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AMD XA6SLX75-3CSG484Q
- Part No.:
- XA6SLX75-3CSG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XA6SLX75-3CSG484Q.pdf
- Description:
- IC FPGA 328 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,599
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Product details
Overview
XA6SLX75-3CSG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -3 speed grade, designed for spaceborne avionics data handling and onboard processing in LEO/MEO missions.
For engineers reviewing the XA6SLX75-3CSG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event latch-up (SEL) immunity, total ionizing dose (TID) rating of 100 krad(Si), and qualified operation at -40°C to +100°C under proton and gamma irradiation.
Technical Context
The XA6SLX75-3CSG484Q implements a configurable logic block (CLB) architecture with distributed RAM, shift registers, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual 10-bit ADCs and supports SelectIO™ standards including LVDS, SSTL, and HSTL.
Configuration is performed via serial NOR flash or JTAG, with built-in SEU mitigation using CRC-based frame monitoring and automatic reconfiguration. The device includes hardened PCIe® Gen1 endpoint logic and supports partial reconfiguration for mission-critical runtime adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for complex digital signal processing and control logic |
| TID Rating | 100 krad(Si) - validated for long-duration operation in high-radiation orbital environments without functional degradation |
| SEL Immunity | >75 MeV·cm²/mg - withstands heavy-ion strikes without destructive latch-up up to specified LET threshold |
| Operating Temp | -40°C to +100°C - qualified across full range under irradiation for use in unheated or passively cooled spacecraft bays |
| Transceiver Speed | 3.2 Gb/s - enables high-throughput interconnect between imaging sensors, telemetry units, and downlink modems |
| Config Interface | Serial NOR + JTAG - supports secure, field-upgradable configuration with tamper-resistant bitstream encryption |
Pinout & Package
XA6SLX75-3CSG484Q is housed in a 484-pin CSG (Chip-Scale Grid Array) package with 0.8 mm pitch, optimized for low-inductance power delivery and thermal dissipation in vacuum environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.2 V core supply input - requires local low-noise regulation and decoupling for stable CLB/DSP operation |
| K19 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, I/O banks, and transceivers |
| P20 | PROGRAM_B | Active-low asynchronous reset - initiates full configuration reload on assertion, critical for recovery after SEU events |
| R18 | DONE | Open-drain status output - signals successful configuration completion and readiness for user logic execution |
| A12 | CLKIN | Dedicated global clock input - accepts single-ended or differential clocks up to 500 MHz for timing-critical subsystems |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened-by-process (RHBP) | Manufactured on 45 nm bulk CMOS with epitaxial substrate and guard-ring isolation to suppress SEL and reduce TID-induced leakage |
| SEU Mitigation | CRC-protected configuration frames with automatic scrubbing and error-triggered partial reconfiguration to maintain logic integrity |
| Dual 10-bit ADCs | On-chip analog-to-digital conversion at up to 1 MSPS per channel for sensor monitoring without external ADC components |
| SelectIO™ Standards | Support for 18 I/O standards including LVDS, SSTL-2, and HSTL-I - enables direct interface to FPGAs, ADCs, DACs, and memory in mixed-signal payloads |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time collection, formatting, and compression of housekeeping data from power, thermal, and payload subsystems before downlink. IC Role / Device Role / Timing Role: Central data concentrator and protocol engine implementing CCSDS packetization and Reed-Solomon encoding. Use Value: Radiation tolerance ensures uninterrupted telemetry stream during solar particle events; 74,880 logic cells support concurrent encoding, encryption, and buffer management. | Use Scenario: Closed-loop processing of star tracker, gyroscope, and magnetometer inputs to compute quaternion-based attitude solutions. IC Role / Device Role / Timing Role: Deterministic real-time controller executing Kalman filter algorithms with sub-microsecond interrupt latency. Use Value: -3 speed grade guarantees 100 MHz+ system clock stability under radiation-induced timing derating; DSP48A1 slices accelerate matrix operations. |
| Spaceborne Imaging Payload Interface | Secure Command & Control Processor |
Use Scenario: High-speed bridging between CMOS image sensors (LVDS output) and solid-state mass memory with on-the-fly JPEG2000 compression. IC Role / Device Role / Timing Role: Pixel-domain serializer/deserializer and programmable image pipeline accelerator. Use Value: 3.2 Gb/s transceivers sustain 4× LVDS lanes at 800 Mbps each; SelectIO™ compatibility eliminates level-shifting components. | Use Scenario: Authentication, decryption, and validation of uplinked commands prior to execution by flight software. IC Role / Device Role / Timing Role: Secure boot root-of-trust module with AES-256 bitstream encryption and SHA-256 signature verification. Use Value: Tamper-resistant configuration memory and JTAG lockdown prevent unauthorized reprogramming; TID/SEL ratings ensure security logic remains intact over mission lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA with no reconfiguration capability; higher static power; 2M system gates | Fixed-function, non-reprogrammable logic; suited for permanent control paths but not adaptive payloads | Choose RTAX2000D when deterministic, zero-reconfiguration-risk logic is required and partial reconfiguration is unnecessary |
| XA7VX415T-1RF1760Q | Virtex-7 radiation-tolerant FPGA with 415K logic cells, 13.1 Gb/s transceivers, and higher power envelope | Enables more complex SDR radios and AI-accelerated processing; requires enhanced thermal management | Choose XA7VX415T-1RF1760Q when >74K logic cells or multi-gigabit serial links beyond 3.2 Gb/s are required |
Compared with RTAX2000D and XA7VX415T-1RF1760Q, the XA6SLX75-3CSG484Q delivers optimal balance of reconfigurability, radiation hardness, and power efficiency for mid-complexity space computing tasks - especially where partial reconfiguration and embedded ADCs provide architectural advantage.
