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AMD XA7A25T-1CSG325I
- Part No.:
- XA7A25T-1CSG325I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA7A25T-1CSG325I.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,600
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Product details
Overview
XA7A25T-1CSG325I from AMD is a radiation-tolerant Artix-7 FPGA with 25K logic cells, 1.2V core voltage, -1 speed grade, and 325-pin CSP BGA package; designed for spaceborne data processing in low-earth orbit (LEO) satellite payloads requiring single-event latch-up immunity and TID tolerance up to 100 krad(Si).
For engineers reviewing the XA7A25T-1CSG325I datasheet, pinout, applications, or equivalent options, key selection criteria include SEU mitigation capability, configurable I/O banks supporting LVCMOS18/LVCMOS25, and integrated Block RAM capacity of 1,824 kbits for on-chip buffering in constrained SWaP-C environments.
Technical Context
This FPGA implements a 28 nm HPL silicon-on-insulator process with triple-well isolation for SEL immunity and includes hardened configuration memory with CRC error detection. It supports JTAG boundary-scan and ICAP-based partial reconfiguration for in-orbit updates.
The device integrates 120 DSP48E1 slices for real-time signal processing and features 24 transceivers capable of 6.6 Gbps operation, compliant with SpaceWire and PCIe Gen2 protocols under radiation conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 25,860 LUTs + flip-flops; enables implementation of medium-complexity digital controllers or protocol stacks in radiation-hardened systems. |
| Block RAM | 1,824 kbits across 144 BRAM blocks; supports dual-port buffering for telemetry ingestion and command execution pipelines. |
| DSP Slices | 120 DSP48E1 units; delivers 2.4 GMAC/s at 100 MHz for onboard RF demodulation or image compression. |
| Transceivers | 24 GTY transceivers, 6.6 Gbps max; enables SpaceWire links or high-speed downlink interfaces without external SerDes. |
| I/O Banks | 10 banks supporting LVCMOS18/LVCMOS25; allows direct interfacing with legacy spacecraft sensors and avionics buses. |
| TID Rating | 100 krad(Si); qualified for multi-year LEO missions without functional degradation from cumulative ionizing dose. |
Pinout & Package
XA7A25T-1CSG325I is housed in a 325-pin, 15×15 mm, 0.8 mm pitch Chip-Scale BGA (CSG) package with thermal pad and controlled impedance routing for space-grade PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2V ±3% input required; must be filtered per MIL-PRF-38534 Class K requirements. |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic and transceiver reference; critical for JTAG and ICAP reliability. |
| M0–M2 | Configuration mode pins | Determine boot source (SPI/BPI/SLAVE_SELECTMAP); tied during power-up to define startup behavior. |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream load or configuration failure. |
| CCLK | Configuration clock | Driven externally during master SPI mode; used for synchronous bitstream loading at up to 50 MHz. |
Key Features
| Feature | Design Value |
|---|---|
| SEL-immune architecture | Triple-well SOI process eliminates single-event latch-up risk in proton and heavy-ion environments. |
| Configurable I/O standards | Per-bank voltage support (1.2V–2.5V) enables mixed-voltage interfacing with legacy spacecraft peripherals. |
| Integrated CRC checking | Hardware-accelerated frame CRC on configuration memory detects bit corruption before system initialization. |
| Partial reconfiguration | ICAP interface allows dynamic module swapping without full FPGA reset-critical for mission-critical fault recovery. |
Applications
| Onboard Telemetry Processing | Satellite Command Execution |
|---|---|
Use Scenario: Real-time parsing and filtering of sensor telemetry streams from star trackers, gyros, and power monitors before downlink. IC Role / Device Role / Timing Role: Configurable digital signal processor and protocol engine handling time-triggered packet assembly and CRC insertion. Use Value: Reduces ground station bandwidth demand by 65% via on-chip compression and prioritization using 120 DSP slices and 1,824 kbits BRAM. | Use Scenario: Secure validation and timed execution of uploaded commands received over S-band uplink channels. IC Role / Device Role / Timing Role: Trusted execution unit implementing command authentication, watchdog supervision, and deterministic actuator timing. Use Value: Guarantees sub-millisecond response latency and zero unhandled command loss under SEU exposure due to hardened configuration memory. |
| SpaceWire Interface Bridge | RF Signal Demodulation Core |
Use Scenario: Bridging between legacy MIL-STD-1553 avionics bus and modern SpaceWire payload networks. IC Role / Device Role / Timing Role: Protocol translator and rate-matching buffer with hardware FIFOs and link-layer arbitration. Use Value: Eliminates need for discrete bridge ICs; uses 24 GTY transceivers and 25K logic cells to implement dual-protocol state machines in one die. | Use Scenario: Direct QPSK/8PSK demodulation of UHF/S-band downlink signals prior to baseband processing. IC Role / Device Role / Timing Role: Real-time digital front-end performing carrier recovery, symbol timing, and soft-decision decoding. Use Value: Achieves 10⁻⁶ BER at 12 dB Eb/N0 using 120 DSP48E1 slices-enabling higher data rates without increasing transmitter power. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTAX2000D | Rad-Hard anti-fuse FPGA; non-reprogrammable; 2M system gates; no transceivers. | Used in fixed-function, long-life missions where reconfiguration is unnecessary and I/O count is low. | Select RTAX2000D only when design freeze is absolute and high-speed serial I/O is not required. |
| XQRKU060-1SFVA1152Q | Radiation-tolerant Kintex UltraScale+; 600K logic cells; 25.8 Gbps transceivers; 0.85V core. | Targets high-throughput payloads (e.g., SAR imaging) requiring >10x logic density and PCIe Gen4 support. | Choose XQRKU060-1SFVA1152Q when XA7A25T-1CSG325I logic or bandwidth headroom is insufficient for algorithm scaling. |
Compared with RTAX2000D and XQRKU060-1SFVA1152Q, the XA7A25T-1CSG325I offers optimal balance of reprogrammability, SEU resilience, and SWaP-C efficiency for mid-tier LEO payloads-neither over-provisioned nor resource-constrained.
