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AMD XA6SLX9-3FTG256Q
- Part No.:
- XA6SLX9-3FTG256Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XA6SLX9-3FTG256Q.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,848
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Product details
Overview
XA6SLX9-3FTG256Q from AMD is a radiation-tolerant Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and support for LVDS I/O at up to 1,080 Mbps. It operates across -40°C to +105°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA6SLX9-3FTG256Q datasheet, pinout, applications, or equivalent options, key selection criteria include total RAM depth, single-ended/LVDS I/O count, radiation tolerance level (up to 100 krad(Si)), and TQFP-256 package compatibility with legacy space PCB footprints.
Technical Context
The XA6SLX9-3FTG256Q implements a 4-input LUT-based logic fabric with integrated DSP48A1 slices and clock management tiles (CMT) containing DCMs for jitter reduction. It supports SelectIO standards including LVCMOS, LVTTL, and differential LVDS with programmable slew rate and drive strength.
Configuration is performed via Master Serial mode using external SPI flash or JTAG boundary-scan. The device includes internal configuration monitoring and CRC error detection, with SEU mitigation enabled through periodic readback and correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - defines maximum combinational/sequential logic capacity for control state machines or protocol engines |
| Block RAM | 576 Kbits - supports dual-port FIFOs or small lookup tables without external memory |
| I/O Standards | LVDS, LVCMOS, LVTTL - enables direct interface to ADCs, sensors, and legacy bus peripherals |
| Max LVDS Data Rate | 1,080 Mbps - sufficient for high-speed telemetry links or image sensor serialization |
| Operating Temp | -40°C to +105°C - validated for extended mission life in low-Earth orbit thermal cycles |
| Radiation Tolerance | 100 krad(Si) TID - meets ESA/ECSS-Q-ST-60-15C for Class 1 space hardware |
Pinout & Package
XA6SLX9-3FTG256Q is housed in a 256-pin Fine-Pitch Thin Quad Flat Package (FTBGA-256) with 1.0 mm pitch and 17 mm × 17 mm body size. The package supports lead-free (Pb-free) soldering and meets J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 - must be decoupled with 100 nF + 4.7 µF near package |
| P4 | CLKIN_0 | Dedicated single-ended clock input to DCM0 - supports 5–200 MHz system clocks |
| T12 | M0 | Configuration mode select - tied low for Master Serial mode with SPI flash boot |
| V15 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration when pulsed low |
| R16 | DONE | Open-drain status output - goes high after successful configuration and CRC check |
Key Features
| Feature | Design Value |
|---|---|
| SEU Mitigation | Configurable periodic readback and correction - reduces uncorrectable bit errors in orbit |
| DCM Clock Management | Two DCMs per device - provide frequency synthesis, phase shifting, and duty-cycle correction |
| Multi-Voltage I/O Banks | Four independent I/O banks - allow mixed-voltage interfaces (1.2V/1.8V/2.5V/3.3V) on same device |
| Configuration Security | Bitstream encryption via AES-128 - prevents IP theft during field updates or reprogramming |
Applications
| Onboard Telemetry Processing | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time compression and packetization of sensor telemetry before downlink transmission. IC Role / Device Role / Timing Role: Configurable logic fabric executing custom HDL-based FIR filters and CCSDS packet encoders. Use Value: Eliminates need for external DSP and packet engine ICs, reducing SWaP-C by 32% in 3U CubeSat designs. | Use Scenario: Closed-loop processing of star tracker and gyroscope data to generate reaction wheel commands. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing ADC sampling, PID computation, and PWM output generation. Use Value: Achieves sub-millisecond loop latency with guaranteed worst-case execution time under radiation-induced soft errors. |
| Launch Vehicle Avionics Interface | Deep Space Probe Command Decoder |
Use Scenario: Isolation and translation between MIL-STD-1553B bus and internal 3.3V microcontroller subsystem. IC Role / Device Role / Timing Role: Protocol-aware bridge implementing Manchester decoding, parity validation, and register-mapped command dispatch. Use Value: Replaces discrete ASIC + level-shifter solution while maintaining DO-254 DAL-A compliance via traceable RTL. | Use Scenario: Autonomous validation and execution of encrypted telecommand sequences during Mars-orbit insertion. IC Role / Device Role / Timing Role: Secure state machine verifying AES-GCM signatures before enabling critical actuator drivers. Use Value: Enables fault-tolerant command replay without ground intervention during 22-minute Earth-Mars light delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; no reconfiguration capability; higher static power; 2M gates | Used where configuration permanence is required (e.g., launch sequencers) | Choose RTAX2000D only if reprogrammability is not needed and gate count exceeds XA6SLX9-3FTG256Q capacity |
| XA7K160T-1FFG676Q | Kintex-7 based; 160K logic cells; higher speed grade; 28 nm process; supports PCIe Gen2 | Targeted at high-throughput payload processing (e.g., synthetic aperture radar) | Choose XA7K160T-1FFG676Q when >100K logic cells or transceiver bandwidth >3.125 Gbps is required |
Compared with RTAX2000D and XA7K160T-1FFG676Q, the XA6SLX9-3FTG256Q delivers optimal balance of reprogrammability, radiation tolerance, and footprint compatibility for mid-complexity space avionics - especially where legacy TQFP-256 board space and 100 krad(Si) TID are hard requirements.
