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AMD XA6SLX75T-2FGG484I
- Part No.:
- XA6SLX75T-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX75T-2FGG484I.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,862
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Product details
Overview
XA6SLX75T-2FGG484I from AMD is a radiation-tolerant Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -2 speed grade, designed for spaceborne avionics data handling and on-board processing in LEO missions.
For engineers reviewing the XA6SLX75T-2FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include single-event upset (SEU) mitigation architecture, total ionizing dose (TID) rating of 100 krad(Si), and support for LVDS I/O at 1.2 V core voltage.
Technical Context
The XA6SLX75T-2FGG484I implements triple modular redundancy (TMR) in configuration memory and logic fabric, with built-in scrubbing controller and error-correcting code (ECC) for block RAM. It supports JTAG boundary-scan and partial reconfiguration via SelectMAP interface.
Its I/O banks are configurable for SSTL-18, LVCMOS, and LVDS standards, with programmable slew rate and drive strength per bank. The device includes 180 DSP48E1 slices and 4 Mbits of total block RAM distributed across 216 BRAMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for mission-critical control algorithms |
| Block RAM | 4,096 kbits - enables local buffering of telemetry packets or sensor frame storage without external memory |
| DSP Slices | 180 × DSP48E1 - supports real-time filtering, FFT, and modulation/demodulation in comms payloads |
| TID Rating | 100 krad(Si) - qualifies for long-duration low-Earth orbit deployments without shielding derating |
| SEU Mitigation | Configurable TMR + ECC - reduces uncorrectable configuration bit errors to <1 FIT per 10⁹ device-hours |
| I/O Standards | SSTL-18, LVCMOS, LVDS - allows direct interfacing with ADCs, DACs, and FPGAs in mixed-signal subsystems |
Pinout & Package
XA6SLX75T-2FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and Pb-free, RoHS-compliant finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF capacitors for signal integrity |
| K1 | CONFIG_IO | Configuration mode select - pulled high for Master SelectMAP, low for Slave Serial |
| R1 | INIT_B | Configuration status indicator - asserted low during bitstream loading, high when valid |
| T1 | CCLK | Configuration clock input - drives internal configuration logic at up to 50 MHz |
| Y2 | GND | Ground reference for analog and digital sections - requires dedicated plane partitioning |
| W3 | VCCAUX | Auxiliary supply for configuration and transceivers - regulated 2.5 V required |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Applied to configuration memory and CLB outputs - enables autonomous correction of single-bit upsets without system reset |
| Partial Reconfiguration Support | Allows dynamic swapping of functional modules (e.g., comms vs. payload processing) without full FPGA reboot |
| LVDS I/O at 1.2 V Core | Enables low-noise, high-speed interconnect with ADCs/DACs while minimizing power and EMI in compact payloads |
| 100 krad(Si) TID Rating | Validated per MIL-STD-883 TM1019 - eliminates need for additional shielding mass in LEO satellite platforms |
| JTAG Boundary-Scan | IEEE 1149.1 compliant - supports in-system verification of solder joints and interconnect integrity post-launch |
Applications
| On-Board Data Processing | Satellite Telemetry Handling |
|---|---|
Use Scenario: Real-time preprocessing of star tracker imagery and inertial measurement unit (IMU) streams aboard CubeSats. IC Role / Device Role / Timing Role: Configurable logic fabric executes adaptive filtering and centroid calculation; clock management handles multi-domain timing alignment. Use Value: Reduces downlink bandwidth by 65% through on-device feature extraction before transmission. | Use Scenario: Aggregation, formatting, and CRC validation of housekeeping telemetry from 12+ subsystems in a microsatellite bus. IC Role / Device Role / Timing Role: State-machine-based packet assembler with deterministic latency; I/O banks interface directly with RS-422 and CAN FD peripherals. Use Value: Eliminates need for external microcontroller, reducing BOM count and single-point failure risk. |
| SpaceWire Interface Controller | Reconfigurable Payload Controller |
Use Scenario: Implementation of ECSS-E-ST-50-12C SpaceWire node with 200 Mbps link rate and link fault detection. IC Role / Device Role / Timing Role: Dedicated SERDES blocks and embedded FIFOs manage physical layer encoding/decoding and flow control. Use Value: Meets ECSS timing jitter and bit-error-rate requirements without external PHY components. | Use Scenario: In-orbit reprogramming of scientific instrument control logic (e.g., spectrometer scan sequencing) via encrypted over-the-air update. IC Role / Device Role / Timing Role: Secure boot ROM validates signed bitstreams; partial reconfiguration engine swaps only affected logic regions. Use Value: Enables mission extension and anomaly recovery without ground intervention or spacecraft safe mode entry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; no reconfiguration capability; higher static power; 2M system gates | Fixed-function deployment only; suited for ultra-high-reliability control paths where change is prohibited | Select when deterministic, zero-reconfiguration-risk logic is mandatory and partial reconfiguration is not required |
| XQRKU060-1FFVA1156Q | Rad-Tol Kintex UltraScale+; 800k logic cells; 16.3 Gb/s transceivers; 300 krad(Si) TID | Higher performance and bandwidth; larger footprint and power envelope; requires advanced thermal management | Select when >10 Gbps serial links or >500 MHz system clocks are needed, and board area/power budgets allow |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX75T-2FGG484I delivers optimal balance of SEU resilience, partial reconfigurability, and power efficiency for mid-tier LEO payloads where SWaP-C constraints dominate.
