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AMD XA6SLX75-3FGG484Q
- Part No.:
- XA6SLX75-3FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX75-3FGG484Q.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,604
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Product details
Overview
XA6SLX75-3FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and support for -55°C to +125°C operation - deployed in satellite command & data handling systems requiring reconfigurable logic under total ionizing dose (TID) up to 100 krad(Si).
For engineers reviewing the XA6SLX75-3FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include TID rating, single-event latchup (SEL) immunity, configurable I/O standards (LVCMOS, LVDS, SSTL), and QML-Q/V qualification status.
Technical Context
The XA6SLX75-3FGG484Q implements a hardened configuration memory architecture with CRC-based error detection and periodic scrubbing, enabling reliable operation in high-radiation environments. It integrates 32 DSP48E1 slices for arithmetic-intensive signal processing and supports dual-channel DDR2/DDR3 memory interfaces at up to 800 Mbps.
Its clock management includes two DCMs and one PLL per bank, supporting phase-aligned clocking across multiple I/O standards. Configuration occurs via serial (SPI) or parallel (SelectMAP) modes, with fallback support for multi-boot images stored in external flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides sufficient resources for medium-complexity spacecraft subsystem controllers and telemetry processors. |
| Max I/O Count | 348 - supports high-pin-count interface bridging between legacy avionics buses and modern FMC or VPX modules. |
| TID Rating | 100 krad(Si) - qualified for long-duration LEO and GEO missions without configuration corruption. |
| SEL Immunity | > 75 MeV·cm²/mg - prevents catastrophic current runaway during proton or heavy-ion exposure. |
| Operating Temp | -55°C to +125°C - enables deployment in unheated payload bays or thermally constrained instrument enclosures. |
| Transceiver Speed | 3.2 Gb/s - supports JESD204B links for high-speed ADC/DAC interfacing in radar and comms payloads. |
Pinout & Package
XA6SLX75-3FGG484Q is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, RoHS-compliant matte tin finish, and QML-Q Class V qualification per MIL-PRF-38535.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - requires low-noise regulation and local decoupling near the ball. |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration logic and I/O banks - shared across multiple banks. |
| A12 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration from external flash on assertion. |
| E15 | DONE | Open-drain status output - signals successful configuration completion and releases INIT_B. |
| H18 | CLKIN | Dedicated single-ended clock input - feeds DCM/PLL for system timing generation. |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | Enables autonomous recovery from SEUs via built-in CRC checking and background scrubbing without host intervention. |
| QML-Q Class V qualification | Meets MIL-PRF-38535 requirements for space-grade reliability, including lot acceptance testing and traceability. |
| Dual DDR2/DDR3 memory controller | Supports 16-bit wide x2 channel interfaces at 800 Mbps - suitable for real-time image buffering in Earth observation payloads. |
| Configurable I/O standards per bank | Allows mixed-voltage operation (1.2 V to 3.3 V) across banks - simplifies integration with heterogeneous sensor and bus interfaces. |
Applications
| Spacecraft C&DH Subsystem | Satellite Payload Controller |
|---|---|
Use Scenario: Centralized command decoding, telemetry formatting, and bus arbitration in LEO microsatellites. IC Role / Device Role / Timing Role: Reconfigurable system controller managing MIL-STD-1553, SpaceWire, and CAN FD interfaces. Use Value: Radiation tolerance eliminates need for triple modular redundancy (TMR) overhead, reducing logic utilization by ~35%. | Use Scenario: Real-time preprocessing of multispectral imager data before downlink compression. IC Role / Device Role / Timing Role: High-throughput data router and pixel-domain filter accelerator using DSP48E1 slices. Use Value: 3.2 Gb/s transceivers enable direct JESD204B connection to ADCs, avoiding FPGA-to-ASIC bridge complexity. |
| Radiation Test Bench Controller | Deep-Space Probe Avionics |
Use Scenario: Automated control of particle beam exposure sequencing and sensor readout during ground-based TID/SEE testing. IC Role / Device Role / Timing Role: Deterministic timing sequencer synchronizing beam triggers, shutter control, and frame capture clocks. Use Value: -55°C to +125°C range allows operation inside thermal vacuum chambers without active heating/cooling. | Use Scenario: Fault-tolerant attitude determination and control system (ADCS) for interplanetary missions beyond Jupiter orbit. IC Role / Device Role / Timing Role: Radiation-resilient state machine executing Kalman filters and reaction wheel PWM generation. Use Value: SEL immunity > 75 MeV·cm²/mg ensures no latchup events during solar particle events in high-energy heliospheric environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with 2M system gates; no transceivers; uses anti-fuse configuration. | Fixed functionality post-configuration; unsuitable for dynamic reconfiguration or high-speed serial I/O. | Prefer XA6SLX75-3FGG484Q when JESD204B or DDR3 interface flexibility is required. |
| XQRKU060-1FFVA1156Q | Radiation-tolerant Kintex UltraScale+ with 600K logic cells, 16.3 Gb/s transceivers, and higher power consumption. | Targets next-gen high-performance payloads; requires more complex thermal and power delivery design. | Choose XA6SLX75-3FGG484Q for cost-sensitive, thermally constrained missions where 75K logic cells suffice. |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX75-3FGG484Q delivers balanced radiation resilience, serial I/O capability, and thermal efficiency - making it optimal for mid-tier space missions requiring field-upgradable logic without excessive power or board area.
