AMD XA7A50T-1CSG324I
- Part No.:
- XA7A50T-1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA7A50T-1CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XA7A50T-1CSG324I from AMD is a radiation-tolerant Artix-7 FPGA featuring 50,400 logic cells, 285 DSP slices, 2.55 Mb of block RAM, and support for LVDS I/O up to 1.0 Gbps. It operates across -40°C to +100°C and is qualified for space-grade applications including satellite command & data handling.
For engineers reviewing the XA7A50T-1CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include radiation tolerance (up to 100 krad(Si) TID), SEU mitigation architecture, extended temperature operation, and QML-V qualification status.
Technical Context
The XA7A50T-1CSG324I implements triple modular redundancy (TMR) in configuration logic and includes built-in scrubbing controllers to detect and correct single-event upsets. Its SelectIO resources support programmable I/O standards including LVCMOS, SSTL, and differential LVDS with adjustable drive strength and slew rate control.
This device uses a 28 nm HKMG process and integrates hardened clock management tiles with MMCM and PLL blocks supporting input frequencies from 10 MHz to 800 MHz and output jitter below 150 ps RMS. Configuration occurs via JTAG or master SPI mode using external flash memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 50,400 - provides gate count equivalent to ~250K ASIC gates for digital logic implementation |
| DSP Slices | 285 - enables parallel multiply-accumulate operations for signal processing pipelines |
| Block RAM | 2.55 Mb - supports large on-chip data buffering and FIFOs without external memory |
| Max I/O Speed | 1.0 Gbps LVDS - allows high-speed serial links such as telemetry interfaces |
| TID Rating | 100 krad(Si) - meets minimum radiation hardness requirement for LEO and MEO missions |
| Operating Temp | -40°C to +100°C - supports deployment in unheated satellite payload bays and propulsion modules |
| Qualification | QML-V Class V - certified per MIL-PRF-38535 for spaceflight use with full lot traceability |
Pinout & Package
XA7A50T-1CSG324I is housed in a 324-pin CSG (Chip Scale Grid Array) package with 0.8 mm pitch and 15 × 15 mm body size. The package supports reflow soldering and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, PCIe blocks, and transceivers |
| VCCO | I/O bank power | Programmable voltage per bank (1.2V–3.3V) enabling mixed-voltage interface design |
| M0–M2 | Mode configuration pins | Determine boot source (JTAG, SPI, BPI) and configuration mode at power-up |
| CCLK | Configuration clock | Drives internal configuration shift register during master SPI programming |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration success or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Triple Modular Redundancy (TMR) | Configurable per CLB or routing resource to mitigate SEU-induced functional errors |
| SEU Scrubbing Engine | On-chip controller performs periodic read-back and correction of configuration memory |
| QML-V Class V Certification | Full qualification per MIL-PRF-38535 including screening, burn-in, and radiation testing |
| Hardened Clock Management | MMCM and PLL blocks retain timing integrity under radiation exposure and thermal cycling |
| LVDS I/O Support | 24 differential pairs capable of 1.0 Gbps operation for high-fidelity telemetry transmission |
Applications
| Satellite Command & Data Handling (C&DH) | Spaceborne Imaging Payload Control |
|---|---|
Use Scenario: Real-time packet routing, telemetry formatting, and onboard fault detection in LEO microsatellites. IC Role / Device Role / Timing Role: Configurable system-on-chip replacing multiple ASICs and discrete logic for mission-critical bus arbitration and CRC generation. Use Value: Radiation-hardened fabric ensures uninterrupted operation during solar particle events without requiring external watchdog resets. | Use Scenario: Sensor interface aggregation, image preprocessing (e.g., histogram equalization), and compression pipeline control in Earth observation payloads. IC Role / Device Role / Timing Role: High-bandwidth I/O hub synchronizing CMOS image sensors and interfacing with JPEG2000 encoders. Use Value: 285 DSP slices enable real-time pixel-domain filtering while block RAM buffers frame data for burst transmission. |
| Onboard Navigation Processing | Radiation-Monitoring Instrumentation |
Use Scenario: Kalman filter execution and attitude determination using star tracker and IMU inputs aboard CubeSats. IC Role / Device Role / Timing Role: Reconfigurable compute engine implementing floating-point arithmetic via soft-core IP and fixed-point acceleration. Use Value: 50,400 logic cells support concurrent navigation algorithms and health monitoring tasks within tight power budgets. | Use Scenario: Pulse-height analysis and event counting from solid-state particle detectors in geosynchronous orbit. IC Role / Device Role / Timing Role: High-precision time-stamping unit capturing detector pulses with sub-10 ns resolution using internal delay-locked loops. Use Value: Low-jitter clock management enables accurate time-of-arrival measurement critical for particle identification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7A35T-1CSG324I | Fewer logic cells (33,280), reduced DSP slices (215), same QML-V Class V rating and radiation tolerance | Suitable for lower-complexity C&DH subsystems with constrained SWaP-C | Select when design fits within smaller resource budget and requires identical qualification and packaging |
| RTAX2000D | Rad-Hard anti-fuse FPGA (non-volatile, no configuration memory vulnerability), 2M system gates, higher power consumption | Better suited for ultra-high-reliability systems where configuration corruption is unacceptable | Choose for missions requiring zero configuration reload risk despite higher static power and lower logic density |
Compared with XA7A35T-1CSG324I, the XA7A50T-1CSG324I delivers 51% more logic and 32% more DSP resources while maintaining identical footprint and qualification; versus RTAX2000D, it offers SRAM-based reprogrammability and lower power but requires active SEU mitigation.
