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AMD XA6SLX9-2CSG324I
- Part No.:
- XA6SLX9-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX9-2CSG324I.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,012
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Product details
Overview
XA6SLX9-2CSG324I from AMD is a radiation-tolerant Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and support for LVDS I/O at up to 1,080 Mbps. It operates across -40°C to +100°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX9-2CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include single-event latch-up (SEL) immunity > 75 MeV·cm²/mg, total ionizing dose (TID) tolerance of 100 krad(Si), and QML-V Class V qualification per MIL-PRF-38535.
Technical Context
The XA6SLX9-2CSG324I implements a configurable logic fabric based on 6-input LUTs and integrated DSP48A1 slices for arithmetic acceleration. It includes dedicated clock management tiles with DCMs supporting frequency synthesis, phase shifting, and duty-cycle correction.
I/O banks are independently configurable for SSTL, HSTL, LVCMOS, and LVDS standards, with programmable slew rate and drive strength per pin. Configuration occurs via serial mode using an external PROM or through JTAG boundary-scan interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides sufficient resources for medium-complexity control and interface logic in radiation-hardened systems |
| Block RAM | 576 Kbits - enables local data buffering and small lookup tables without external memory |
| Max I/O Speed | 1,080 Mbps (LVDS) - supports high-speed sensor interfaces and telemetry links |
| TID Tolerance | 100 krad(Si) - ensures functional operation after prolonged exposure in low-Earth orbit |
| SEL Immunity | >75 MeV·cm²/mg - prevents catastrophic latch-up events in proton-rich environments |
| Operating Temp | -40°C to +100°C - validated for use in unheated satellite payloads and propulsion subsystems |
Pinout & Package
The XA6SLX9-2CSG324I is housed in a 324-pin ceramic column grid array (CPGA) package with 2.54 mm pitch, designed for hermetic sealing and thermal cycling reliability in space environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins provide low-inductance return paths for I/O and core domains |
| VCCO_0 | I/O bank supply | Supplies 1.8 V or 2.5 V to Bank 0; must be decoupled per AMD XA6SLX9 layout guidelines |
| VCCAUX | auxiliary supply | Provides 2.5 V to configuration circuitry, DCMs, and JTAG interface |
| PROGRAM_B | configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| CCLK | configuration clock | Drives internal configuration shift register during master serial mode programming |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened by process | Manufactured on 45 nm partially depleted SOI process to suppress single-event effects |
| QML-V Class V qualification | Fully compliant with MIL-PRF-38535 requirements for spaceflight hardware screening and testing |
| Dedicated DCM blocks | Two Digital Clock Managers enable jitter reduction and clock domain crossing for telemetry timing |
| Configurable I/O standards | Per-bank voltage selection supports mixed-voltage interfacing with legacy avionics peripherals |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Logic |
|---|---|
Use Scenario: Real-time collection and formatting of sensor telemetry from star trackers and gyros before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic handles protocol framing, CRC generation, and time-tagging using internal DCM-synchronized counters. Use Value: Eliminates need for external microcontroller or ASIC while maintaining deterministic latency under radiation exposure. | Use Scenario: Closed-loop execution of attitude determination and control algorithms using magnetometer and reaction wheel feedback. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers and state machines with cycle-accurate timing via DCM-derived clocks. Use Value: Enables autonomous response to attitude disturbances without ground intervention, meeting mission-critical timing deadlines. |
| Launch Vehicle Health Monitoring | Deep Space Probe Command Decoding |
Use Scenario: Continuous monitoring of engine vibration, pressure, and temperature signals during ascent phase. IC Role / Device Role / Timing Role: Interfaces with multiple analog front-ends and digital sensors via LVDS and LVCMOS I/O banks; performs real-time FFT preprocessing. Use Value: Provides fault detection within 10 ms window using on-chip block RAM for coefficient storage and pipeline processing. | Use Scenario: Reliable decoding and validation of encrypted uplink commands received over X-band in high-radiation deep space environments. IC Role / Device Role / Timing Role: Implements CCSDS-compatible Reed-Solomon decoder and AES-128 decryption engine using LUT-based logic and block RAM. Use Value: Ensures command integrity and prevents unauthorized execution even after cumulative TID exposure exceeding 75 krad(Si). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA with 2M system gates; no reconfigurability; higher static power | Used where configuration permanence is required (e.g., launch sequencers) | Choose RTAX2000D when reprogramming is prohibited and SEU immunity outweighs flexibility needs |
| XA7K160T-1FFG676I | Kintex-7 based; 160K logic cells; 28 nm bulk CMOS; TID rated to 50 krad(Si) | Suitable for LEO missions with shorter lifetimes and lower radiation budgets | Choose XA7K160T-1FFG676I when higher logic density and PCIe Gen2 support are needed but full 100 krad(Si) tolerance is not required |
Compared with RTAX2000D and XA7K160T-1FFG676I, the XA6SLX9-2CSG324I delivers balanced reconfigurability, SEL immunity, and TID tolerance in a proven 45 nm SOI process-making it optimal for mid-lifetime Earth observation platforms requiring field-upgradable functionality.
