AMD XA6SLX45T-3CSG324Q
- Part No.:
- XA6SLX45T-3CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX45T-3CSG324Q.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XA6SLX45T-3CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, 216 DSP48E1 slices, and operates at -3 speed grade in a 324-pin CSGA package. It targets spaceborne data processing, onboard telemetry handling, and reconfigurable avionics control systems.
For engineers reviewing the XA6SLX45T-3CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include radiation tolerance (up to 100 krad(Si) TID), SEU mitigation support, extended temperature range (-55°C to +125°C), and QML-Q/V qualification status.
Technical Context
The XA6SLX45T-3CSG324Q implements a fully static, 4-input LUT-based architecture with integrated shift registers and wide multiplexers. It supports dual-register flip-flops per slice and includes dedicated carry logic for high-speed arithmetic.
Configuration is performed via SelectMAP or serial mode using an external PROM or processor. Built-in startup sequence controls power-on reset, configuration clock synchronization, and JTAG boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total configurable logic resources for implementing synchronous digital logic functions |
| Block RAM | 2.1 Mb - distributed memory capacity usable as true dual-port RAM, FIFO, or ROM |
| DSP Slices | 216 × DSP48E1 - hardwired multiply-accumulate units supporting 25×18 signed multiplication |
| Speed Grade | -3 - highest performance bin with guaranteed timing at max junction temperature and radiation stress |
| TID Rating | 100 krad(Si) - total ionizing dose tolerance validated under MIL-STD-883 TM1019 |
| Operating Temp | -55°C to +125°C - qualified for extreme thermal environments in LEO and deep-space missions |
| Qualification | QML-Q/V - certified per SMD 5962-10205 for space-grade reliability and screening |
Pinout & Package
XA6SLX45T-3CSG324Q is housed in a 324-pin Ceramic Column Grid Array (CSGA) package with 1.0 mm pitch, hermetically sealed for space applications. Pin assignment follows AMD's Spartan-6 XA family pinout standard for QML-Q devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input, must be filtered locally to meet noise and droop requirements |
| P2 | VCCAUX | 2.5 V auxiliary supply for I/O banks and configuration circuitry |
| A1 | PROGRAM_B | Active-low asynchronous reset that initiates configuration reload from master SPI flash |
| E3 | INIT_B | Open-drain status output indicating configuration memory readiness |
| R1 | DONE | Open-drain output signaling successful configuration completion and I/O release |
| H2 | TCK | JTAG test clock input for boundary-scan and debug access per IEEE 1149.1 |
Key Features
| Feature | Design Value |
|---|---|
| SEU Mitigation | Configurable triple modular redundancy (TMR) and CRC-based frame monitoring for real-time error detection |
| Configuration Security | Bitstream encryption via AES-256 and HMAC-SHA-256 authentication keys stored in on-chip eFUSE |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards up to 1.0 Gbps per pin |
| Startup Control | Programmable startup clock divider and delay settings to synchronize with external system clocks |
| Thermal Management | On-die temperature sensor with I²C interface for closed-loop thermal monitoring in vacuum environments |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control |
|---|---|
Use Scenario: Real-time compression and formatting of sensor telemetry streams before downlink transmission. IC Role / Device Role / Timing Role: Configurable datapath engine performing packetization, CRC insertion, and time-stamping. Use Value: Enables deterministic latency ≤ 2.1 µs for critical housekeeping data with radiation-hardened operation. | Use Scenario: Closed-loop execution of attitude determination and control algorithms using star tracker and gyroscope inputs. IC Role / Device Role / Timing Role: Reconfigurable flight computer executing Kalman filters and PID controllers at 1 kHz update rate. Use Value: Delivers 12,800 Dhrystone MIPS at -55°C to +125°C without derating or thermal throttling. |
| Reconfigurable Payload Interface | Deep-Space Command Decoding |