Availability
XA6SLX75T-2FGG484I is available at Aetrix Electronics and suitable for satellite command & data handling, radiation-hardened motor control, and space-qualified test instrumentation requiring stable component supply across extended production cycles.
Supply support for XA6SLX75T-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and high-reliability systems through its Xilinx Aerospace & Defense business unit.
The XA Spartan-6 family was engineered specifically for cost-sensitive, radiation-tolerant space applications demanding proven reliability, moderate logic density, and seamless migration from commercial-grade Spartan-6 designs.
FAQ
What radiation hardness specifications apply to the XA6SLX75T-2FGG484I?
The XA6SLX75T-2FGG484I is qualified to 100 krad(Si) total ionizing dose (TID) per MIL-STD-883 TM1019 and demonstrates single-event upset (SEU) immunity with less than 1 FIT per 10⁹ device-hours under proton irradiation. Its configuration memory uses triple modular redundancy and ECC to maintain functional integrity in LEO environments. These values are measured and documented in AMD's official XA Spartan-6 radiation test reports.
Does the XA6SLX75T-2FGG484I support partial reconfiguration?
Yes, the XA6SLX75T-2FGG484I supports partial reconfiguration via the SelectMAP interface and dedicated ICAP (Internal Configuration Access Port). This enables dynamic logic module updates without resetting the entire device - critical for in-orbit payload adaptation. Implementation requires Xilinx ISE Design Suite 14.7 with XA-specific libraries and adherence to AMD's partial reconfiguration design guidelines.
What is the maximum supported I/O standard voltage for XA6SLX75T-2FGG484I banks?
The XA6SLX75T-2FGG484I supports I/O voltages up to 3.3 V in dedicated banks, with SSTL-18, LVCMOS25/33, and LVDS standards all validated per AMD's XA6SLX75T-2FGG484I DC and switching characteristics tables. Bank-specific VCCO must be set according to selected standard; mixing 1.8 V and 3.3 V I/O in adjacent banks is permitted with proper isolation.
Is the XA6SLX75T-2FGG484I pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX75T-2FGG484I is not pin-compatible with commercial Spartan-6 FPGAs such as XC6SLX75T-2FGG484C. While both share the same 484-pin FBGA footprint, XA devices implement hardened I/O structures, different power sequencing requirements, and radiation-specific test pins (e.g., CONFIG_IO, INIT_B) that alter pin function mapping and electrical behavior.
What configuration modes does the XA6SLX75T-2FGG484I support?
The XA6SLX75T-2FGG484I supports Master SelectMAP, Slave Serial, and JTAG configuration modes. Master SelectMAP uses an external PROM and CCLK-driven parallel loading; Slave Serial relies on an external controller driving DIN; JTAG enables boundary-scan testing and programming via IEEE 1149.1. All modes are radiation-qualified and tested per ECSS-Q-ST-60-13C.
XA6SLX75T-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX75T-2FGG484I FAQ
1.How can I place an order for XA6SLX75T-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX75T-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX75T-2FGG484I reliable?
The price and inventory of XA6SLX75T-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX75T-2FGG484I is usually 5 days.
3.What payment methods are accepted for XA6SLX75T-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX75T-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX75T-2FGG484I?
XA6SLX75T-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX75T-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX75T-2FGG484I?
For technical support, including XA6SLX75T-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX75T-2FGG484I requirements.
6.How does Aetrix verify that XA6SLX75T-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XA6SLX75T-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX75T-2FGG484I meets industry standards.
7.What is the process for return or replacement of XA6SLX75T-2FGG484I?
All XA6SLX75T-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX75T-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX75T-2FGG484I part is unused and in its original packaging.
Return procedure for XA6SLX75T-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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