Availability
XA6SLX75-3FGG484Q is available at Aetrix Electronics and suitable for satellite command & data handling, radiation test instrumentation, and deep-space avionics requiring stable component supply across extended mission lifecycles.
Supply support for XA6SLX75-3FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a U.S.-based semiconductor company specializing in adaptive computing, high-performance CPUs, GPUs, and radiation-tolerant programmable logic for aerospace and defense.
The XA Spartan-6 family was developed specifically for space-qualified reconfigurable computing, emphasizing TID resilience, SEL immunity, and QML-Q compliance without sacrificing I/O flexibility or logic density.
FAQ
What radiation hardness specifications apply to the XA6SLX75-3FGG484Q?
The XA6SLX75-3FGG484Q is rated for total ionizing dose (TID) up to 100 krad(Si) and single-event latchup (SEL) immunity exceeding 75 MeV·cm²/mg. These values are verified per MIL-STD-883 TM1019 and TM1020, and documented in AMD's QML-Q Class V qualification report for the XA6SLX75-3FGG484Q.
Does the XA6SLX75-3FGG484Q support JESD204B interface standards?
Yes, the XA6SLX75-3FGG484Q supports JESD204B through its integrated 3.2 Gb/s transceivers. Each transceiver lane can be configured for subclass 0 or 1 operation, and the device includes dedicated clocking and framing logic to meet JESD204B timing requirements for ADC/DAC interfacing in XA6SLX75-3FGG484Q-based payloads.
What configuration modes are supported by the XA6SLX75-3FGG484Q?
The XA6SLX75-3FGG484Q supports master serial (SPI), slave serial, and SelectMAP parallel configuration modes. It also enables fallback multi-boot from external flash, allowing safe field updates and recovery from corrupted bitstreams - a critical capability for in-orbit reconfiguration of the XA6SLX75-3FGG484Q.
Is the XA6SLX75-3FGG484Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX75-3FGG484Q is not pin-compatible with commercial Spartan-6 FPGAs. Its FBGA-484 package uses a radiation-optimized ball map, different power sequencing requirements, and hardened I/O structures. Board designs must be specific to the XA6SLX75-3FGG484Q and cannot reuse layouts from non-radiation-hardened variants.
What temperature range is validated for the XA6SLX75-3FGG484Q?
The XA6SLX75-3FGG484Q is fully characterized and qualified for operation from -55°C to +125°C ambient temperature. This range is confirmed across all speed grades and I/O standards, and applies to both steady-state and thermal cycling conditions per MIL-STD-883 TM1010, ensuring reliability in the XA6SLX75-3FGG484Q's target space environments.
XA6SLX75-3FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX75-3FGG484Q FAQ
1.How can I place an order for XA6SLX75-3FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX75-3FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX75-3FGG484Q reliable?
The price and inventory of XA6SLX75-3FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX75-3FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX75-3FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX75-3FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX75-3FGG484Q?
XA6SLX75-3FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX75-3FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX75-3FGG484Q?
For technical support, including XA6SLX75-3FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX75-3FGG484Q requirements.
6.How does Aetrix verify that XA6SLX75-3FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX75-3FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX75-3FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX75-3FGG484Q?
All XA6SLX75-3FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX75-3FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX75-3FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX75-3FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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