Use Scenario: Adapting interface protocols between legacy and next-generation scientific instruments aboard planetary orbiters. IC Role / Device Role / Timing Role: Protocol bridge implementing SpaceWire, MIL-STD-1553, and CCSDS packet transfer layers. Use Value: Supports hot-swappable firmware updates via JTAG while maintaining full I/O isolation during reconfiguration. | Use Scenario: Secure validation and parsing of encrypted command sequences received from Earth-based ground stations. IC Role / Device Role / Timing Role: Cryptographic accelerator verifying AES-GCM authenticated commands prior to execution. Use Value: Achieves ≤ 8.3 µs command validation latency with zero false-acceptance rate under 100 krad(Si) exposure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7K160T-1FFG676Q | Kintex-7 based; higher logic density (162k LUTs), 28 nm process, lower power per function, no QML-V option | Targets higher-compute payloads requiring PCIe Gen2 or 10G Ethernet; not qualified for QML-V screening | Preferred when algorithm complexity exceeds Spartan-6 capacity but radiation environment is limited to TID ≤ 50 krad(Si) |
| RTAX2000D-1MFG676I | Antifuse-based; non-volatile, single-event latch-up immune, 2 M gates, no configuration memory vulnerability | Used where configuration permanence and SEL immunity are mandatory over reconfigurability | Select when mission-critical functions require zero reconfiguration risk, even at cost of flexibility and lower gate count |
Compared with XA6SLX45T-3CSG324Q, the XA7K160T-1FFG676Q offers greater compute density but lacks QML-V qualification, while the RTAX2000D-1MFG676I provides inherent SEU/SEL immunity at the expense of field reprogrammability and logic capacity.
Availability
XA6SLX45T-3CSG324Q is available at Aetrix Electronics and suitable for satellite bus management, deep-space probe telemetry, and radiation-hardened industrial control systems requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX45T-3CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs and manufactures high-performance adaptive computing solutions for aerospace, defense, and industrial markets.
The XA Spartan-6 family delivers radiation-tolerant, reconfigurable logic for mission-critical space electronics where reliability, longevity, and design flexibility are essential.
FAQ
What radiation hardness level does XA6SLX45T-3CSG324Q support?
The XA6SLX45T-3CSG324Q is rated for total ionizing dose (TID) up to 100 krad(Si) per MIL-STD-883 TM1019, with single-event upset (SEU) mitigation features including CRC frame checking and optional TMR implementation. It meets QML-Q/V screening requirements for spaceflight use.
Is XA6SLX45T-3CSG324Q pin-compatible with commercial Spartan-6 devices?
No, XA6SLX45T-3CSG324Q uses a radiation-hardened CSGA package and pinout optimized for space-grade thermal and EMI performance. Its pin assignments differ from commercial CSBGA variants, and I/O bank voltage configurations are hardened for extended temperature operation.
Does XA6SLX45T-3CSG324Q support JTAG boundary-scan testing?
Yes, XA6SLX45T-3CSG324Q fully supports IEEE 1149.1 JTAG boundary-scan for interconnect testing and in-system programming. Dedicated TCK, TMS, TDI, TDO, and TRST pins are assigned and qualified across the full operating temperature range.
What configuration modes are supported by XA6SLX45T-3CSG324Q?
XA6SLX45T-3CSG324Q supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI flash, parallel PROM, or host processor via dedicated configuration interfaces.
Can XA6SLX45T-3CSG324Q operate at full speed across its entire temperature range?
Yes, XA6SLX45T-3CSG324Q is speed-binned and characterized at -55°C to +125°C. The -3 speed grade guarantees timing closure for all internal paths-including CLB, RAM, and DSP-under worst-case voltage, temperature, and radiation conditions.
XA6SLX45T-3CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX45T-3CSG324Q FAQ
1.How can I place an order for XA6SLX45T-3CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45T-3CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45T-3CSG324Q reliable?
The price and inventory of XA6SLX45T-3CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45T-3CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX45T-3CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45T-3CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45T-3CSG324Q?
XA6SLX45T-3CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45T-3CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45T-3CSG324Q?
For technical support, including XA6SLX45T-3CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45T-3CSG324Q requirements.
6.How does Aetrix verify that XA6SLX45T-3CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX45T-3CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45T-3CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX45T-3CSG324Q?
All XA6SLX45T-3CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45T-3CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45T-3CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX45T-3CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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