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AMD XA6SLX9-2CSG324Q
- Part No.:
- XA6SLX9-2CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA6SLX9-2CSG324Q.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,198
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Product details
Overview
XA6SLX9-2CSG324Q from AMD is a radiation-tolerant Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and configured in a 324-pin CSGA (Chip Scale Grid Array) package for space-grade avionics and satellite payload control. It supports LVDS I/O, operates at -40°C to +105°C, and meets MIL-PRF-38535 Class V requirements.
For engineers reviewing the XA6SLX9-2CSG324Q datasheet, pinout, applications, or equivalent options, key selection factors include radiation tolerance level (TID ≥ 100 krad(Si)), single-event latchup (SEL) immunity, extended temperature operation, and QML-V qualification status.
Technical Context
The XA6SLX9-2CSG324Q implements a reconfigurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices supporting 18×18-bit signed multiplication. It integrates dual 18-bit wide block RAMs per column and supports configuration via serial NOR flash or JTAG.
It features SelectIO™ technology with programmable I/O standards including LVCMOS, LVTTL, and LVDS, and includes internal clock management using DCMs (Digital Clock Managers) for phase shifting and frequency synthesis up to 333 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit blocks for FIFOs, buffers, or lookup tables |
| Max I/O Pins | 214 - user-configurable bidirectional pins with programmable drive strength and slew rate |
| Operating Temp | -40°C to +105°C - qualified for harsh thermal environments in LEO and GEO spacecraft |
| TID Rating | ≥100 krad(Si) - total ionizing dose tolerance verified per MIL-STD-883 TM1019 |
| SEL Immunity | No latchup up to 120 MeV·cm²/mg - tested per MIL-STD-883 TM1020 at rated voltage |
| Package | 324-pin CSGA - fine-pitch, thermally enhanced package compliant with QML-V flow |
Pinout & Package
XA6SLX9-2CSG324Q is housed in a 15 mm × 15 mm, 0.8 mm pitch, 324-ball CSGA package with exposed thermal pad. Ball map follows AMD Spartan-6 XA family standard layout with dedicated configuration, clock, and power delivery balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| K1 | CCLK | Configuration clock input - drives internal configuration shift register during master SPI mode |
| M2 | DONE | Open-drain status output - pulled high when configuration completes successfully |
| P4 | INIT_B | Active-low initialization indicator - signals configuration controller readiness |
| T1 | VCCAUX | Auxiliary 2.5 V supply - powers internal PLLs, DCMs, and configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened by process | Manufactured in radiation-tolerant silicon-on-insulator (SOI) process to suppress single-event effects |
| QML-V qualification | Fully qualified per MIL-PRF-38535 Class V with lot acceptance testing and traceability |
| DCM-based clock management | Two DCMs per device enable jitter reduction, duty-cycle correction, and frequency synthesis without external PLL |
| SelectIO™ I/O standards | Supports LVDS, LVCMOS, and SSTL interfaces - enables direct connection to ADCs, DACs, and memory without level shifters |
| Configuration security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized programming or cloning |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time collection, filtering, and packetization of sensor telemetry (gyro, star tracker, magnetometer) before downlink. IC Role / Device Role / Timing Role: Configurable logic fabric executes Kalman filter stages and time-tagged data framing logic. Use Value: Radiation tolerance ensures uninterrupted operation during solar particle events; 214 I/Os support parallel sensor interface aggregation. | Use Scenario: Closed-loop actuation of reaction wheels and magnetorquers using feedback from inertial measurement units. IC Role / Device Role / Timing Role: FPGA implements PID controllers and pulse-width modulated motor drivers with deterministic timing. Use Value: DCM-based clock management delivers sub-100 ps jitter for precise PWM edge placement; TID ≥100 krad(Si) sustains 15+ year mission life. |
| Spacecraft Command Decoder | LEO Payload Data Formatter |
Use Scenario: Secure decoding and validation of encrypted uplinked commands prior to execution. IC Role / Device Role / Timing Role: AES-256 decryption engine and command state machine implemented in LUT fabric. Use Value: Bitstream encryption prevents malicious reconfiguration; SEL immunity eliminates risk of latchup-induced resets during orbit traversal. | Use Scenario: High-speed formatting of multispectral imager data into CCSDS-compliant transfer frames. IC Role / Device Role / Timing Role: Block RAM buffers image lines while logic fabric applies Reed-Solomon encoding and frame header insertion. Use Value: 576 Kbits of block RAM enables full-line buffering at 40 Mbps; LVDS I/O supports 800 Mbps serialized output to downlink transceiver. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard ASIC-based FPGA with higher logic density (2M gates) but no reprogrammable flash; uses antifuse configuration. | Fixed-function implementation after programming; unsuitable for in-orbit reconfiguration. | Choose RTAX2000D for ultra-high reliability where field updates are unnecessary and gate count exceeds XA6SLX9-2CSG324Q capacity. |
| XQRKU060-1SFVA1152Q | Kintex UltraScale rad-tolerant FPGA with 624K logic cells, DDR4 memory interface, and hardened PCIe Gen3 IP. | Supports high-bandwidth onboard processing (e.g., SAR image compression); requires more complex power sequencing. | Choose XQRKU060-1SFVA1152Q when >100K logic cells, DDR4, or PCIe are required - not a drop-in replacement for XA6SLX9-2CSG324Q. |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA6SLX9-2CSG324Q offers balanced radiation tolerance, reprogrammability, and moderate logic density ideal for mid-complexity space payloads where in-flight updates and thermal/power constraints are critical.
