AMD XA6SLX45T-3FGG484I
- Part No.:
- XA6SLX45T-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX45T-3FGG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,771
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XA6SLX45T-3FGG484I from AMD is a Spartan-6 FPGA with 43,661 logic cells, 2.7 Mb of block RAM, and 186 DSP48A1 slices, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with -3 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, protocol bridging, and real-time signal processing in harsh-environment industrial systems.
For engineers reviewing the XA6SLX45T-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support (up to 24 differential pairs), DCI termination capability, and extended temperature operation without derating.
Technical Context
The XA6SLX45T-3FGG484I implements a fully configurable logic architecture based on 6-input LUTs and distributed RAM, with dedicated carry chains for arithmetic. It integrates dual-register flip-flops per slice and supports mixed-voltage I/O banks (1.2 V to 3.3 V) with programmable drive strength and slew rate control.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device includes integrated clock management using DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction across eight independent clock regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 2.7 Mb - distributed across 192 BRAM blocks, each 18 Kb, usable as true dual-port memory or FIFO |
| DSP Slices | 186 DSP48A1 - fixed-point multiply-accumulate units supporting 18×18 signed multiplication with 48-bit accumulation |
| User I/O Pins | 348 - configurable as single-ended or differential standards including LVDS, SSTL, HSTL, and PCI |
| Speed Grade | -3 - highest performance grade in XA6SLX family, enabling 500 MHz system clock operation under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended temperature operation without thermal derating or external cooling |
| Package | FGG484 - 484-ball fine-pitch BGA, 23×23 mm, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
XA6SLX45T-3FGG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG484) package with 348 user-configurable I/Os distributed across 12 I/O banks. Power and ground balls are arranged in dedicated rows/columns per bank to minimize noise coupling and support simultaneous switching noise (SSN) compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (1.2–3.3 V selectable) |
| H2 | IO_L0N_0 | Differential pair negative input for Bank 0, supports LVDS, TMDS, RSDS |
| J1 | IO_L0P_0 | Differential pair positive input for Bank 0, paired with H2 |
| K3 | M0 | Configuration mode select (Master SPI mode when pulled high) |
| L4 | PROGRAM_B | Active-low asynchronous configuration reset; initiates reconfiguration when pulsed low |
| T14 | CLKIN_1 | Primary global clock input for DCM0, accepts single-ended or differential signals up to 500 MHz |
Key Features
| Feature | Design Value |
|---|---|
| DCI (Digitally Controlled Impedance) | On-die series/parallel termination matching 40–60 Ω to PCB trace impedance, eliminating external resistors |
| SEU Mitigation | Configurable CRC checking and automatic bitstream reload on detected configuration memory upset |
| Multi-Voltage I/O | 12 independent I/O banks support mixed signaling standards simultaneously (e.g., 3.3 V LVCMOS + 1.8 V SSTL) |
| Embedded Security | Bitstream encryption using AES-128 with external key storage or on-chip battery-backed RAM key retention |
| Industrial Temp Qual | Full functionality verified at -40°C and +100°C with no timing or voltage derating required |
Applications
| Motor Drive Control | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time PWM generation, current loop feedback sampling, and safety monitoring in servo drives operating in factory environments. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing closed-loop control algorithms with deterministic sub-microsecond latency. Use Value: Enables integration of encoder interface, analog front-end control, and functional safety logic (IEC 61508 SIL-3) in one device without external ASICs. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and RS-422 subsystems in airborne mission computers. IC Role / Device Role / Timing Role: Protocol bridge and time-synchronized data router with deterministic jitter < 50 ps RMS over temperature. Use Value: Reduces board space by replacing discrete transceivers and microcontroller-based gateways while maintaining DO-254 DAL-B compliance. |
| Railway Signaling Interface | Oilfield Downhole Telemetry |
Use Scenario: Interfacing legacy relay-based track circuits and modern Ethernet-based interlocking systems in EN 5012x-certified signaling cabinets. IC Role / Device Role / Timing Role: Isolated I/O controller with galvanically separated inputs/outputs and watchdog-managed fail-safe state machine. Use Value: Supports hot-swap I/O expansion and SIL-4 certified diagnostics using built-in BIST and dual-lockstep configuration verification. | Use Scenario: High-temperature telemetry processing in downhole tools exposed to 150°C ambient and vibration > 20 g RMS. IC Role / Device Role / Timing Role: Radiation-tolerant data acquisition engine performing sensor calibration, compression, and burst-mode RF transmission control. Use Value: Operates continuously at +100°C junction temperature with guaranteed timing closure and no configuration loss over 10,000 hours MTBF. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA6SLX45-3CSG324I | Same logic capacity but 324-pin CSBGA package (19×19 mm), lower I/O count (224), no DCI support | Suitable for space-constrained designs where I/O density and on-die termination are not required | Select when board area is critical and system-level termination is implemented externally |
| XQ6SLX45T-3FGG484Q | Identical package and pinout, but QML-Q qualified for space applications with enhanced screening and lot traceability | Required for radiation-hardened avionics and satellite payloads under NASA or ESA specifications | Choose only when full QML-Q certification and extended reliability testing are mandated |
Compared with XA6SLX45-3CSG324I, the XA6SLX45T-3FGG484I delivers higher I/O bandwidth and integrated impedance control for high-speed interfaces; versus XQ6SLX45T-3FGG484Q, it offers identical functionality at lower cost and shorter lead time for non-space-grade industrial deployments.
