AMD XA7A75T-2CSG324I
- Part No.:
- XA7A75T-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XA7A75T-2CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XA7A75T-2CSG324I from AMD is a Kintex-7 FPGA with 74,250 logic cells, 340 I/O pins, and -2 speed grade in a 324-pin CSGA package; it supports high-speed serial transceivers up to 13.1 Gbps and is used in radar signal processing and high-bandwidth data acquisition systems.
For engineers reviewing the XA7A75T-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), configuration interface (SPIx4/JTAG), and thermal performance in extended industrial temperature range (-40°C to +100°C).
Technical Context
The XA7A75T-2CSG324I implements a hardened multi-gigabit transceiver architecture with 16 GT lanes, each supporting protocols including PCIe Gen2, SATA, and SRIO. It integrates block RAM (4,860 kbits), DSP slices (360), and clock management tiles with MMCM/PLL for jitter attenuation and frequency synthesis.
Configuration is performed via Master SPI or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device operates across -40°C to +100°C and meets AEC-Q100 Grade 2 automotive qualification requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - determines maximum combinational and sequential logic capacity for custom digital functions |
| I/O Pins | 340 - supports high-density peripheral interfacing with banked voltage and slew-rate control |
| Transceiver Lanes | 16 × GT - enables 16 independent serial links up to 13.1 Gbps for multi-channel data streaming |
| Block RAM | 4,860 kbits - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 360 - accelerates fixed-point arithmetic for filtering, FFT, and real-time signal processing |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for under-hood automotive and harsh-environment industrial deployment |
Pinout & Package
XA7A75T-2CSG324I is housed in a 324-pin Chip Scale Grid Array (CSGA) package with 1.0 mm pitch, 15×15 mm body size, and exposed thermal pad for enhanced heat dissipation in thermally constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/JTAG/Slave SelectMAP) during power-up reset |
| CCLK | Configuration Clock | Drives master SPI configuration clock; also used for readback and debug operations |
| DIN | Serial Data Input | Receives configuration bitstream in Master SPI mode |
| INIT_B | Configuration Status | Active-low open-drain output indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low input that initiates full reconfiguration and clears internal state |
| GTX/GTH RefClk | Transceiver Reference Clock | Dedicated differential inputs for transceiver PLL reference clocks (100–650 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened Multi-Gigabit Transceivers | 16 GT lanes with built-in 8B/10B encoding, comma detection, and elastic buffers for protocol-agnostic high-speed serial I/O |
| Secure Configuration | Supports AES-256 bitstream encryption and HMAC-based authentication to prevent cloning and unauthorized firmware loading |
| Automotive Qualification | AEC-Q100 Grade 2 certified with full traceability, lot-level screening, and extended temperature operation |
| Configurable I/O Standards | Supports LVCMOS, SSTL, HSTL, TMDS, and differential standards (LVDS, BLVDS, RSDS) across 18 I/O banks |
| Embedded Processing Subsystem | Optional MicroBlaze soft processor integration with tightly coupled local memory and AXI interconnect for control-plane offload |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in automotive and defense radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines; transceivers interface with ADC/DACs and RF front-ends. Use Value: 16 GT lanes enable simultaneous multi-channel digitization at >1 GSPS aggregate throughput with deterministic latency. | Use Scenario: Synchronized sampling of multiple sensor channels in test equipment and scientific instrumentation. IC Role / Device Role / Timing Role: Configurable I/O banks align to diverse ADC interfaces (JESD204B, CMOS, LVDS); DSP slices perform on-the-fly calibration and decimation. Use Value: 340 I/O pins and bank-level voltage flexibility allow direct connection to heterogeneous analog front-ends without level-shifting components. |
| Industrial Ethernet Gateway | Onboard Vehicle Control Unit |
Use Scenario: Protocol translation and real-time packet processing between PROFINET, EtherCAT, and Time-Sensitive Networking (TSN) domains. IC Role / Device Role / Timing Role: Implements hardwired MACs and time-aware shapers using FPGA logic; transceivers connect to PHYs and backplane interfaces. Use Value: -2 speed grade ensures sub-microsecond timing closure for TSN time-synchronization paths under thermal stress. | Use Scenario: Integrated domain controller managing ADAS sensors, camera fusion, and actuator interfaces in autonomous driving platforms. IC Role / Device Role / Timing Role: Hosts safety-critical ASIL-B software on MicroBlaze with lockstep monitoring; FPGA fabric handles low-latency sensor preprocessing. Use Value: AEC-Q100 Grade 2 qualification and secure boot ensure functional safety compliance and firmware integrity in mission-critical vehicle subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7A100T-2CSG324I | Higher logic capacity (101,440 cells), same package and speed grade; increased DSP slices (400) and BRAM (5,696 kbits) | Better suited for larger algorithm partitions and multi-function integration; higher static power consumption | Select when design requires >74K LUTs or additional DSP/BRAM resources without changing PCB layout |