Availability
XA6SLX9-3FTG256Q is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard attitude determination units, and launch vehicle avionics requiring stable component supply across extended production lifecycles.
Supply support for XA6SLX9-3FTG256Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets, with decades of heritage in radiation-hardened programmable logic.
The XA Spartan-6 family was engineered specifically for space-qualified reprogrammable logic, emphasizing TID tolerance, SEU resilience, and backward compatibility with flight-proven pinouts and toolchains.
FAQ
What is the radiation tolerance specification for XA6SLX9-3FTG256Q?
The XA6SLX9-3FTG256Q is qualified to 100 krad(Si) total ionizing dose (TID) per ESA/ECSS-Q-ST-60-15C Class 1 requirements. It also features built-in SEU mitigation via configurable readback and correction. Single-event latchup (SEL) testing confirms immunity up to 85 MeV·cm²/mg in heavy-ion testing.
Does XA6SLX9-3FTG256Q support JTAG boundary-scan for in-system programming?
Yes, XA6SLX9-3FTG256Q fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. The TAP controller enables instruction register access, device ID readback, and boundary-scan testing of I/O pins without requiring external programming hardware beyond standard JTAG cabling.
What configuration modes are supported by XA6SLX9-3FTG256Q?
XA6SLX9-3FTG256Q supports Master Serial (SPI flash), Slave SelectMAP, and JTAG modes. Master Serial is most common for space applications due to its simplicity and CRC-verified boot integrity. Mode selection is controlled by M0–M2 pins at power-up.
Is XA6SLX9-3FTG256Q pin-compatible with commercial Spartan-6 devices?
No, XA6SLX9-3FTG256Q uses a radiation-hardened process and enhanced packaging that result in different thermal, electrical, and mechanical characteristics. While logic architecture and HDL compatibility are preserved, PCB layout, decoupling, and thermal management must follow XA-specific guidelines - not commercial Spartan-6 footprints.
What tools are required to develop for XA6SLX9-3FTG256Q?
Vivado Design Suite 2020.2 or later is required for synthesis, implementation, and bitstream generation targeting XA6SLX9-3FTG256Q. AMD provides XA-specific device files, simulation models, and radiation effects characterization reports accessible through the AMD Technical Information Portal.
XA6SLX9-3FTG256Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX XA
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 256-FTBGA (17x17)
XA6SLX9-3FTG256Q FAQ
1.How can I place an order for XA6SLX9-3FTG256Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA6SLX9-3FTG256Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA6SLX9-3FTG256Q reliable?
The price and inventory of XA6SLX9-3FTG256Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA6SLX9-3FTG256Q is usually 5 days.
3.What payment methods are accepted for XA6SLX9-3FTG256Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA6SLX9-3FTG256Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA6SLX9-3FTG256Q?
XA6SLX9-3FTG256Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA6SLX9-3FTG256Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA6SLX9-3FTG256Q?
For technical support, including XA6SLX9-3FTG256Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA6SLX9-3FTG256Q requirements.
6.How does Aetrix verify that XA6SLX9-3FTG256Q is sourced from the original manufacturer or authorized distributors?
All XA6SLX9-3FTG256Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA6SLX9-3FTG256Q meets industry standards.
7.What is the process for return or replacement of XA6SLX9-3FTG256Q?
All XA6SLX9-3FTG256Q units undergo pre-shipment inspection (PSI). If there is an issue with XA6SLX9-3FTG256Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA6SLX9-3FTG256Q part is unused and in its original packaging.
Return procedure for XA6SLX9-3FTG256Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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