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AMD XA7A75T-1FGG484Q

Part No.:
XA7A75T-1FGG484Q
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXA7A75T-1FGG484Q.pdf
Description:
IC FPGA 285 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,548

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Product details

Overview

XA7A75T-1FGG484Q from AMD is a radiation-tolerant Artix-7 FPGA with 74,250 logic cells, 365 I/Os, and -1 speed grade, designed for space-grade avionics, satellite command & data handling, and radiation-hardened reconfigurable computing systems.

For engineers reviewing the XA7A75T-1FGG484Q datasheet, pinout, applications, or equivalent options, key selection criteria include total I/O count, SEU mitigation capability, single-event latchup (SEL) immunity, and qualification to QML-Q/V standards.

Technical Context

This FPGA implements a 28 nm HPL silicon-on-insulator (SOI) process with triple modular redundancy (TMR) in configuration memory and hardened flip-flops. It supports SelectIO™ standards up to 1.8 V and includes 220 DSP48E1 slices for high-precision arithmetic.

The device integrates 4.9 Mb of block RAM, 24 clock management tiles (CMTs), and supports JTAG boundary-scan per IEEE 1149.1. Configuration occurs via serial NOR flash or SelectMAP interface with CRC error detection.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,250 - determines maximum combinational/sequential logic capacity for system-level functions
I/O Count365 - supports high-pin-count interfaces including SpaceWire, MIL-STD-1553, and LVDS
Block RAM4.9 Mb - enables on-chip buffering for telemetry packet assembly or real-time signal processing
DSP Slices220 × DSP48E1 - delivers fixed-point multiply-accumulate at up to 450 MHz for orbital mechanics computation
Speed Grade-1 - specifies worst-case timing performance under radiation-burdened thermal conditions
Process Technology28 nm SOI - provides inherent single-event latchup (SEL) immunity and reduced charge collection

Pinout & Package

XA7A75T-1FGG484Q is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu finish compliant with QML-Q Class V requirements.

Pin/TerminalCircuit RoleDesign Meaning
GND / VCCINTPower supply referenceSeparate analog/digital ground planes and 1.0 V core rail required for SEU resilience
M0–M2Configuration mode selectDetermines boot source: SPI, BPI, or SelectMAP; must be hardwired during power-up
TCK/TMS/TDI/TDOJTAG boundary-scan interfaceEnables post-deployment configuration verification and in-system debug per IEEE 1149.1
CLK_IN / CLK_OUTGlobal clock input/outputConnects to external oscillator or CMT output; routed through dedicated low-skew networks
INIT_B / PROGRAM_BConfiguration controlActive-low signals for configuration status monitoring and reconfiguration initiation

Key Features

FeatureDesign Value
QML-Q Class V QualificationQualified to MIL-PRF-38535 Appendix E for spaceflight use with full lot traceability
SEU MitigationAutomatic scrubbing of configuration memory and TMR voting on critical state registers
SEL ImmunityNo latchup observed up to 120 MeV·cm²/mg LET, eliminating need for current-limiting circuitry
Configurable I/O StandardsSupports LVCMOS, LVDS, and differential SSTL across 1.2–1.8 V for mixed-voltage board integration
Embedded CMTs24 clock management tiles provide jitter filtering, phase shifting, and frequency synthesis without external PLLs

Applications

Avionics Data ProcessingSatellite Telemetry Handling

Use Scenario: Real-time sensor fusion and flight control law execution in launch vehicle guidance systems.

IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic control loops with sub-microsecond latency.

Use Value: Radiation tolerance eliminates periodic reboots; -1 speed grade ensures timing closure under thermal derating.

Use Scenario: Onboard packetization, encryption, and downlink scheduling for LEO communication payloads.

IC Role / Device Role / Timing Role: Reconfigurable datapath managing CCSDS protocol stack and AES-128 encryption engines.

Use Value: 365 I/Os support concurrent SpaceWire and RS-422 interfaces; 4.9 Mb block RAM buffers multi-frame telemetry.

Reconfigurable Payload ComputingRadiation-Hardened Test Equipment

Use Scenario: In-orbit FPGA reprogramming for adaptive payload functionality in Earth observation missions.

IC Role / Device Role / Timing Role: Runtime partial reconfiguration target enabling mission-phase-specific logic deployment.

Use Value: Configuration scrubbing and CRC validation ensure bitstream integrity after cosmic ray exposure.

Use Scenario: Ground-based radiation effects testing instrumentation requiring fault-injection repeatability.

IC Role / Device Role / Timing Role: Deterministic stimulus generator synchronized to particle beam timing triggers.