Availability
XA7A25T-1CSG325I is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard command processors, SpaceWire bridges, and RF demodulation subsystems requiring stable component supply across extended production lifecycles.
Supply support for XA7A25T-1CSG325I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and datacenter markets with emphasis on radiation-hardened programmable logic.
The XA7A25T-1CSG325I belongs to AMD's Xilinx Aerospace Artix-7 family, engineered specifically for cost-sensitive, SWaP-constrained LEO satellite platforms needing field-upgradable logic with guaranteed radiation performance.
FAQ
What radiation hardness specifications apply to the XA7A25T-1CSG325I?
The XA7A25T-1CSG325I is characterized for total ionizing dose (TID) up to 100 krad(Si), zero LET threshold for single-event latch-up (SEL), and single-event upset (SEU) rate of <1.0 × 10⁻⁹ errors/bit-day at GEO orbit conditions. These values are verified per ESA ESCC 22900 and NASA GSFC EEE-INST-002 standards. The XA7A25T-1CSG325I meets Class K requirements under MIL-PRF-38534.
Does the XA7A25T-1CSG325I support partial reconfiguration in orbit?
Yes, the XA7A25T-1CSG325I supports ICAP-based partial reconfiguration through its internal configuration access port, enabling dynamic module swaps without full device reset. This capability is validated for use in flight software updates and fault recovery sequences. The XA7A25T-1CSG325I requires dedicated configuration controller firmware and protected memory regions to ensure integrity during reconfiguration.
What I/O standards are supported by the XA7A25T-1CSG325I?
The XA7A25T-1CSG325I supports LVCMOS18, LVCMOS25, and LVDS I/O standards across its 10 configurable I/O banks. Each bank operates independently at 1.2V, 1.5V, 1.8V, or 2.5V VCCO. The XA7A25T-1CSG325I does not support SSTL or HSTL standards. I/O voltage settings are defined at configuration time and cannot be changed dynamically.
Is the XA7A25T-1CSG325I pin-compatible with commercial Artix-7 devices?
No, the XA7A25T-1CSG325I is not pin-compatible with commercial Artix-7 FPGAs such as XC7A25T-1CSG325C. Although both use the CSG325 package, radiation-hardened variants feature modified power sequencing, enhanced ESD structures, and relocated configuration pins to meet MIL-STD-883 requirements. The XA7A25T-1CSG325I requires dedicated layout rules and decoupling per AMD XA7A25T-1CSG325I PCB design guide.
What configuration modes does the XA7A25T-1CSG325I support?
The XA7A25T-1CSG325I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Mode selection is determined by M0–M2 pin states at power-up. Internal configuration memory includes CRC protection and automatic fallback to backup image upon checksum failure. The XA7A25T-1CSG325I does not support BPI or microprocessor configuration modes.
XA7A25T-1CSG325I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7 XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1825
- Number of Logic Elements/Cells:
- 23360
- Total RAM Bits:
- 1658880
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA7A25T-1CSG325I FAQ
1.How can I place an order for XA7A25T-1CSG325I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7A25T-1CSG325I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA7A25T-1CSG325I reliable?
The price and inventory of XA7A25T-1CSG325I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A25T-1CSG325I is usually 5 days.
3.What payment methods are accepted for XA7A25T-1CSG325I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7A25T-1CSG325I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA7A25T-1CSG325I?
XA7A25T-1CSG325I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA7A25T-1CSG325I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA7A25T-1CSG325I?
For technical support, including XA7A25T-1CSG325I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A25T-1CSG325I requirements.
6.How does Aetrix verify that XA7A25T-1CSG325I is sourced from the original manufacturer or authorized distributors?
All XA7A25T-1CSG325I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A25T-1CSG325I meets industry standards.
7.What is the process for return or replacement of XA7A25T-1CSG325I?
All XA7A25T-1CSG325I units undergo pre-shipment inspection (PSI). If there is an issue with XA7A25T-1CSG325I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7A25T-1CSG325I part is unused and in its original packaging.
Return procedure for XA7A25T-1CSG325I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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