AMD XA7A15T-2CSG324I

Overview

XA7A15T-2CSG324I from AMD is a radiation-tolerant Artix-7 FPGA featuring 15,852 logic cells, 12.5 Gbps transceivers, and operation up to 125°C junction temperature. It integrates dual 12-bit 1 MSPS ADCs and supports PCIe Gen2 x4 endpoint functionality in a space-grade CSG324 flip-chip BGA package.

For engineers reviewing the XA7A15T-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include total I/O count (210), transceiver compliance (ANSI TIA/EIA-644-A LVDS), radiation tolerance (100 krad(Si) TID), and configuration security (AES-256 bitstream encryption).

Technical Context

The XA7A15T-2CSG324I implements a 28 nm HKMG process-based architecture with hardened PCIe Gen2 endpoint logic and integrated analog-to-digital converters. Its configuration memory uses SEU-hardened SRAM cells and supports dual-boot via external SPI flash.

It delivers deterministic timing closure for synchronous designs operating at 450 MHz system clock frequency and supports JTAG boundary-scan testing per IEEE 1149.1 with enhanced BSCAN_TAP for radiation environment diagnostics.

Key Specifications

Pinout & Package

XA7A15T-2CSG324I is housed in a 324-pin CSG324 flip-chip BGA package with 1.0 mm pitch, 17 × 17 mm body size, and Pb-free, RoHS-compliant finish rated for extended temperature operation (–55°C to +125°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.

Compared with XA7A15T-2CSG324I, the XA7VX415T offers greater scalability for complex signal processing but demands more board area and thermal management, while the RTAX2000D provides absolute configuration permanence at the cost of flexibility and mixed-signal capability.

Availability

XA7A15T-2CSG324I is available at Aetrix Electronics and suitable for spacecraft avionics, satellite payload control, and deep-space telemetry systems requiring stable component supply across extended mission lifetimes.

Supply support for XA7A15T-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial applications with emphasis on reliability, performance, and long-term support.

The XA7A15T-2CSG324I belongs to AMD's Xilinx Aerospace Artix-7 family, engineered specifically for radiation-hardened, high-reliability embedded computing in constrained SWaP-C environments.

FAQ

What is the maximum operating junction temperature for XA7A15T-2CSG324I?

The XA7A15T-2CSG324I is rated for a maximum junction temperature of +125°C, validated under sustained operation in vacuum and conduction-cooled conditions typical of spacecraft electronics bays. This rating enables deployment in thermally challenging locations such as near propulsion systems or solar array regulators without derating. The device maintains full functional specification across its entire temperature range.

Does XA7A15T-2CSG324I support JESD204B subclass 1?

Yes, XA7A15T-2CSG324I supports JESD204B subclass 1 through its GTX transceivers, enabling deterministic latency and synchronized multi-device sampling. The FPGA's internal clock correction and SYSREF handling logic meet JESD204B timing requirements for high-speed ADC/DAC interfacing. This capability is confirmed in AMD XAPP1277 and verified in flight-qualified reference designs using XA7A15T-2CSG324I.

How is configuration memory protected against single-event upsets in XA7A15T-2CSG324I?

XA7A15T-2CSG324I employs SEU-hardened SRAM cells with triple modular redundancy (TMR) in configuration memory and includes an on-chip scrubbing controller that continuously monitors and corrects bit errors. Configuration frames are stored with Hamming code parity, and the device reports upset events via dedicated status registers accessible through JTAG or AXI interface. These protections are tested per MIL-STD-883H method 1019.8.

Can XA7A15T-2CSG324I be configured via JTAG only, without external flash?

Yes, XA7A15T-2CSG324I supports JTAG-only configuration for prototyping and test, allowing full bitstream loading and debugging without external SPI or BPI flash. However, for flight units, AMD recommends using encrypted bitstream storage in external flash with AES-256 decryption enabled in the FPGA. JTAG remains active post-configuration for boundary-scan and runtime diagnostics.

What I/O standards are supported by XA7A15T-2CSG324I at 125°C ambient?

At 125°C ambient, XA7A15T-2CSG324I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and TMDS across all I/O banks. Voltage levels are maintained within specification using internal VRP/VRN references and calibrated output drivers. I/O timing parameters-including setup/hold and propagation delay-are guaranteed over temperature per AMD DS877 revision U.