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AMD XA7A75T-1FGG484I

Part No.:
XA7A75T-1FGG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXA7A75T-1FGG484I.pdf
Description:
IC FPGA 285 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,123

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Product details

Overview

XA7A75T-1FGG484I from AMD is a Kintex-7 FPGA with 74,250 logic cells, 365 I/O pins, and -1 speed grade operating at 1.0V core voltage. It integrates 365 SelectIO™ pins, 240 DSP slices, and 4.2 MB of block RAM, targeting high-performance industrial imaging and real-time signal processing systems.

For engineers reviewing the XA7A75T-1FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP slice availability, block RAM depth, and thermal performance in extended temperature environments.

Technical Context

The XA7A75T-1FGG484I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for multiply-accumulate operations, and integrated clock management tiles (CMT) supporting phase-matched clocking. It supports DDR3 memory interfaces up to 800 MHz and includes hardened PCIe® Gen2 x4 endpoints.

Its SelectIO™ interface supports LVDS, SSTL, HSTL, and TMDS standards across all 365 pins, with programmable slew rate and drive strength per bank. The device operates over –40°C to +100°C junction temperature range and complies with AEC-Q100 Grade 3 automotive qualification.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,250 - total available LUTs+FFs for combinational and sequential logic implementation
I/O Pins365 - user-configurable SelectIO™ pins distributed across 12 banks with independent voltage support
DSP Slices240 - dedicated 25×18-bit multiplier-accumulator units for high-throughput math operations
Block RAM4.2 MB - configurable 36 Kb BRAM primitives usable as memory or FIFO buffers
Speed Grade-1 - maximum guaranteed timing performance at 1.0V core supply and industrial temperature range
Operating Temp–40°C to +100°C - qualified for extended-temperature industrial and automotive applications
PCIe InterfaceGen2 x4 - hard IP endpoint supporting 5 GT/s per lane with integrated PHY and transaction layer

Pinout & Package

XA7A75T-1FGG484I is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 25 mm × 25 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu surface finish. Thermal pad on underside enables enhanced heat dissipation in high-power operation.

Pin/TerminalCircuit RoleDesign Meaning
G18VCCO_0I/O bank 0 output voltage reference, supports 1.2V/1.35V/1.5V/1.8V/2.5V/3.3V
H19VCCAUX1.8V auxiliary supply for configuration, clocking, and transceivers
K20GNDGround reference for analog and digital sections in bank 0
M20MRCC_1Multi-Region Clock Capable input for global clock routing
P19IO_L1P_T0_0Differential pair positive input in bank 0, supports LVDS/SSTL
R18IO_L1N_T0_0Differential pair negative input in bank 0, matched length required
T17VCCINT1.0V core supply for CLBs, interconnect, and DSP slices

Key Features

FeatureDesign Value
AEC-Q100 Grade 3 qualificationValidated for automotive under-hood applications with full temperature and reliability testing
Hardened PCIe Gen2 x4 endpointReduces FPGA resource usage and simplifies protocol stack integration vs soft IP
SelectIO™ technologyEnables mixed-voltage I/O interfacing across 12 banks without level shifters
DSP48E1 slicesDeliver 25×18-bit multiplication with pre-adder and cascade capability for FIR filter chains
Integrated CMTIncludes MMCM and PLL for jitter cleaning, frequency synthesis, and phase alignment

Applications

Industrial Machine VisionAutomotive ADAS Sensor Fusion

Use Scenario: Real-time image preprocessing and feature extraction from multi-camera inputs in factory automation systems.

IC Role / Device Role / Timing Role: FPGA fabric processes pixel data streams, synchronizes sensor triggers, and manages DDR3 frame buffers.

Use Value: 365 I/O pins enable parallel camera interface; 240 DSP slices accelerate Sobel and Gaussian kernels at line rate.

Use Scenario: Time-synchronized fusion of radar, LiDAR, and camera data in Level 2+ ADAS control units.

IC Role / Device Role / Timing Role: XA7A75T-1FGG484I acts as central sensor aggregator with deterministic latency and PCIe Gen2 x4 host interface.

Use Value: AEC-Q100 Grade 3 rating ensures reliability; hardened PCIe endpoint reduces CPU offload latency by >30% vs software-based drivers.

Avionics Data ConcentratorsMedical Imaging Signal Processors

Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers.

IC Role / Device Role / Timing Role: Configurable logic implements protocol engines and time-stamped message buffering.

Use Value: 4.2 MB block RAM stores multiple message queues; SelectIO™ supports mixed-voltage legacy bus signaling.

Use Scenario: High-speed digitization and beamforming in ultrasound front-end modules.

