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AMD XA6SLX9-2FTG256Q
- Part No.:
- XA6SLX9-2FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX9-2FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,077
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Product details
Overview
XA6SLX9-2FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and support for LVDS I/O at up to 1,050 Mbps. It operates across –40°C to +105°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX9-2FTG256Q datasheet, pinout, applications, or equivalent options, key selection factors include total RAM depth, single-ended/LVDS I/O count, radiation tolerance level (up to 100 krad(Si)), and TID qualification per ESA/SCC basic specification.
Technical Context
The XA6SLX9-2FTG256Q implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices supporting 18 × 18-bit signed multiplication. Its clocking architecture includes two DCMs per bank for phase alignment and jitter reduction in high-speed serial links.
I/O banks are independently powered (1.2 V, 1.8 V, 2.5 V, or 3.3 V), enabling mixed-voltage interface support. Configuration occurs via Master Serial SPI or JTAG, with SEU mitigation using built-in CRC and optional EDAC on configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~15,000 ASIC gates for control logic and state machines |
| Block RAM | 576 Kbits - supports dual-port FIFOs up to 18 Kwords × 32 bits or frame buffers for telemetry processing |
| Max LVDS Rate | 1,050 Mbps - enables direct connection to space-qualified ADCs/DACs without external serializers |
| Operating Temp | –40°C to +105°C - validated for use in unheated satellite payload bays and propulsion modules |
| TID Rating | 100 krad(Si) - meets ESA/SCC Basic Specification for low-earth orbit missions up to 5 years |
| I/O Standards | LVTTL, LVCMOS, LVDS, RSDS - supports legacy bus interfaces and high-speed differential telemetry links |
Pinout & Package
XA6SLX9-2FTG256Q is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch and 17 × 17 mm body size. The package supports reflow soldering per J-STD-020 and is qualified for space-level thermal cycling (–55°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with ≥10 µF + 100 nF per bank |
| D2 | IO_L0N_0 | Differential pair negative input - used for LVDS clock or data reception in telemetry interfaces |
| E2 | IO_L0P_0 | Differential pair positive input - paired with D2 for noise-immune 1050 Mbps link implementation |
| P16 | M0 | Configuration mode select - tied low to enable Master Serial SPI boot mode |
| R15 | INIT_B | Open-drain status output - asserts low during configuration error or CRC mismatch |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | EDAC-capable with automatic single-bit error correction and double-bit error detection |
| Dedicated DSP slices | Four DSP48A1 blocks enable real-time FFT or FIR filtering for onboard signal processing |
| Multi-voltage I/O banks | Independent VCCO per bank allows interfacing with 1.2 V sensors and 3.3 V legacy buses simultaneously |
| DCM-based clock management | Two Digital Clock Managers per I/O bank provide ±150 ps phase alignment for synchronous sampling |
Applications
| Satellite Telemetry Processing | Onboard Command Decoding |
|---|---|
Use Scenario: Real-time parsing and formatting of downlinked sensor data from star trackers and radiation monitors. IC Role / Device Role / Timing Role: Configurable datapath controller with embedded FIFO buffering and CRC generation logic. Use Value: Reduces reliance on external microcontrollers by implementing protocol stacks (CCSDS TM/TC) directly in fabric. | Use Scenario: Secure validation and execution of uplinked telecommands under radiation-induced bit-flip conditions. IC Role / Device Role / Timing Role: Radiation-tolerant state machine executing authenticated command sequences with watchdog supervision. Use Value: Eliminates need for triple-modular redundancy in command path due to built-in SEU mitigation and lockstep monitoring. |
| Spacecraft Attitude Control Logic | Propulsion System Monitor |
Use Scenario: Closed-loop processing of gyroscope and magnetometer inputs to generate reaction wheel drive signals. IC Role / Device Role / Timing Role: Deterministic timing engine with sub-microsecond interrupt latency for attitude update cycles. Use Value: Enables 1 kHz control loop execution without external timing ICs or jitter-sensitive PLLs. | Use Scenario: Monitoring pressure, temperature, and valve position feedback during thruster firing sequences. IC Role / Device Role / Timing Role: Safety-critical I/O concentrator with hardware-enforced timeout and fail-safe shutdown logic. Use Value: Meets ECSS-Q-ST-60-02C Class B requirements for propulsion interlock integrity without external safety ASICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7S6-2CSG324Q | Artix-7 architecture; higher logic density (23,000 LUTs); no DCMs - uses MMCM instead | Requires redesign of clocking network; supports PCIe Gen1 but not space-qualified for >100 krad(Si) | Preferred for new designs needing higher performance where TID < 30 krad(Si) suffices |
| RTAX2000D | RadTol anti-fuse FPGA; non-volatile configuration; 2,000K system gates; no dynamic reconfiguration | Used in launch vehicle avionics where configuration permanence is mandatory; no SEU risk but no field updates | Chosen when zero reconfiguration risk outweighs flexibility and lower gate count |
Compared with XA6SLX9-2FTG256Q, the XA7S6-2CSG324Q offers greater logic capacity but lacks full space qualification, while the RTAX2000D eliminates configuration vulnerability at the cost of in-field adaptability - making XA6SLX9-2FTG256Q optimal for LEO missions requiring balance of reprogrammability and radiation assurance.