Availability
XA6SLX9-2CSG324I is available at Aetrix Electronics and suitable for satellite telemetry systems, launch vehicle health monitors, deep space probe command processors, and onboard attitude control units requiring stable component supply across extended production cycles.
Supply support for XA6SLX9-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance and adaptive computing solutions for aerospace, defense, and industrial markets, with heritage in radiation-hardened programmable logic dating to the early 2000s.
The XA6SLX9-2CSG324I belongs to AMD's XA Spartan-6 family, developed specifically for space-qualified reconfigurable computing where deterministic timing, radiation resilience, and long-term supply assurance are mandatory.
FAQ
What radiation hardness specifications apply to the XA6SLX9-2CSG324I?
The XA6SLX9-2CSG324I is specified for total ionizing dose (TID) tolerance of 100 krad(Si) and single-event latch-up (SEL) immunity exceeding 75 MeV·cm²/mg. It meets QML-V Class V requirements per MIL-PRF-38535, including burn-in, temperature cycling, and proton irradiation testing. These ratings are verified per AMD's space qualification report for the XA6SLX9-2CSG324I and apply to the full operating temperature range.
Does the XA6SLX9-2CSG324I support partial reconfiguration?
No, the XA6SLX9-2CSG324I does not support partial reconfiguration. Its configuration architecture is based on the Spartan-6 generation, which only permits full reconfiguration via JTAG or master serial mode. Partial reconfiguration requires 7-series or newer FPGA families. The XA6SLX9-2CSG324I supports fast full reconfiguration in under 100 ms using external SPI PROM, suitable for mission-mode switching.
What configuration modes are supported by the XA6SLX9-2CSG324I?
The XA6SLX9-2CSG324I supports master serial (via CCLK and DIN), slave serial, JTAG boundary-scan, and slave selectMAP configuration modes. Master serial is most commonly used in space applications due to its simplicity and deterministic timing. JTAG is reserved for debug, test, and field updates. All modes are radiation-tested and included in the XA6SLX9-2CSG324I qualification scope.
Is the XA6SLX9-2CSG324I pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX9-2CSG324I is not pin-compatible with commercial Spartan-6 FPGAs. It uses a unique 324-pin ceramic PGA package with different power pin allocation, thermal pad configuration, and radiation-specific grounding schemes. Migration from commercial to XA variants requires PCB redesign. The XA6SLX9-2CSG324I pinout is defined exclusively in AMD's XA6SLX9-2CSG324I datasheet and qualification reports.
What is the maximum operating frequency of internal logic in the XA6SLX9-2CSG324I?
The XA6SLX9-2CSG324I is speed-grade -2, meaning its internal logic is characterized to operate reliably at up to 500 MHz for register-to-register paths under worst-case voltage and temperature conditions. This rating is confirmed in AMD's XA6SLX9-2CSG324I data sheet DS162 and applies to synchronous logic implemented in LUTs and flip-flops, excluding I/O timing constraints.
XA6SLX9-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX9-2CSG324I FAQ
1.How can I place an order for XA6SLX9-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX9-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX9-2CSG324I reliable?
The price and inventory of XA6SLX9-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX9-2CSG324I is usually 5 days.
3.What payment methods are accepted for XA6SLX9-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX9-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX9-2CSG324I?
XA6SLX9-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX9-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX9-2CSG324I?
For technical support, including XA6SLX9-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX9-2CSG324I requirements.
6.How does Aetrix verify that XA6SLX9-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XA6SLX9-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX9-2CSG324I meets industry standards.
7.What is the process for return or replacement of XA6SLX9-2CSG324I?
All XA6SLX9-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX9-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX9-2CSG324I part is unused and in its original packaging.
Return procedure for XA6SLX9-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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