AMD XA7A35T-1CSG324Q
- Part No.:
- XA7A35T-1CSG324Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA7A35T-1CSG324Q.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XA7A35T-1CSG324Q from AMD is a radiation-tolerant Artix-7 FPGA featuring 35,000 logic cells, 2.1 Mb of block RAM, 186 DSP slices, and operation up to 628 MHz in -1 speed grade; used in spaceborne data processing units requiring single-event latch-up immunity and TID tolerance to 100 krad(Si).
For engineers reviewing the XA7A35T-1CSG324Q datasheet, pinout, applications, or equivalent options, key selection criteria include SEU mitigation capability, QML-Q/QML-V qualification status, I/O voltage support (1.2–3.3 V), and configuration via SelectMAP or JTAG.
Technical Context
The XA7A35T-1CSG324Q implements triple modular redundancy (TMR) in CLBs and hardened configuration memory with CRC error detection. It integrates 24 transceivers supporting 6.6 Gb/s serial links and includes dedicated PCIe Gen2 x2 endpoint logic.
Configuration is performed through SEU-hardened configuration memory with automatic scrubbing; power management supports dynamic voltage and frequency scaling (DVFS) across three I/O banks and two internal voltage domains (VCCINT, VCCAUX).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 35,000 - usable LUT-based fabric for custom digital logic implementation |
| Block RAM | 2.1 Mb - on-chip memory for FIFOs, buffers, or lookup tables without external DRAM |
| DSP Slices | 186 - fixed-point arithmetic units optimized for filtering and math-intensive algorithms |
| Transceivers | 24 × 6.6 Gb/s - high-speed serial I/O for space telemetry, imaging, or inter-FPGA links |
| TID Rating | 100 krad(Si) - total ionizing dose tolerance validated per MIL-STD-883 TM1019 |
| SEL Immunity | No latch-up up to 110 MeV·cm²/mg - qualified per ESA/SCC Basic Specification No. 22900 |
| I/O Standards | LVCMOS, LVDS, MIPI D-PHY - supports mixed-signal interface bridging in payload subsystems |
Pinout & Package
XA7A35T-1CSG324Q is housed in a 324-pin CSG (Chip Scale Grid Array) package with 0.8 mm pitch, thermally enhanced for conduction-cooled space applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins for analog/digital domain separation and low-noise return paths |
| VCCINT | Core supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and decoupling |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration, transceivers, and I/O banks |
| M0–M2 | Mode pins | Set boot mode (SelectMAP, JTAG, SPI) at power-on reset |
| CCLK | Configuration clock | Drives configuration data into FPGA during master SPI or SelectMAP mode |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Hardened CLB logic with voter logic reduces soft-error-induced functional failure risk |
| Configuration Scrubbing | On-the-fly bitstream integrity checking and correction prevents persistent configuration corruption |
| QML-Q Class V Qualification | Fully tested per MIL-PRF-38535 Class V for high-reliability space launch and orbital systems |
| SEU-Hardened Configuration Memory | Non-volatile memory immune to single-event upsets during long-duration missions |
| Thermal Monitoring Diode | Integrated diode enables real-time junction temperature measurement for thermal derating control |
Applications
| Earth Observation Imaging Payload | Satellite Onboard Data Handler |
|---|---|
Use Scenario: Real-time compression and preprocessing of multispectral image data from CMOS sensors before downlink. IC Role / Device Role / Timing Role: Configurable logic fabric executing custom HDL-based JPEG2000 encoders and pixel pipeline filters. Use Value: Eliminates need for external ASICs while maintaining radiation tolerance and deterministic latency under TID exposure. | Use Scenario: Aggregation, routing, and protocol translation between CAN bus, MIL-STD-1553, and SpaceWire interfaces. IC Role / Device Role / Timing Role: System-level bridge IC managing time-triggered communication scheduling and fault-isolated message buffering. Use Value: Enables mixed-bus satellite avionics integration without compromising SEL immunity or TID margin. |
| Deep Space Probe Telemetry Controller | LEO SmallSat Attitude Determination Unit |
Use Scenario: Autonomous command decoding, health monitoring, and telemetry packet formatting for Ka-band downlink. IC Role / Device Role / Timing Role: Radiation-hardened state machine orchestrating CCSDS packetization and Reed-Solomon encoding. Use Value: Provides deterministic execution timing and configuration recovery after proton-induced SEUs during solar particle events. | Use Scenario: Sensor fusion of star tracker, gyro, and magnetometer data using Kalman filter acceleration. IC Role / Device Role / Timing Role: High-throughput DSP accelerator offloading floating-point matrix operations from host MCU. Use Value: Delivers 12× faster attitude solution update rate versus software-only implementation under same power budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7A50T-1CSG324Q | 50K logic cells, identical package and radiation specs; higher static power and larger die area | Preferred when additional logic resources needed for multi-channel sensor processing or redundant control paths | Select when design requires >35K LUTs without changing PCB layout or thermal design |
| RTAX2000D | Rad-tolerant antifuse FPGA; non-reprogrammable, lower I/O count (171), no transceivers | Better for ultra-high-reliability boot ROM or fixed-function control where reconfiguration is not required | Choose only if field updates are unnecessary and deterministic timing outweighs flexibility needs |
Compared with XA7A35T-1CSG324Q, the XA7A50T-1CSG324Q offers scalable logic density within identical mechanical and radiation constraints, while RTAX2000D trades reprogrammability for absolute configuration permanence-critical for fail-safe boot functions but limiting for adaptive mission phases.
