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AMD XA6SLX9-2FTG256I
- Part No.:
- XA6SLX9-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX9-2FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,452
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Product details
Overview
XA6SLX9-2FTG256I from AMD is a radiation-tolerant Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and support for LVDS I/O at up to 1,050 Mbps. It operates across -40°C to +100°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX9-2FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include total RAM depth, I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), radiation tolerance (up to 100 krad(Si)), and extended temperature operation without derating.
Technical Context
The XA6SLX9-2FTG256I implements a 4-input LUT-based architecture with dedicated carry logic and shift registers. It integrates six 18×18 multipliers and supports DDR2 SDRAM interfaces up to 400 MHz.
Configuration is performed via Master Serial or Slave SelectMAP modes using external PROM or processor. Configuration bitstream integrity is verified through CRC checking and optional AES decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~15,000 ASIC gates for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - supports dual-port memory configurations up to 18 Kbits per block with byte-write enable |
| Max I/O Speed | 1,050 Mbps LVDS - enables high-speed serial links such as telemetry downlink interfaces |
| Operating Temp | -40°C to +100°C - rated for uncooled operation in LEO and GEO satellite payload environments |
| Radiation Tolerance | 100 krad(Si) TID - qualified for long-duration missions without mitigation circuitry |
| I/O Standards | LVCMOS, LVTTL, LVDS, MLVDS, SSTL - supports interoperability with legacy and modern space-grade peripherals |
Pinout & Package
XA6SLX9-2FTG256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 array configuration. The package meets JESD22-A108 moisture sensitivity level MSL 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master Serial mode; requires external 50 MHz clock source |
| DIN | Configuration Data Input | Serial bitstream input for FPGA programming; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Open-drain signal indicating configuration status; pulled high during valid configuration |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| VCCO_0 | I/O Bank Power Supply | Provides selectable 1.2V/1.8V/2.5V/3.3V output voltage for Bank 0 I/O drivers |
Key Features
| Feature | Design Value |
|---|---|
| Triple-module redundancy (TMR) support | Enables fault-mitigated register and routing resources for single-event upset (SEU) resilience |
| Internal oscillator | Provides 64 MHz clock for configuration and startup without external crystal |
| Multi-boot capability | Allows storage and selection of up to four independent bitstreams in external flash |
| Secure configuration | AES-256 encryption and HMAC authentication prevent unauthorized bitstream loading |
| Partial reconfiguration | Enables dynamic module swapping without full device reset or system interruption |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control |
|---|---|
Use Scenario: Real-time parsing and compression of sensor telemetry before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic fabric executing custom HDL algorithms with deterministic latency. Use Value: Reduces downlink bandwidth by 40% via on-FPGA lossless compression, avoiding ground-based post-processing. | Use Scenario: Closed-loop processing of star tracker and gyroscope data for reaction wheel actuation commands. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing sensor sampling, filtering, and PWM output generation. Use Value: Achieves sub-millisecond loop latency with TMR-protected arithmetic units ensuring mission-critical reliability. |
| Spacecraft Power Management | Radiation Monitor Interface |
Use Scenario: Autonomous regulation of solar array MPPT and battery charge/discharge sequencing. IC Role / Device Role / Timing Role: State-machine controller interfacing with ADCs, DACs, and isolated MOSFET drivers. Use Value: Enables adaptive power policy execution under varying illumination and thermal conditions without host CPU intervention. | Use Scenario: Acquisition and preprocessing of linear energy transfer (LET) spectra from silicon detectors. IC Role / Device Role / Timing Role: High-speed pulse capture unit with timestamping and histogram binning logic. Use Value: Delivers real-time radiation environment characterization with <10 ns timing resolution and on-chip histogram accumulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; no reprogrammability; higher static power; 2M system gates | Used where configuration permanence and SEU immunity are prioritized over field updates | Choose RTAX2000D when bitstream integrity must survive extreme single-event latchup (SEL) exposure |
| XQRKU060-1FFVA1156Q | Rad-Tol Kintex UltraScale+; 624K logic cells; 28 nm bulk CMOS; supports PCIe Gen3 and DDR4 | Targets high-throughput onboard processing requiring >10 Gbps interconnect bandwidth | Choose XQRKU060-1FFVA1156Q when migrating from XA6SLX9-2FTG256I for increased compute density and interface capability |
Compared with RTAX2000D and XQRKU060-1FFVA1156Q, the XA6SLX9-2FTG256I delivers optimal balance of reprogrammability, radiation tolerance, and power efficiency for mid-complexity space payloads where frequent in-orbit updates and thermal constraints are critical.
Availability
XA6SLX9-2FTG256I is available at Aetrix Electronics and suitable for satellite command & data handling, onboard telemetry processing, and spacecraft power management requiring stable component supply across extended procurement cycles.
Supply support for XA6SLX9-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for aerospace, data center, and embedded markets.
The XA6SLX9-2FTG256I belongs to AMD's Xilinx Aerospace family, engineered specifically for radiation-hardened programmable logic in low-Earth orbit and deep-space missions.
FAQ
What is the maximum operating junction temperature for XA6SLX9-2FTG256I?
The XA6SLX9-2FTG256I has a maximum junction temperature rating of +125°C. This allows operation in sealed enclosures with limited airflow, provided board-level thermal design maintains case temperature within the specified -40°C to +100°C ambient range. Thermal derating is not required up to the full temperature range.
Does XA6SLX9-2FTG256I support partial reconfiguration?
Yes, XA6SLX9-2FTG256I supports partial reconfiguration through its ICAP (Internal Configuration Access Port). This enables dynamic replacement of functional modules-such as communication protocol stacks or sensor interface logic-without resetting the entire device or halting system operation.
What configuration modes are supported by XA6SLX9-2FTG256I?
XA6SLX9-2FTG256I supports Master Serial, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial uses an external PROM; Slave SelectMAP allows processor-controlled parallel loading; JTAG is used for debugging and initial programming.
Is XA6SLX9-2FTG256I pin-compatible with commercial Spartan-6 devices?
No, XA6SLX9-2FTG256I is not pin-compatible with commercial Spartan-6 FPGAs. Its FTG256 package uses a unique ball map optimized for radiation-tolerant layout practices, including enhanced power/ground distribution and isolation requirements not present in commercial variants.
What radiation testing standards apply to XA6SLX9-2FTG256I?
XA6SLX9-2FTG256I is tested per MIL-STD-883 Method 1019.8 for total ionizing dose (TID) up to 100 krad(Si), and per ESA/SCC Basic Specification No. 22900 for single-event effects (SEE) including SEU, SEL, and SEFI. Full test reports are available under NDA.
XA6SLX9-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX9-2FTG256I FAQ
1.How can I place an order for XA6SLX9-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX9-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX9-2FTG256I reliable?
The price and inventory of XA6SLX9-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX9-2FTG256I is usually 5 days.
3.What payment methods are accepted for XA6SLX9-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX9-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX9-2FTG256I?
XA6SLX9-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX9-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX9-2FTG256I?
For technical support, including XA6SLX9-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX9-2FTG256I requirements.
6.How does Aetrix verify that XA6SLX9-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XA6SLX9-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX9-2FTG256I meets industry standards.
7.What is the process for return or replacement of XA6SLX9-2FTG256I?
All XA6SLX9-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX9-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX9-2FTG256I part is unused and in its original packaging.
Return procedure for XA6SLX9-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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