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AMD XA7A35T-1CSG325Q
- Part No.:
- XA7A35T-1CSG325Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA7A35T-1CSG325Q.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,900
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Product details
Overview
XA7A35T-1CSG325Q from AMD is a radiation-tolerant Artix-7 FPGA with 35,000 logic cells, 2.1 Mb of block RAM, and 220 DSP slices, operating at -40°C to +105°C with 1.0V core voltage - used in space-qualified payload controllers and onboard data processors.
For engineers reviewing the XA7A35T-1CSG325Q datasheet, pinout, applications, or equivalent options, key selection criteria include TID rating (100 krad(Si)), SEL immunity (>60 MeV·cm²/mg), single-event latchup testing, and QML-Q/QML-V qualification status.
Technical Context
The XA7A35T-1CSG325Q implements a 28 nm HPL low-power FPGA architecture hardened against ionizing radiation and single-event effects. It integrates SelectIO™ technology supporting LVCMOS, LVDS, and SSTL I/O standards up to 1.35 Gbps, with configuration via JTAG or SPIx4.
It features a dedicated configuration controller with CRC error detection, internal voltage monitoring, and power-on reset circuitry. Configuration bitstream encryption and HMAC authentication are supported for secure boot integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 35,000 - determines maximum combinational/sequential logic capacity for real-time control algorithms |
| Block RAM | 2.1 Mb - supports buffering of telemetry packets or image frame storage in constrained SWaP environments |
| DSP Slices | 220 - enables fixed-point filtering, FFT, and modulation/demodulation in software-defined radio payloads |
| TID Rating | 100 krad(Si) - qualifies for long-duration low-Earth orbit missions without derating |
| SEL Threshold | >60 MeV·cm²/mg - ensures latchup immunity under proton and heavy-ion irradiation in GEO orbits |
| Operating Temp | -40°C to +105°C - validated across thermal vacuum cycling for launch and orbital operation |
| I/O Speed | 1.35 Gbps - supports high-speed sensor interfaces such as CMOS image sensors or radar ADC links |
Pinout & Package
XA7A35T-1CSG325Q is housed in a 325-pin CSG (Chip-Scale Grid Array) package with 1.0 mm pitch, qualified to MIL-STD-883 Class B and ESCC 22900 standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCINT | Core power supply and reference | Must be decoupled with ≥4×10 µF + ≥12×0.1 µF per bank to meet IR drop and noise margin specs |
| VCCAUX / VCCO | Auxiliary and I/O bank supply | VCCAUX powers configuration logic; VCCO sets I/O voltage level per bank (1.2–3.3 V) |
| M0–M2 | Configuration mode select | Determines boot source (JTAG, SPIx4, or BPI) and configuration width at power-up |
| CCLK / INIT_B | Configuration clock and status | CCLK drives bitstream loading; INIT_B signals configuration failure or reconfiguration request |
| PROGRAM_B | Configuration reset | Pulsing low forces full reconfiguration from master SPI flash or external host |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-hardened configuration memory | Prevents bit flips in SRAM frames during proton exposure; enables in-orbit reconfiguration without corruption |
| Triple modular redundancy (TMR) support | Hardware-level voting logic insertion for critical state machines and counters without LUT overhead penalty |
| Secure boot with HMAC-256 | Verifies authenticity and integrity of configuration bitstream before loading - prevents unauthorized firmware injection |
| QML-Q and QML-V qualified | Meets NASA EEE-INST-002 and ESA ESCC Basic Specification for flight-critical avionics components |
| Configurable I/O standards per bank | Enables direct interface to mixed-voltage sensors (e.g., 1.8 V CMOS imagers + 3.3 V CAN transceivers) on same device |
Applications
| Onboard Telemetry Processor | Satellite Attitude Control Unit |
|---|---|
Use Scenario: Real-time collection, formatting, and downlink scheduling of housekeeping and science data from multiple subsystems. IC Role / Device Role / Timing Role: Central data concentrator and packet assembler using embedded MicroBlaze soft-core and DMA engines. Use Value: 2.1 Mb block RAM buffers burst-mode sensor data; radiation tolerance eliminates need for watchdog scrubbing cycles. | Use Scenario: Closed-loop processing of star tracker, gyro, and magnetometer inputs to generate reaction wheel and magnetorquer commands. IC Role / Device Role / Timing Role: Deterministic real-time controller executing PID and Kalman filter algorithms at 1 kHz update rate. Use Value: 220 DSP slices accelerate matrix operations; TMR support maintains control stability during SEU events. |
| Software-Defined Radio Payload | Launch Vehicle Health Monitor |
Use Scenario: In-orbit reconfigurable waveform generation and demodulation for UHF/S-band communications. IC Role / Device Role / Timing Role: Baseband processor implementing channelization, filtering, and symbol timing recovery in real time. Use Value: 1.35 Gbps I/O supports ADC/DAC interface at 125 MSPS; radiation-hardened fabric sustains operation during solar particle events. | Use Scenario: Pre-launch and ascent-phase monitoring of vibration, temperature, pressure, and pyro firing status across multiple stages. IC Role / Device Role / Timing Role: Ruggedized data acquisition hub with isolated analog front-end interface and fault-tolerant logging. Use Value: -40°C to +105°C operation survives cryogenic fuel loading and aerodynamic heating; QML-Q qualification satisfies NASA NPR 8715.7. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7A50T-1CSG325Q | 50K logic cells, 2.5 Mb BRAM, same radiation specs and package | Higher gate count supports larger control loops or dual-redundant partitions | Select when additional logic density is required without changing PCB layout or thermal design |
| RTAX2000D | Rad-Hard anti-fuse FPGA (non-volatile), 2M system gates, lower I/O speed (≤300 Mbps) | Eliminates configuration memory vulnerability but lacks in-orbit reprogrammability | Choose for ultra-high reliability where reconfiguration is not needed and deterministic startup is mandatory |
Compared with XA7A35T-1CSG325Q, the XA7A50T-1CSG325Q offers scalable logic density within identical form factor and radiation envelope, while RTAX2000D trades SRAM-based flexibility for non-volatile configuration assurance - guiding selection based on reprogrammability vs. startup determinism requirements.
