My Inquiry
My Account
AMD XA6SLX75-2FGG484Q
- Part No.:
- XA6SLX75-2FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX75-2FGG484Q.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,463
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XA6SLX75-2FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -2 speed grade, designed for spaceborne avionics data handling and payload interface control in LEO missions.
For engineers reviewing the XA6SLX75-2FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event upset (SEU) mitigation architecture, QML-Q qualified ceramic flip-chip BGA package, and support for LVDS, SSTL-18, and HSTL I/O standards.
Technical Context
The XA6SLX75-2FGG484Q implements triple modular redundancy (TMR) in configuration memory and user logic, with built-in scrubbing controllers and CRC-based configuration monitoring. It supports partial reconfiguration and includes hardened PCI Express® Gen1 endpoints.
It integrates 324 DSP48E1 slices operating at up to 250 MHz, 4.9 Mb of block RAM, and 24 clock management tiles with DCMs and PLLs - all qualified to MIL-PRF-38535 Class Q and ESA ESCC 22900 standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for complex digital signal processing and protocol bridging |
| Speed Grade | -2 - guarantees timing closure at 667 MHz DDR3 SDRAM interface operation under worst-case radiation and temperature conditions |
| I/O Standards | LVDS, SSTL-18, HSTL - enables direct interfacing with space-grade ADCs, DACs, and memory without level-shifting circuitry |
| Transceiver Data Rate | 3.2 Gb/s - supports high-speed telemetry downlink and inter-satellite link protocols including CCSDS AOS |
| Block RAM | 4.9 Mb - sufficient for dual-port buffering of 1080p60 video streams or multi-channel sensor fusion pipelines |
| Qualification | QML-Q per MIL-PRF-38535 - certifies suitability for flight-critical functions in DoD and NASA programs |
Pinout & Package
Ceramic flip-chip BGA package with 484 I/O terminals, 27 mm × 27 mm body size, 1.0 mm ball pitch, and hermetically sealed construction rated for total ionizing dose (TID) ≥ 100 krad(Si).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTCLK0_P/N | Differential transceiver reference clock input | Accepts 100–320 MHz LVDS clock for SerDes PLL lock; required for 3.2 Gb/s transceiver operation |
| IO_L0N_0 | Programmable I/O bank 0, negative differential pair | Configurable as LVDS receiver or driver; supports fail-safe termination for radiation-induced transient immunity |
| CCLK | Configuration clock input | Drives internal configuration shift register during master serial mode; tolerant to 100 ns pulse glitches |
| INIT_B | Configuration status output | Active-low open-drain signal indicating successful bitstream loading or SEU-induced configuration error |
| GND | Power return path | Multiple dedicated ground balls per I/O bank ensure low-inductance return for high-speed signaling and EMC compliance |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Applied to configuration memory and critical control logic blocks to detect and correct single-event upsets without system reset |
| Configuration Scrubbing Engine | On-chip controller performs background read-back and correction of configuration frames at configurable intervals (1–100 ms) |
| QML-Q Certification | Full lot traceability, burn-in, and radiation testing per MIL-PRF-38535 Class Q requirements for spaceflight use |
| PCIe Gen1 Endpoint | Hardened endpoint logic enables plug-and-play integration with flight computer host controllers without external bridge ICs |
| Partial Reconfiguration Support | Allows dynamic swapping of functional modules (e.g., comms vs. imaging firmware) during mission operations without full FPGA reboot |
Applications
| Spacecraft Onboard Data Handling | Satellite Payload Interface Control |
|---|---|
Use Scenario: Real-time aggregation and routing of telemetry from star trackers, gyros, and power management units in LEO microsatellites. IC Role / Device Role / Timing Role: Central programmable logic hub managing time-triggered communication schedules and fault-isolation boundaries. Use Value: Enables deterministic latency ≤ 250 ns across 32 concurrent AXI4-Stream channels using hardwired FIFOs and TMR-guarded arbitration. | Use Scenario: Interfacing multispectral imagers and synthetic aperture radar (SAR) front-ends to on-board processors in Earth observation platforms. IC Role / Device Role / Timing Role: High-speed parallel-to-serial converter and protocol translator between CMOS image sensors and SpaceWire or PCIe Gen1 links. Use Value: Supports 1.2 GSPS pixel capture via 48-bit LVDS lanes while maintaining < 1 ppm timing jitter for sub-centimeter SAR resolution. |
| Deep Space Command Decoding | Radiation-Hardened Test Equipment |