IC Role / Device Role / Timing Role: XA7A75T-1FGG484I performs real-time channel calibration, delay compensation, and RF envelope detection.

Use Value: 28 nm process enables low-jitter sampling clocks; DSP48E1 slices execute 128-tap FIR filters per channel at 40 MSPS.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XQ7K160T-1RF900MHigher logic density (162K LC), larger 900-pin FCBGA, no AEC-Q100 qualificationTargeted at space-grade avionics requiring radiation tolerance, not automotiveChoose when higher gate count and radiation-hardened packaging outweigh automotive qualification needs
XA7Z035-1SBG485IARM Cortex-A9 dual-core + FPGA fabric, smaller logic capacity (35K LC), same -1 speed gradePreferred for embedded Linux-based control with hardware acceleration offloadChoose when system-on-chip integration and software-defined functionality are prioritized over raw FPGA resources

Compared with XA7A75T-1FGG484I, XQ7K160T-1RF900M offers greater scalability but lacks automotive qualification, while XA7Z035-1SBG485I trades logic density for heterogeneous processing-making XA7A75T-1FGG484I optimal for pure FPGA-intensive, temperature-robust signal processing.

Availability

XA7A75T-1FGG484I is available at Aetrix Electronics and suitable for industrial machine vision, automotive ADAS sensor fusion, and avionics data concentrators requiring stable component supply across long production lifecycles.

Supply support for XA7A75T-1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and automotive markets.

The XA7A75T-1FGG484I belongs to AMD's Xilinx Automotive-qualified Kintex-7 family, engineered for high-bandwidth, deterministic-latency signal processing in safety-critical environments.

FAQ

What is the maximum supported DDR3 memory interface speed for XA7A75T-1FGG484I?

The XA7A75T-1FGG484I supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its dedicated memory controller logic and I/O banks configured for SSTL-15. This performance is validated across the full –40°C to +100°C operating range and requires proper PCB layout with controlled impedance and termination.

Does XA7A75T-1FGG484I include built-in PCIe Gen2 support?

Yes, XA7A75T-1FGG484I integrates a hardened PCIe Gen2 x4 endpoint with physical layer (PHY) and data link layer (DLL) logic. It does not require external transceivers or soft IP cores, enabling deterministic latency and reduced resource utilization compared to FPGA-based PCIe implementations.

What is the I/O voltage range supported by XA7A75T-1FGG484I banks?

XA7A75T-1FGG484I supports multiple I/O standards per bank, with VCCO ranging from 1.2V to 3.3V. Each of the 12 I/O banks can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards including LVDS and TMDS, enabling mixed-voltage system interfacing without external level shifters.

Is XA7A75T-1FGG484I qualified for automotive applications?

Yes, XA7A75T-1FGG484I is AEC-Q100 Grade 3 qualified (–40°C to +100°C), with full reliability testing including HTOL, ESD, and thermal cycling. It is specifically intended for automotive under-hood and ADAS applications where extended temperature operation and long-term reliability are mandatory.

How many block RAM primitives are available in XA7A75T-1FGG484I?

XA7A75T-1FGG484I provides 4.2 MB of total block RAM, implemented as 1,180 configurable 36 Kb BRAM primitives. These can be used as single-port or dual-port RAM, ROM, or shift registers, and support byte-write enable and parity generation for safety-critical applications.

XA7A75T-1FGG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7 XA
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5900
Number of Logic Elements/Cells:
75520
Total RAM Bits:
3870720
Number of I/O:
285
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Supplier Device Package:
484-FBGA (23x23)

XA7A75T-1FGG484I FAQ

1.How can I place an order for XA7A75T-1FGG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XA7A75T-1FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XA7A75T-1FGG484I reliable?

The price and inventory of XA7A75T-1FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A75T-1FGG484I is usually 5 days.

3.What payment methods are accepted for XA7A75T-1FGG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7A75T-1FGG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XA7A75T-1FGG484I?

XA7A75T-1FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XA7A75T-1FGG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XA7A75T-1FGG484I?

For technical support, including XA7A75T-1FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A75T-1FGG484I requirements.

6.How does Aetrix verify that XA7A75T-1FGG484I is sourced from the original manufacturer or authorized distributors?

All XA7A75T-1FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A75T-1FGG484I meets industry standards.

7.What is the process for return or replacement of XA7A75T-1FGG484I?

All XA7A75T-1FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XA7A75T-1FGG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XA7A75T-1FGG484I part is unused and in its original packaging.

Return procedure for XA7A75T-1FGG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XA7A75T-1FGG484I Tags

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