Availability
XA6SLX9-2FTG256Q is available at Aetrix Electronics and suitable for satellite telemetry systems, spacecraft command & data handling units, and radiation-hardened industrial controllers requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX9-2FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on reliability, longevity, and radiation resilience.
The XA Spartan-6 family was developed specifically for space-qualified reprogrammable logic applications where TID tolerance, SEU mitigation, and long-term obsolescence management are mission-critical design requirements.
FAQ
What is the total usable block RAM capacity of the XA6SLX9-2FTG256Q?
The XA6SLX9-2FTG256Q contains 576 Kbits of distributed and block RAM. This includes 16 BRAM primitives, each configurable as 18 Kbits dual-port memory, supporting deep FIFOs or small frame buffers. All block RAM is fully accessible during operation and retains content through configuration cycles. The XA6SLX9-2FTG256Q's RAM architecture enables deterministic read/write timing critical for telemetry packet assembly.
Does the XA6SLX9-2FTG256Q support JTAG boundary-scan testing?
Yes, the XA6SLX9-2FTG256Q supports IEEE 1149.1-compliant JTAG boundary-scan for interconnect testing and in-system programming. TDI, TDO, TCK, and TMS pins are assigned to dedicated package balls and operate at 3.3 V LVTTL levels. The XA6SLX9-2FTG256Q implements full instruction register and bypass functionality, enabling automated test coverage in flight computer PCB assemblies.
What configuration modes does the XA6SLX9-2FTG256Q support?
The XA6SLX9-2FTG256Q supports Master Serial SPI, Slave Serial, and JTAG configuration modes. Mode selection is controlled by M2:M0 pins at power-up. For space applications, Master Serial SPI is most common, using on-board flash memory. The XA6SLX9-2FTG256Q includes automatic CRC checking and INIT_B assertion on configuration failure - essential for autonomous recovery in remote deployments.
Is the XA6SLX9-2FTG256Q compatible with commercial Spartan-6 development tools?
Yes, the XA6SLX9-2FTG256Q uses the same ISE Design Suite 14.7 toolchain as commercial Spartan-6 FPGAs. Pin constraints, timing analysis, and bitstream generation workflows are identical. However, the XA6SLX9-2FTG256Q requires space-grade device models and radiation-aware simulation libraries - available only in AMD's XA-specific tool bundles. The XA6SLX9-2FTG256Q bitstream is not interchangeable with commercial variants due to configuration memory hardening.
What is the maximum supported I/O standard voltage for XA6SLX9-2FTG256Q banks?
The XA6SLX9-2FTG256Q supports I/O standards up to 3.3 V across all 12 I/O banks. Each bank has independent VCCO supply pins allowing mixed-voltage operation - e.g., Bank 0 at 1.2 V for DDR2 SDRAM interface and Bank 12 at 3.3 V for RS-422 telemetry links. The XA6SLX9-2FTG256Q's I/O architecture complies with IEEE 1149.4 and supports slew-rate control for EMI reduction in sensitive RF environments.
XA6SLX9-2FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX9-2FTG256Q FAQ
1.How can I place an order for XA6SLX9-2FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX9-2FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX9-2FTG256Q reliable?
The price and inventory of XA6SLX9-2FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX9-2FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX9-2FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX9-2FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX9-2FTG256Q?
XA6SLX9-2FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX9-2FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX9-2FTG256Q?
For technical support, including XA6SLX9-2FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX9-2FTG256Q requirements.
6.How does Aetrix verify that XA6SLX9-2FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX9-2FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX9-2FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX9-2FTG256Q?
All XA6SLX9-2FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX9-2FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX9-2FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX9-2FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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