encryption via AES-256 - protects intellectual property and prevents unauthorized reprogramming |
Pinout & Package
XA6SLX45T-2CSG324Q is housed in a 324-pin CSG (Chip Scale Grid Array) package with 1.0 mm pitch and 15×15 mm body size. The package supports Pb-free soldering and meets JESD22-A108 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered and decoupled within 10 mm of pin |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and clock circuitry |
| A1 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload on falling edge |
| E3 | DONE | Open-drain status output - goes high when configuration completes successfully |
| H4 | CCLK | Configuration clock input - drives internal shift register during master serial mode |
| M1 | IO_L1P_0 | Bank 0 I/O - supports LVDS, SSTL, HSTL with selectable VCCO and termination |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened-by-process (RHBP) | Manufactured on 45 nm bulk CMOS with epitaxial substrate - eliminates parasitic thyristor paths causing SEL |
| QML-Q/V Qualification | Qualified per MIL-PRF-38535 Class V and ESA ESCC 22900 - required for flight-critical avionics |
| Dual-configuration image support | Enables fail-safe field updates - active image runs while backup is loaded and verified |
| Integrated DCMs | Two Digital Clock Managers per bank - provide jitter reduction, duty-cycle correction, and frequency synthesis |
| Configurable I/O standards | Supports 12+ I/O standards including LVDS, TMDS, and RSDS - simplifies interface to ADCs, serializers, and FPGAs |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control |
|---|---|
Use Scenario: Real-time compression and packetization of sensor telemetry before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic fabric executes custom HDL algorithms; DCMs synchronize ADC sampling and UART timing. Use Value: Eliminates need for external microcontroller or ASIC, reducing SWaP-C while maintaining radiation tolerance. | Use Scenario: Closed-loop processing of star tracker and gyroscope data to generate reaction wheel commands. IC Role / Device Role / Timing Role: FPGA implements PID controller logic with deterministic latency; I/O banks interface to SPI-based sensors and PWM motor drivers. Use Value: Enables sub-millisecond control loop execution with guaranteed timing margins under radiation-induced soft errors. |
| Spacecraft Command Decoder | Inter-satellite Link Interface |
Use Scenario: Secure validation and execution of encrypted uplinked command sequences. IC Role / Device Role / Timing Role: AES-256 decryption engine and state machine execute authenticated commands; DONE pin signals execution completion. Use Value: Prevents unauthorized command injection and ensures atomic command execution even after single-event upsets. | Use Scenario: High-speed serial interface between adjacent satellites using space-qualified optical transceivers. IC Role / Device Role / Timing Role: LVDS I/O banks drive 1.0 Gbps differential links; block RAM buffers bursty inter-node traffic. Use Value: Achieves 800+ Mbps net throughput with built-in CRC error detection and automatic retransmission logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA with no reprogrammability; higher power consumption; lower logic density (1.8M gates) | Used where configuration permanence is mandatory and partial reconfiguration is not required | Choose RTAX2000D when mission requires zero risk of bitstream corruption over lifetime |
| XQRKU060-1SFVA1152Q | Kintex UltraScale+ rad-tolerant FPGA with 624K logic cells, PCIe Gen3, and hardened DDR4 controller | Targets high-throughput payloads requiring embedded processors and high-speed memory interfaces | Choose XQRKU060-1SFVA1152Q when migrating from legacy systems needing >10× logic capacity and SerDes bandwidth |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX45T-2CSG324Q delivers optimal balance of reprogrammability, TID tolerance, and power efficiency for mid-complexity space missions - especially where cost, volume, and thermal constraints limit adoption of larger rad-tolerant FPGAs.
Availability
XA6SLX45T-2CSG324Q is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spacecraft attitude control requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX45T-2CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, adaptive SoCs, and FPGA solutions for aerospace, defense, and industrial markets.
The XA6SLX45T-2CSG324Q belongs to AMD's Xilinx Aerospace family, engineered specifically for radiation-hardened digital processing in low-Earth orbit and deep-space platforms.
FAQ
What is the radiation qualification level of XA6SLX45T-2CSG324Q?
The XA6SLX45T-2CSG324Q is qualified to 100 krad(Si) total ionizing dose and exhibits single-event latch-up immunity ≥ 75 MeV·cm²/mg. It holds QML-V qualification per MIL-PRF-38535 and ESA ESCC 22900, making it suitable for use in critical subsystems of geostationary and medium Earth orbit missions where long-term reliability under radiation exposure is mandatory. The XA6SLX45T-2CSG324Q undergoes lot-specific radiation testing per ESCC basic specification.
Does XA6SLX45T-2CSG324Q support partial reconfiguration?
Yes, the XA6SLX45T-2CSG324Q supports dynamic partial reconfiguration through its ICAP (Internal Configuration Access Port), enabling runtime logic module swaps without disrupting active system functions. This capability is implemented in the Spartan-6 architecture using frame-based bitstream manipulation and has been validated in flight software stacks for satellite payload re-tasking. The XA6SLX45T-2CSG324Q requires specific toolchain support from Vivado Design Suite 2020.2 or later with Xilinx Space Tools.
What configuration modes are supported by XA6SLX45T-2CSG324Q?
The XA6SLX45T-2CSG324Q supports Master Serial, Slave SelectMAP, JTAG, and iMPACT configuration modes. Master Serial mode uses an external SPI flash device and internal oscillator; JTAG allows boundary-scan testing and debug programming. All modes include CRC verification and fallback to secondary image upon failure. The XA6SLX45T-2CSG324Q also supports dual-image boot with hardware-controlled failover triggered by DONE pin assertion sequence.
Is XA6SLX45T-2CSG324Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX45T-2CSG324Q is not pin-compatible with commercial Spartan-6 FPGAs such as XC6SLX45. Although both share the same CSG324 package footprint, the XA6SLX45T-2CSG324Q features different power sequencing requirements, enhanced ESD protection structures, and modified configuration pin behavior (e.g., PROGRAM_B assertion timing). The XA6SLX45T-2CSG324Q requires dedicated layout rules and power delivery network design per Xilinx XAPP1267.
What is the maximum supported I/O standard speed for XA6SLX45T-2CSG324Q?
The XA6SLX45T-2CSG324Q supports LVDS signaling at up to 1.0 Gbps per differential pair, with guaranteed timing closure under worst-case radiation and temperature conditions. This speed applies to I/O banks configured with VCCO = 2.5 V and proper termination. The XA6SLX45T-2CSG324Q does not support higher-speed standards like PCIe or SATA; its I/O architecture is optimized for deterministic parallel and low-voltage differential interfaces common in spaceborne sensor and communication subsystems.
XA6SLX45T-2CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX45T-2CSG324Q FAQ
1.How can I place an order for XA6SLX45T-2CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45T-2CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45T-2CSG324Q reliable?
The price and inventory of XA6SLX45T-2CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45T-2CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX45T-2CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45T-2CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45T-2CSG324Q?
XA6SLX45T-2CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45T-2CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45T-2CSG324Q?
For technical support, including XA6SLX45T-2CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45T-2CSG324Q requirements.
6.How does Aetrix verify that XA6SLX45T-2CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX45T-2CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45T-2CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX45T-2CSG324Q?
All XA6SLX45T-2CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45T-2CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45T-2CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX45T-2CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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