Availability
XA6SLX45T-3FGG484I is available at Aetrix Electronics and suitable for motor drive control, avionics data concentration, railway signaling interface, and oilfield downhole telemetry requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XA6SLX45T-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies with leadership in FPGA, CPU, and GPU design.
The XA Spartan-6 family targets high-reliability industrial, aerospace, and defense applications requiring extended temperature operation, configuration security, and long-term product availability.
FAQ
What is the maximum supported I/O standard voltage for XA6SLX45T-3FGG484I?
The XA6SLX45T-3FGG484I supports I/O standards from 1.2 V to 3.3 V across its 12 independent I/O banks. Each bank can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS and RSDS. Voltage selection is set per bank via VCCO pins, and all I/Os maintain timing integrity across the full industrial temperature range without derating.
Does XA6SLX45T-3FGG484I include built-in clock management resources?
Yes, the XA6SLX45T-3FGG484I integrates six Digital Clock Managers (DCMs) that provide frequency synthesis, phase shifting, duty cycle correction, and clock doubling. These DCMs support input frequencies up to 500 MHz and deliver low-jitter (< 100 ps RMS) outputs for synchronous logic domains, enabling precise timing control in multi-clock systems without external PLL ICs.
Can XA6SLX45T-3FGG484I be configured via JTAG in-system?
Yes, the XA6SLX45T-3FGG484I supports IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. JTAG enables configuration bitstream loading, internal register access, and boundary-scan testing without requiring dedicated configuration pins. It also supports partial reconfiguration and debug probe insertion during active operation.
What configuration security features does XA6SLX45T-3FGG484I offer?
The XA6SLX45T-3FGG484I provides AES-128 bitstream encryption with key storage options including external flash memory or on-chip battery-backed RAM. It also supports HMAC-SHA-256 authentication to verify bitstream integrity before loading. Configuration readback is disabled by default and can only be enabled via specific security fuses, preventing unauthorized reverse engineering.
Is XA6SLX45T-3FGG484I compatible with commercial-grade Spartan-6 development tools?
Yes, the XA6SLX45T-3FGG484I uses the same bitstream format and design flow as commercial Spartan-6 FPGAs. It is fully supported by Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, simulation, and programming utilities. No toolchain modifications are required-only device-specific constraints and timing models differ.
XA6SLX45T-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX45T-3FGG484I FAQ
1.How can I place an order for XA6SLX45T-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX45T-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX45T-3FGG484I reliable?
The price and inventory of XA6SLX45T-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX45T-3FGG484I is usually 5 days.
3.What payment methods are accepted for XA6SLX45T-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX45T-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX45T-3FGG484I?
XA6SLX45T-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX45T-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX45T-3FGG484I?
For technical support, including XA6SLX45T-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX45T-3FGG484I requirements.
6.How does Aetrix verify that XA6SLX45T-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XA6SLX45T-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX45T-3FGG484I meets industry standards.
7.What is the process for return or replacement of XA6SLX45T-3FGG484I?
All XA6SLX45T-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX45T-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX45T-3FGG484I part is unused and in its original packaging.
Return procedure for XA6SLX45T-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XA6SLX45T-3FGG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