Availability
XA6SLX75-3CSG484Q is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard attitude determination, spaceborne imaging interfaces, and secure command processors requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX75-3CSG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering high-performance and adaptive computing solutions for aerospace, defense, and industrial markets.
The XA6SLX75-3CSG484Q belongs to AMD's Xilinx Aerospace family, engineered specifically for radiation-hardened reconfigurable computing in low-Earth and medium-Earth orbit platforms.
FAQ
What radiation hardness specifications apply to the XA6SLX75-3CSG484Q?
The XA6SLX75-3CSG484Q is characterized for total ionizing dose (TID) tolerance up to 100 krad(Si) and single-event latch-up (SEL) immunity exceeding 75 MeV·cm²/mg. These values are verified per MIL-STD-883 TM1019.4 and ESA ESCC 22900 standards under proton and gamma irradiation. The XA6SLX75-3CSG484Q maintains full functionality within these limits without derating.
Does the XA6SLX75-3CSG484Q support partial reconfiguration?
Yes, the XA6SLX75-3CSG484Q supports hardware-accelerated partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows dynamic replacement of logic modules during operation - essential for fault recovery and adaptive mission modes. The XA6SLX75-3CSG484Q implements CRC-based frame monitoring to trigger safe reconfiguration upon detected SEU corruption.
What is the maximum operating temperature for the XA6SLX75-3CSG484Q under irradiation?
The XA6SLX75-3CSG484Q is fully qualified for continuous operation from -40°C to +100°C, including under combined thermal and radiation stress per ESA ESCC 22900. Performance parameters such as setup/hold timing and transceiver jitter remain within specification across this range when irradiated up to 100 krad(Si).
How does the XA6SLX75-3CSG484Q handle configuration memory security?
The XA6SLX75-3CSG484Q supports AES-256 bitstream encryption with external key storage and HMAC-based authentication. Configuration readback is disabled by hardware fuse, and JTAG access can be locked post-configuration. These features ensure that the XA6SLX75-3CSG484Q resists reverse engineering and unauthorized reprogramming in deployed systems.
Is the XA6SLX75-3CSG484Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX75-3CSG484Q uses a radiation-hardened process and packaging that differ from commercial Spartan-6 FPGAs. While logic architecture and HDL compatibility are preserved, the XA6SLX75-3CSG484Q has distinct power sequencing requirements, voltage tolerances, and thermal pad layout. PCB design must follow the XA6SLX75-3CSG484Q-specific mechanical and electrical guidelines.
XA6SLX75-3CSG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 328
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-CSPBGA (19x19)
XA6SLX75-3CSG484Q FAQ
1.How can I place an order for XA6SLX75-3CSG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX75-3CSG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX75-3CSG484Q reliable?
The price and inventory of XA6SLX75-3CSG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX75-3CSG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX75-3CSG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX75-3CSG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX75-3CSG484Q?
XA6SLX75-3CSG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX75-3CSG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX75-3CSG484Q?
For technical support, including XA6SLX75-3CSG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX75-3CSG484Q requirements.
6.How does Aetrix verify that XA6SLX75-3CSG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX75-3CSG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX75-3CSG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX75-3CSG484Q?
All XA6SLX75-3CSG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX75-3CSG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX75-3CSG484Q part is unused and in its original packaging.
Return procedure for XA6SLX75-3CSG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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