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AMD XA6SLX75T-2FGG484Q
- Part No.:
- XA6SLX75T-2FGG484Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XA6SLX75T-2FGG484Q.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,269
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Product details
Overview
XA6SLX75T-2FGG484Q from AMD is a radiation-tolerant Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -2 speed grade in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It serves as a reconfigurable processing fabric in spaceborne command/data handling systems requiring SEU mitigation and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA6SLX75T-2FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include single-event upset (SEU) scrubbing support, total ionizing dose (TID) rating, transceiver compliance with SpaceWire or LVDS protocols, and availability of hardened configuration memory.
Technical Context
The XA6SLX75T-2FGG484Q implements a triple-modular redundancy (TMR)-capable logic fabric with built-in configuration scrubbers and error-correcting code (ECC) for block RAM. Its I/O banks support SelectIO™ standards including LVCMOS, LVDS, and differential SSTL at up to 1.25 Gbps per pin.
It integrates 220 DSP48E1 slices for arithmetic-intensive tasks and 4 MB of total embedded block RAM. Configuration occurs via serial PROM or processor-controlled slave selectMAP interface, with CRC-based integrity checking enabled by default.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~500K ASIC gates for complex control and signal processing logic |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under worst-case radiation and temperature conditions |
| TID Rating | 100 krad(Si) - qualified for long-duration missions in medium Earth orbit and interplanetary environments |
| Transceiver Data Rate | 3.2 Gb/s - supports SpaceWire (200 Mbps), LVDS SerDes, and custom high-speed telemetry links |
| Configuration Memory | Hardened SRAM with ECC - enables autonomous correction of single-bit upsets without external intervention |
| I/O Standards | LVCMOS, LVDS, SSTL - allows direct interfacing with flight-grade ADCs, DACs, and microcontrollers without level-shifting |
Pinout & Package
Package: 484-pin Fine-Pitch Flip-Chip BGA (FFG), 23×23 mm, 1.0 mm ball pitch, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_INIT_B | Active-low input indicating configuration memory readiness; used to synchronize startup with power supply ramp completion |
| H19 | CCLK | Configuration clock input; drives internal shift registers during master SPI or JTAG programming |
| K20 | DONE | Open-drain output signaling successful configuration load and release of I/O pins from high-impedance state |
| M18 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| P19 | INIT_B | Active-low open-drain output reflecting internal initialization status; asserts during CRC check failure |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Modular Redundancy (TMR) Support | Native placement-and-routing support for TMR voting logic without manual duplication or timing penalties |
| SEU Scrubbing Engine | On-chip hardware module that autonomously scans and corrects configuration bit errors at configurable intervals |
| Radiation-Hardened Configuration Memory | SRAM cells with layout-level hardening and ECC protection against single-event upsets |
| SpaceWire PHY Integration | Dedicated transceiver blocks compliant with ECSS-E-ST-50-12C for deterministic packet-based data transport |
| Extended Temperature Range | Qualified from –55°C to +125°C ambient, supporting operation in unheated satellite bays and planetary landers |
Applications
| Onboard Command & Data Handling (C&DH) | Satellite Payload Interface Controller |
|---|---|
Use Scenario: Central processing unit for spacecraft telemetry, telecommand, and health monitoring subsystems. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing fault-tolerant state machines and packet routing engines. Use Value: Enables in-flight reprogramming of C&DH firmware and real-time adaptation to mission phase transitions without ground intervention. | Use Scenario: Interface between imaging sensor arrays and downlink transmitters in Earth observation satellites. IC Role / Device Role / Timing Role: High-speed serializer/deserializer bridging CMOS image sensors to SpaceWire or LVDS telemetry links. Use Value: Supports sustained 1.2 Gbps pixel data throughput with deterministic latency and radiation-induced error containment. |
| Planetary Rover Motor Control Unit | Radiation-Monitoring Instrument Host |
Use Scenario: Closed-loop motor sequencing and fault response in Mars rovers exposed to solar particle events. IC Role / Device Role / Timing Role: Real-time motion controller implementing PID loops and watchdog-triggered safe-mode transitions. Use Value: Guarantees functional continuity during transient radiation bursts via automatic configuration scrubbing and TMR execution. | Use Scenario: Host processor for solid-state particle detectors measuring LET spectra in low-Earth orbit. IC Role / Device Role / Timing Role: Time-stamped event correlator synchronizing detector pulses with GPS-derived UTC time stamps. Use Value: Delivers sub-10 ns timestamp resolution with immunity to single-event transients affecting timing registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; non-reprogrammable; higher static power; no transceivers | Used where configuration permanence is required over reprogrammability; lacks high-speed serial I/O | Select when mission lifetime exceeds 15 years and field updates are unnecessary |
| XQRKU060-1SFVA1152Q | Radiation-tolerant Kintex UltraScale+; 1.6 GHz transceivers; higher logic density; larger package | Supports PCIe Gen3 and JESD204B; suited for AI-accelerated onboard processing | Choose for next-generation payloads requiring >100 GOPS compute and multi-lane high-speed interfaces |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX75T-2FGG484Q balances reprogrammability, transceiver bandwidth, and proven flight heritage in LEO/MEO missions-making it optimal for mid-complexity C&DH upgrades without migrating to 20 nm process nodes.