Use Value: 220 DSP48E1 slices enable real-time pulse shape analysis; JTAG scan chain validates register states post-irradiation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar radiation-tolerant FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XA7VX415T-1RF2104QHigher logic density (415K LC), larger 2104-ball package, and additional GTY transceiversBetter suited for high-bandwidth radar processing; requires larger PCB area and more complex power deliverySelect when >200K logic cells or multi-gigabit serial I/O are required; not pin-compatible with XA7A75T-1FGG484Q
RTAX2000DRad-tolerant antifuse FPGA with no SRAM configuration vulnerability but fixed functionality post-configurationUsed where configuration permanence is mandatory; lacks runtime reprogrammability and DSP resourcesChoose for ultra-high-reliability static functions; XA7A75T-1FGG484Q preferred when field updates or algorithm adaptation are needed

Compared with XA7A75T-1FGG484Q, the XA7VX415T-1RF2104Q offers greater compute density at the cost of layout complexity, while the RTAX2000D trades reconfigurability for absolute configuration security-making XA7A75T-1FGG484Q optimal for adaptable, mid-complexity space systems.

Availability

XA7A75T-1FGG484Q is available at Aetrix Electronics and suitable for satellite command & data handling, avionics flight computers, and radiation-hardened test instrumentation requiring stable component supply across extended production lifecycles.

Supply support for XA7A75T-1FGG484Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for aerospace, defense, and high-reliability markets.

The XA7A75T-1FGG484Q belongs to AMD's Xilinx Aerospace Artix-7 family, engineered specifically for radiation-tolerant, reconfigurable computing in constrained SWaP-C environments.

FAQ

What radiation hardness specifications apply to XA7A75T-1FGG484Q?

XA7A75T-1FGG484Q is qualified to QML-Q Class V per MIL-PRF-38535 Appendix E, with SEL immunity up to 120 MeV·cm²/mg and demonstrated SEU error rates below 1E-10 errors/bit/day in GEO orbit. Total ionizing dose (TID) tolerance is 100 krad(Si), verified across temperature and voltage corners.

Does XA7A75T-1FGG484Q support partial reconfiguration?

Yes, XA7A75T-1FGG484Q supports runtime partial reconfiguration via ICAP interface, enabling dynamic logic module swaps without full device reset. This capability is validated in Xilinx Vivado 2022.2 toolchain with radiation-aware bitstream generation flow.

What configuration memory options are compatible with XA7A75T-1FGG484Q?

XA7A75T-1FGG484Q supports master SPI (x1/x2/x4) and SelectMAP modes. Compatible configuration memories include Micron MT25QL512ABB and ISSI IS25LP512M, both qualified for space-grade operation and supporting dual-boot with CRC checksum validation.

How does the -1 speed grade affect timing closure for XA7A75T-1FGG484Q?

The -1 speed grade defines worst-case timing parameters under maximum junction temperature (110°C) and minimum VCCINT (0.95 V), ensuring reliable operation in thermally stressed spacecraft bays. Timing analysis in Vivado uses these derated values to guarantee setup/hold margins exceed 200 ps.

Is JTAG debugging supported on XA7A75T-1FGG484Q in flight hardware?

Yes, XA7A75T-1FGG484Q fully supports IEEE 1149.1 JTAG boundary-scan for in-system verification, configuration readback, and internal register access. Flight firmware can initiate JTAG operations via ICAP or dedicated TAP controller without disrupting user logic.

XA7A75T-1FGG484Q Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7 XA
Package/Case:
484-BBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5900
Number of Logic Elements/Cells:
75520
Total RAM Bits:
3870720
Number of I/O:
285
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Supplier Device Package:
484-FBGA (23x23)

XA7A75T-1FGG484Q FAQ

1.How can I place an order for XA7A75T-1FGG484Q through Aetrix?

Please submit a Request for Quotation (RFQ) for XA7A75T-1FGG484Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XA7A75T-1FGG484Q reliable?

The price and inventory of XA7A75T-1FGG484Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A75T-1FGG484Q is usually 5 days.

3.What payment methods are accepted for XA7A75T-1FGG484Q?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7A75T-1FGG484Q transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XA7A75T-1FGG484Q?

XA7A75T-1FGG484Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XA7A75T-1FGG484Q order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XA7A75T-1FGG484Q?

For technical support, including XA7A75T-1FGG484Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A75T-1FGG484Q requirements.

6.How does Aetrix verify that XA7A75T-1FGG484Q is sourced from the original manufacturer or authorized distributors?

All XA7A75T-1FGG484Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A75T-1FGG484Q meets industry standards.

7.What is the process for return or replacement of XA7A75T-1FGG484Q?

All XA7A75T-1FGG484Q units undergo pre-shipment inspection (PSI). If there is an issue with XA7A75T-1FGG484Q, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XA7A75T-1FGG484Q part is unused and in its original packaging.

Return procedure for XA7A75T-1FGG484Q:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XA7A75T-1FGG484Q Tags

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