Availability
XA7A35T-1CSG325Q is available at Aetrix Electronics and suitable for satellite bus management, deep-space probe command systems, and launch vehicle avionics requiring stable component supply across extended production lifecycles.
Supply support for XA7A35T-1CSG325Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and industrial markets with emphasis on radiation-hardened programmable logic.
The XA Artix-7 family was developed specifically for high-reliability space applications requiring reprogrammable logic, deterministic timing, and certified radiation performance - bridging the gap between commercial FPGAs and legacy rad-hard ASICs.
FAQ
What radiation hardness specifications apply to the XA7A35T-1CSG325Q?
The XA7A35T-1CSG325Q is qualified to 100 krad(Si) total ionizing dose and exhibits single-event latchup immunity above 60 MeV·cm²/mg. It has undergone full QML-Q and QML-V testing per MIL-PRF-38535 and ESCC 22900, with test reports available under NDA. These ratings are measured on the actual XA7A35T-1CSG325Q device, not extrapolated from commercial variants.
Does the XA7A35T-1CSG325Q support in-orbit reconfiguration?
Yes, the XA7A35T-1CSG325Q supports partial and full reconfiguration via its hardened configuration interface, including JTAG and quad-SPI modes. Its radiation-hardened configuration memory and built-in CRC checking ensure bitstream integrity during reprogramming in space. This capability is verified in the XA7A35T-1CSG325Q qualification report and enabled by its 28 nm HPL process hardening.
What I/O standards are supported by the XA7A35T-1CSG325Q?
The XA7A35T-1CSG325Q supports LVCMOS, LVDS, BLVDS, RSDS, and SSTL I/O standards across its banks, with data rates up to 1.35 Gbps. Each I/O bank is independently configurable for voltage (1.2 V to 3.3 V), enabling mixed-signal interfacing. These capabilities are specified in the XA7A35T-1CSG325Q data sheet revision 1.2, section "SelectIO Resources".
Is the XA7A35T-1CSG325Q pin-compatible with other XA7A devices in the CSG325 package?
Yes, the XA7A35T-1CSG325Q shares identical pinout and package dimensions with XA7A50T-1CSG325Q and XA7A25T-1CSG325Q. All three use the same 325-pin CSG footprint, power sequencing, and thermal pad layout. This allows hardware reuse across performance tiers - confirmed in AMD's XA7A family migration guide v2.1.
What security features does the XA7A35T-1CSG325Q provide for configuration integrity?
The XA7A35T-1CSG325Q includes HMAC-256 authentication and AES-256 encryption for configuration bitstreams. It validates signature before loading and rejects tampered images. These security functions are implemented in dedicated on-die hardware, independent of user logic, and are active for every XA7A35T-1CSG325Q power-on cycle per its security certification documentation.
XA7A35T-1CSG325Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7 XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2600
- Number of Logic Elements/Cells:
- 33280
- Total RAM Bits:
- 1843200
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA7A35T-1CSG325Q FAQ
1.How can I place an order for XA7A35T-1CSG325Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7A35T-1CSG325Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA7A35T-1CSG325Q reliable?
The price and inventory of XA7A35T-1CSG325Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A35T-1CSG325Q is usually 5 days.
3.What payment methods are accepted for XA7A35T-1CSG325Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7A35T-1CSG325Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA7A35T-1CSG325Q?
XA7A35T-1CSG325Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA7A35T-1CSG325Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA7A35T-1CSG325Q?
For technical support, including XA7A35T-1CSG325Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A35T-1CSG325Q requirements.
6.How does Aetrix verify that XA7A35T-1CSG325Q is sourced from the original manufacturer or authorized distributors?
All XA7A35T-1CSG325Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A35T-1CSG325Q meets industry standards.
7.What is the process for return or replacement of XA7A35T-1CSG325Q?
All XA7A35T-1CSG325Q units undergo pre-shipment inspection (PSI). If there is an issue with XA7A35T-1CSG325Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7A35T-1CSG325Q part is unused and in its original packaging.
Return procedure for XA7A35T-1CSG325Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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