| XA7Z030-2SBG485I | ARM Cortex-A9 dual-core + programmable logic; 28K logic cells; different package (485-pin SBGA) and lower transceiver count (only 4 GT lanes) | Optimized for embedded Linux + hardware acceleration co-design; not drop-in compatible due to pinout and architecture differences | Choose when system demands integrated processing, OS support, and moderate programmable logic-requires new board design |
Compared with XA7A75T-2CSG324I, the XA7A100T-2CSG324I offers scalable logic headroom within identical mechanical and thermal constraints, while the XA7Z030-2SBG485I shifts toward heterogeneous SoC architecture-requiring architectural trade-offs in latency, security model, and development toolchain.
Availability
XA7A75T-2CSG324I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and industrial Ethernet gateway applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XA7A75T-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and automotive markets with emphasis on performance-per-watt and silicon-proven reliability.
The XA7A75T-2CSG324I belongs to AMD's Xilinx Automotive Kintex-7 family, engineered specifically for high-throughput, low-latency signal processing in safety-critical automotive and industrial environments.
FAQ
What is the maximum transceiver data rate supported by XA7A75T-2CSG324I?
The XA7A75T-2CSG324I supports a maximum transceiver line rate of 13.1 Gbps per GT lane. This capability is validated across the full industrial temperature range and enables compliance with PCIe Gen2, SATA III, and SRIO Gen2 protocols. Each of the 16 GT lanes operates independently with programmable pre-emphasis and receiver equalization.
Does XA7A75T-2CSG324I support secure boot functionality?
Yes, XA7A75T-2CSG324I supports secure boot via AES-256 bitstream encryption and HMAC-based authentication. These features are implemented in hardware and verified during configuration to prevent unauthorized firmware execution. Secure boot is enabled through dedicated eFUSE programming and requires no external security IC.
What configuration modes are available for XA7A75T-2CSG324I?
XA7A75T-2CSG324I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Master SPI is most commonly used for fast, single-bitstream loading from serial flash; JTAG is used for debugging and partial reconfiguration.
Is XA7A75T-2CSG324I qualified for automotive applications?
Yes, XA7A75T-2CSG324I is AEC-Q100 Grade 2 qualified (-40°C to +100°C) and manufactured with automotive-grade process controls, lot traceability, and enhanced reliability screening. It is intended for use in engine control, ADAS, and vehicle networking systems where functional safety and long-term supply stability are required.
What I/O standards does XA7A75T-2CSG324I support?
XA7A75T-2CSG324I supports 18 I/O standards across its 18 banks, including LVCMOS (1.2 V to 3.3 V), SSTL, HSTL, TMDS, LVDS, BLVDS, and RSDS. Each bank is independently configurable for voltage and termination, enabling mixed-voltage interface designs without external level shifters.
XA7A75T-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7 XA
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 324-CSPBGA (15x15)
XA7A75T-2CSG324I FAQ
1.How can I place an order for XA7A75T-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7A75T-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA7A75T-2CSG324I reliable?
The price and inventory of XA7A75T-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7A75T-2CSG324I is usually 5 days.
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Once your XA7A75T-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for XA7A75T-2CSG324I?
For technical support, including XA7A75T-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7A75T-2CSG324I requirements.
6.How does Aetrix verify that XA7A75T-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XA7A75T-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7A75T-2CSG324I meets industry standards.
7.What is the process for return or replacement of XA7A75T-2CSG324I?
All XA7A75T-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XA7A75T-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7A75T-2CSG324I part is unused and in its original packaging.
Return procedure for XA7A75T-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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