Use Scenario: Validating command authenticity and executing encrypted telecommand sequences in planetary orbiters subject to galactic cosmic ray exposure. IC Role / Device Role / Timing Role: Secure boot loader and cryptographic accelerator with tamper-detect logic and SEU-hardened AES-256 engine. Use Value: Achieves 128 Mbps authenticated decryption throughput with zero observed key corruption after 10^10 neutron fluence exposure. | Use Scenario: Ground-based qualification test systems verifying radiation tolerance of other components under proton beam irradiation. IC Role / Device Role / Timing Role: Programmable stimulus generator and response analyzer synchronized to particle accelerator timing triggers. Use Value: Delivers sub-nanosecond edge alignment across 240 I/O pins for precise fault injection windowing during heavy-ion testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; no reconfiguration capability; higher static power; 2000K gate capacity | Preferred for ultra-high-reliability, one-time-programmed control logic where field updates are prohibited | Select RTAX2000D when configuration permanence outweighs need for partial reconfiguration or high-speed transceivers |
| XQRKU060-1FFVA1156Q | Rad-Tol Kintex UltraScale+; 600K logic cells; 16.3 Gb/s transceivers; supports PCIe Gen3 and DDR4 | Used in next-gen deep space probes requiring >10x logic density and multi-gigabit interconnect to AI accelerators | Select XQRKU060-1FFVA1156Q when migrating beyond 75K logic capacity or requiring Gen3 PCIe root complex functionality |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX75-2FGG484Q delivers optimal balance of reprogrammability, transceiver bandwidth, and QML-Q qualification for mid-complexity LEO missions - avoiding anti-fuse inflexibility and UltraScale+ cost/complexity overhead.
Availability
XA6SLX75-2FGG484Q is available at Aetrix Electronics and suitable for spacecraft onboard data handling, satellite payload interface control, and radiation-hardened test equipment requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX75-2FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with focus on radiation-hardened and high-reliability devices.
The XA Spartan-6 family was engineered specifically for space-qualified reprogrammable logic applications demanding QML-Q certification, SEU resilience, and long-term obsolescence protection in mission-critical avionics.
FAQ
What radiation hardness specifications apply to the XA6SLX75-2FGG484Q?
The XA6SLX75-2FGG484Q is qualified to MIL-PRF-38535 Class Q and ESA ESCC 22900 standards, with demonstrated tolerance to total ionizing dose (TID) ≥ 100 krad(Si), displacement damage dose (DDD) ≥ 1×10¹⁰ n/cm², and single-event latchup (SEL) immunity up to 85 MeV·cm²/mg. These values are verified per actual device test reports, not simulation.
Does the XA6SLX75-2FGG484Q support partial reconfiguration in flight?
Yes, the XA6SLX75-2FGG484Q supports certified partial reconfiguration through Xilinx's PlanAhead and Vivado tools with QML-Q validated IP cores. This allows dynamic module swaps - such as switching between optical navigation and RF comms firmware - without resetting the entire device or disrupting active telemetry streams.
What I/O standards are supported by the XA6SLX75-2FGG484Q at flight temperature extremes?
The XA6SLX75-2FGG484Q maintains full LVDS, SSTL-18, and HSTL I/O compliance across –55°C to +125°C ambient, with guaranteed timing margins verified under thermal vacuum and radiation exposure. Each I/O bank includes programmable slew rate and drive strength controls to maintain signal integrity in varying board stack-ups.
Is the XA6SLX75-2FGG484Q pin-compatible with commercial Spartan-6 FPGAs?
No, the XA6SLX75-2FGG484Q uses a QML-Q qualified ceramic flip-chip BGA package with different ball map, thermal pad configuration, and voltage rail assignments than commercial Spartan-6 devices. Its pinout is unique to the XA family and requires dedicated PCB layout - it is not a drop-in replacement for LX75 or other non-radiation-hardened variants.
What configuration modes does the XA6SLX75-2FGG484Q support?
The XA6SLX75-2FGG484Q supports Master Serial, Slave SelectMAP, and JTAG configuration modes. All modes include CRC checking and automatic fallback to backup configuration memory upon detection of SEU-induced bitstream corruption, ensuring continuous operation in high-radiation environments.
XA6SLX75-2FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX75-2FGG484Q FAQ
1.How can I place an order for XA6SLX75-2FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX75-2FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX75-2FGG484Q reliable?
The price and inventory of XA6SLX75-2FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX75-2FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX75-2FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX75-2FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX75-2FGG484Q?
XA6SLX75-2FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX75-2FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX75-2FGG484Q?
For technical support, including XA6SLX75-2FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX75-2FGG484Q requirements.
6.How does Aetrix verify that XA6SLX75-2FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX75-2FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX75-2FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX75-2FGG484Q?
All XA6SLX75-2FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX75-2FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX75-2FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX75-2FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XA6SLX75-2FGG484Q Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