Availability
XA7A35T-1CSG324Q is available at Aetrix Electronics and suitable for satellite telemetry systems, onboard imaging processors, and deep-space probe controllers requiring stable component supply across extended production lifecycles.
Supply support for XA7A35T-1CSG324Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance and adaptive computing solutions for aerospace, defense, and industrial applications, with heritage in radiation-hardened programmable logic dating to the early 2000s.
The XA7A35T-1CSG324Q belongs to AMD's Xilinx Aerospace Artix-7 family, engineered specifically for cost-sensitive, SWaP-constrained space platforms needing reprogrammable logic with certified radiation performance.
FAQ
What radiation hardness specifications apply to the XA7A35T-1CSG324Q?
The XA7A35T-1CSG324Q is qualified to 100 krad(Si) total ionizing dose (TID), exhibits no single-event latch-up (SEL) up to 110 MeV·cm²/mg, and incorporates SEU-hardened configuration memory with scrubbing. These ratings are verified per ESA/SCC 22900 and MIL-STD-883 TM1019 test methods, and documented in the official AMD XA7A35T-1CSG324Q qualification report.
Does the XA7A35T-1CSG324Q support partial reconfiguration?
Yes, the XA7A35T-1CSG324Q supports partial reconfiguration through its hardened configuration logic and frame-based bitstream architecture. This allows dynamic module swapping in operational systems-such as updating telemetry encoding logic without resetting the entire FPGA fabric-while maintaining radiation tolerance and configuration integrity throughout the process.
What configuration modes does the XA7A35T-1CSG324Q support?
The XA7A35T-1CSG324Q supports JTAG, Master SPI, Slave SelectMAP, and BPI parallel modes. Mode selection is controlled by M0–M2 pins at power-on reset. All modes retain full SEU immunity in configuration memory, and JTAG remains accessible for debug even after radiation exposure.
Is the XA7A35T-1CSG324Q pin-compatible with commercial Artix-7 devices?
No, the XA7A35T-1CSG324Q uses a radiation-hardened I/O structure and hardened configuration circuitry that differ electrically and functionally from commercial Artix-7 parts. While the CSG324 package footprint matches, voltage tolerances, drive strength, and configuration signaling are not interchangeable-requiring dedicated board design and validation.
What thermal management guidance applies to the XA7A35T-1CSG324Q in vacuum environments?
In vacuum, the XA7A35T-1CSG324Q relies on conduction cooling through its exposed thermal pad and solder-ball array. AMD specifies a maximum junction temperature of 100°C and recommends copper-filled thermal vias under the package, direct metal mounting, and thermal interface material compliant with NASA ASTM E595 outgassing limits for sustained operation.
XA7A35T-1CSG324Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7 XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2600
- Number of Logic Elements/Cells:
- 33280
- Total RAM Bits:
- 1843200
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA7A35T-1CSG324Q FAQ
1.How can I place an order for XA7A35T-1CSG324Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7A35T-1CSG324Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XA7A35T-1CSG324Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A35T-1CSG324Q is usually 5 days.
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XA7A35T-1CSG324Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
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5.How can I obtain technical support or documentation for XA7A35T-1CSG324Q?
For technical support, including XA7A35T-1CSG324Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A35T-1CSG324Q requirements.
6.How does Aetrix verify that XA7A35T-1CSG324Q is sourced from the original manufacturer or authorized distributors?
All XA7A35T-1CSG324Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A35T-1CSG324Q meets industry standards.
7.What is the process for return or replacement of XA7A35T-1CSG324Q?
All XA7A35T-1CSG324Q units undergo pre-shipment inspection (PSI). If there is an issue with XA7A35T-1CSG324Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7A35T-1CSG324Q part is unused and in its original packaging.
Return procedure for XA7A35T-1CSG324Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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