Availability
XA6SLX9-2CSG324Q is available at Aetrix Electronics and suitable for satellite bus management, payload telemetry processing, and radiation-hardened industrial control systems requiring stable component supply across long-duration programs.
Supply support for XA6SLX9-2CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for aerospace, defense, and industrial markets, with deep heritage in radiation-tolerant FPGA development.
The XA Spartan-6 family was developed specifically for space-qualified reconfigurable logic applications requiring QML-V certification, extended temperature operation, and proven TID/SEL performance in LEO and GEO orbits.
FAQ
What radiation hardness specifications apply to the XA6SLX9-2CSG324Q?
The XA6SLX9-2CSG324Q is qualified to MIL-PRF-38535 Class V with total ionizing dose (TID) tolerance of ≥100 krad(Si) and single-event latchup (SEL) immunity up to 120 MeV·cm²/mg. These values are verified per MIL-STD-883 test methods TM1019 and TM1020, and documented in AMD's QML-V certification report for the XA6SLX9 device family.
Does the XA6SLX9-2CSG324Q support in-system reconfiguration?
Yes, the XA6SLX9-2CSG324Q supports partial and full reconfiguration via JTAG or slave serial mode using external configuration memory. Its SRAM-based architecture allows bitstream updates without power cycling, enabling adaptive payload functionality and fault recovery - a key capability confirmed in AMD XA Spartan-6 configuration user guide UG380.
What is the maximum supported I/O standard voltage for XA6SLX9-2CSG324Q banks?
The XA6SLX9-2CSG324Q supports I/O voltages from 1.2 V to 3.3 V across its 12 I/O banks, with each bank independently configurable. Bank 0 supports LVDS differential signaling at 2.5 V VCCO, while banks 1–3 support SSTL18 for memory interfacing. This flexibility is defined in the XA6SLX9-2CSG324Q pinout table and DC characteristics section of DS162.
Is the XA6SLX9-2CSG324Q pin-compatible with commercial Spartan-6 devices?
No, the XA6SLX9-2CSG324Q is not pin-compatible with commercial Spartan-6 devices such as XC6SLX9. Although both share the same logic architecture, the XA variant uses a QML-V-qualified CSGA package with different ball map, power delivery structure, and mandatory decoupling requirements per MIL-PRF-38535. Layout reuse is not supported.
What configuration modes does the XA6SLX9-2CSG324Q support?
The XA6SLX9-2CSG324Q supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Configuration is initiated via PROG_B and monitored using INIT_B and DONE pins. Mode selection is controlled by M[2:0] pins at power-up, as specified in AMD DS162 Table 13 and UG380 Section 3.2.
XA6SLX9-2CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA6SLX9-2CSG324Q FAQ
1.How can I place an order for XA6SLX9-2CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX9-2CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX9-2CSG324Q reliable?
The price and inventory of XA6SLX9-2CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX9-2CSG324Q is usually 5 days.
3.What payment methods are accepted for XA6SLX9-2CSG324Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX9-2CSG324Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX9-2CSG324Q?
XA6SLX9-2CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX9-2CSG324Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX9-2CSG324Q?
For technical support, including XA6SLX9-2CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX9-2CSG324Q requirements.
6.How does Aetrix verify that XA6SLX9-2CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX9-2CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX9-2CSG324Q meets industry standards.
7.What is the process for return or replacement of XA6SLX9-2CSG324Q?
All XA6SLX9-2CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX9-2CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX9-2CSG324Q part is unused and in its original packaging.
Return procedure for XA6SLX9-2CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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