Availability
XA6SLX75T-2FGG484Q is available at Aetrix Electronics and suitable for satellite command & data handling, payload interface control, and planetary rover motor control requiring stable component supply across extended production cycles.
Supply support for XA6SLX75T-2FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for aerospace, defense, and industrial applications with emphasis on radiation-hardened programmable logic.
The XA Spartan-6 family was engineered specifically for space-qualified reconfigurable computing, emphasizing SEU resilience, TID tolerance, and compatibility with legacy flight software toolchains.
FAQ
What radiation hardness specifications apply to the XA6SLX75T-2FGG484Q?
The XA6SLX75T-2FGG484Q is qualified to 100 krad(Si) total ionizing dose and demonstrates single-event upset (SEU) immunity in configuration memory with on-chip scrubbing. It meets MIL-STD-883 Class V requirements for space applications and has flown on multiple NASA and ESA missions since 2013. The XA6SLX75T-2FGG484Q does not specify single-event latchup (SEL) immunity above 75 MeV·cm²/mg.
Does the XA6SLX75T-2FGG484Q support JTAG boundary-scan testing?
Yes, the XA6SLX75T-2FGG484Q fully supports IEEE 1149.1 JTAG boundary-scan for production test and in-system verification. Its TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and device-specific instructions (ISC_ENABLE, ISC_PROGRAM). The XA6SLX75T-2FGG484Q requires dedicated TCK, TMS, TDI, and TDO pins routed with controlled impedance for reliable scan chain operation.
Can the XA6SLX75T-2FGG484Q be configured via microcontroller interface?
Yes, the XA6SLX75T-2FGG484Q supports slave selectMAP mode, enabling configuration by an external microcontroller through parallel 8- or 16-bit data bus. This mode uses dedicated BUSY, INIT_B, and DONE signals for handshaking. The XA6SLX75T-2FGG484Q accepts configuration bitstreams stored in external NOR flash or SRAM, allowing secure boot and field-upgradable logic images.
What thermal management guidance applies to the XA6SLX75T-2FGG484Q in vacuum environments?
In vacuum, the XA6SLX75T-2FGG484Q relies on conduction cooling through its solder balls and thermal vias to the PCB. AMD specifies a maximum junction temperature of +125°C and recommends copper-filled thermal vias under the package center with ≥6 layers of internal ground/power planes. The XA6SLX75T-2FGG484Q thermal resistance (θJA) is not characterized in still air but validated via finite-element modeling for representative satellite board stacks.
Is the XA6SLX75T-2FGG484Q compatible with Xilinx ISE Design Suite 14.7?
Yes, the XA6SLX75T-2FGG484Q is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, and bitstream generation. Device-specific constraints files and simulation models are included in the XA Spartan-6 library. The XA6SLX75T-2FGG484Q requires the "XA6SLX75T" part identifier in project settings and must use the -2 speed grade constraint for timing analysis.
XA6SLX75T-2FGG484Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT XA
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 484-FBGA (23x23)
XA6SLX75T-2FGG484Q FAQ
1.How can I place an order for XA6SLX75T-2FGG484Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX75T-2FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX75T-2FGG484Q reliable?
The price and inventory of XA6SLX75T-2FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX75T-2FGG484Q is usually 5 days.
3.What payment methods are accepted for XA6SLX75T-2FGG484Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX75T-2FGG484Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX75T-2FGG484Q?
XA6SLX75T-2FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX75T-2FGG484Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX75T-2FGG484Q?
For technical support, including XA6SLX75T-2FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX75T-2FGG484Q requirements.
6.How does Aetrix verify that XA6SLX75T-2FGG484Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX75T-2FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX75T-2FGG484Q meets industry standards.
7.What is the process for return or replacement of XA6SLX75T-2FGG484Q?
All XA6SLX75T-2FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX75T-2FGG484Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX75T-2FGG484Q part is unused and in its original packaging.
Return procedure for XA6SLX75T-2FGG484Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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