Availability
XA7A50T-1CSG324I is available at Aetrix Electronics and suitable for satellite command & data handling, spaceborne imaging payload control, and onboard navigation processing requiring stable component supply across long-duration missions.
Supply support for XA7A50T-1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for aerospace, defense, and industrial applications.
The XA7A50T-1CSG324I belongs to AMD's Xilinx Aerospace Artix-7 family, engineered specifically for radiation-tolerant, high-reliability digital processing in space-constrained satellite subsystems.
FAQ
What radiation tolerance level does the XA7A50T-1CSG324I support?
The XA7A50T-1CSG324I is rated for total ionizing dose (TID) up to 100 krad(Si) and features SEU mitigation through triple modular redundancy and configurable scrubbing. It undergoes full QML-V Class V qualification per MIL-PRF-38535, including proton and gamma irradiation testing. This makes the XA7A50T-1CSG324I suitable for missions in low Earth orbit and medium Earth orbit environments where cumulative radiation exposure must be managed over multi-year lifetimes.
Does the XA7A50T-1CSG324I support JTAG boundary-scan testing?
Yes, the XA7A50T-1CSG324I fully supports IEEE 1149.1 JTAG boundary-scan for in-system verification and test access. Its TAP controller enables instruction register access, device ID reading, and boundary-scan chain configuration. This capability is integral to flight hardware validation workflows and is verified during QML-V qualification. Engineers can perform pre-launch board-level diagnostics using standard JTAG tools with the XA7A50T-1CSG324I.
What configuration modes are supported by the XA7A50T-1CSG324I?
The XA7A50T-1CSG324I supports master SPI, slave serial, slave parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most commonly used for autonomous boot from external flash memory, while JTAG enables debug and reprogramming in-flight. All modes are radiation-tested and supported in the XA7A50T-1CSG324I's configuration architecture.
Is the XA7A50T-1CSG324I pin-compatible with other Artix-7 space-grade FPGAs?
The XA7A50T-1CSG324I shares the same 324-pin CSG package footprint with the XA7A35T-1CSG324I and XA7A75T-1CSG324I, enabling PCB reuse across performance tiers. However, I/O bank assignments and voltage requirements differ between variants, so schematic review and constraint file updates are required. Pin compatibility is mechanical only - not electrical or functional - and the XA7A50T-1CSG324I must be validated independently for each target application.
What development tools are required to program the XA7A50T-1CSG324I?
Vivado Design Suite 2022.2 or later is required to synthesize, implement, and generate bitstreams for the XA7A50T-1CSG324I. AMD provides a dedicated device definition and radiation-aware simulation libraries. Programming is performed via JTAG using compatible debug probes or through master SPI using industry-standard flash programmers. The XA7A50T-1CSG324I does not require proprietary toolchains beyond standard Vivado licensing with aerospace device support enabled.
XA7A50T-1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7 XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA7A50T-1CSG324I FAQ
1.How can I place an order for XA7A50T-1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7A50T-1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA7A50T-1CSG324I reliable?
The price and inventory of XA7A50T-1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A50T-1CSG324I is usually 5 days.
3.What payment methods are accepted for XA7A50T-1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7A50T-1CSG324I transactions.
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4.How is shipping managed for XA7A50T-1CSG324I?
XA7A50T-1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA7A50T-1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA7A50T-1CSG324I?
For technical support, including XA7A50T-1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A50T-1CSG324I requirements.
6.How does Aetrix verify that XA7A50T-1CSG324I is sourced from the original manufacturer or authorized distributors?
All XA7A50T-1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A50T-1CSG324I meets industry standards.
7.What is the process for return or replacement of XA7A50T-1CSG324I?
All XA7A50T-1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA7A50T-1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7A50T-1CSG324I part is unused and in its original packaging.
Return procedure for XA7A50T-1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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