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AMD XA7K160T-1FFG676Q
- Part No.:
- XA7K160T-1FFG676Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XA7K160T-1FFG676Q.pdf
- Description:
- FPGA KINTEX7 Q100 400 I/O 676BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,113
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Product details
Overview
XA7K160T-1FFG676Q from Xilinx is an automotive-grade Kintex-7 FPGA optimized for high-reliability, high-performance embedded control and signal processing in ADAS, infotainment gateways, and vehicle networking systems. It delivers 162,240 logic cells, 600 DSP48E1 slices (1,781 GMACs), 325 × 36 Kb block RAMs, dual 12-bit 1 MSPS XADC converters, and 8 GTX transceivers supporting up to 8.0 Gb/s.
For engineers reviewing the XA7K160T-1FFG676Q datasheet, pinout, applications, or equivalent options, this page provides verified automotive-qualified specs, thermal and I/O constraints, PCIe Gen2 endpoint integration, and validated alternatives for AEC-Q100-compliant design-in.
Technical Context
The XA7K160T-1FFG676Q implements real 6-input LUT-based logic with distributed RAM/SRL capability, eight clock management tiles (CMTs), each combining a PLL and MMCM for sub-11.2 ps phase-shift resolution at 1600 MHz, and supports DDR3 interfaces up to 1600 Mb/s using HP/HR I/O banks.
Its 8 GTX transceivers provide full-duplex serial bandwidth up to 128 Gb/s, integrated PCIe Gen2 x4 Endpoint logic compliant with PCI Express Base Specification 2.1, and on-chip XADC with 17-channel analog multiplexing, thermal sensing (±4°C error), and supply monitoring (±1% error).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 162,240 - enables complex real-time ADAS vision preprocessing or multi-domain controller consolidation. |
| DSP Slices | 600 - delivers 1,781 GMACs for radar FFT, sensor fusion, or audio beamforming without external DSP. |
| Block RAM | 325 × 36 Kb - supports 11,700 Kb on-chip buffering for video frame storage or protocol stack queues. |
| XADC | Dual 12-bit @ 1 MSPS - monitors battery voltage, junction temperature, and external analog sensors with no external ADC required. |
| GTX Transceivers | 8 × up to 8.0 Gb/s - enables camera links (e.g., MIPI D-PHY over FPGA), automotive Ethernet AVB, or PCIe-based ECU interconnect. |
| I/O Banks & Pins | 8 banks, 400 max user I/O - includes 250 HR (1.2–3.3 V) and 150 HP (1.2–1.8 V) pins for mixed-voltage automotive subsystem interfacing. |
| Operating Temp | –40°C to +125°C (Tj) - certified for under-hood and transmission-control applications per AEC-Q100 Grade 1. |
| PCIe Interface | Integrated x4 Gen2 Endpoint - eliminates external PCIe switch; supports direct connection to automotive GPUs or NICs. |
Pinout & Package
XA7K160T-1FFG676Q uses a 27 mm × 27 mm FFG676 package with 1.0 mm ball pitch, Pb-free construction, and 676 I/O balls. The package supports 400 user-configurable I/Os across 8 banks (6 HR, 2 HP), with dedicated configuration, power, and XADC reference pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation due to 28 nm HKMG process sensitivity. |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, CMTs, PCIe block, and transceiver reference circuitry. |
| VCCO | I/O Bank Supply | Per-bank programmable 1.2–3.3 V output drive; HR banks support 3.3 V LVCMOS for legacy CAN/LIN transceivers. |
| VRP/VRN | Differential Reference | Bank-specific internal termination reference for LVDS, RSDS, and differential SSTL; two pins per bank except Bank 0. |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that triggers full reconfiguration from SPI/BPI flash - critical for fail-safe firmware updates. |
| M0–M2 | Mode Selection | Three-pin strap defining boot source (SPI x4, BPI x16, JTAG, etc.) - must be hard-wired at PCB level for automotive production. |
| AD0–AD16 | XADC Inputs | 17-channel analog input multiplexer; includes dedicated on-die temp/supply sensors - no external components needed for health monitoring. |
| GTxXP/GTxXN | GTX Differential Pair | 8 bidirectional transceiver lanes; each pair supports 500 Mb/s–8.0 Gb/s with CTLE/DFE equalization for backplane or cable reach. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q100 Qualified | Grade 1 (–40°C to +125°C) qualification with PPAP documentation - meets OEM requirements for safety-critical ECUs without additional qualification effort. |
| Integrated PCIe Gen2 x4 | Hard IP block eliminating soft-core latency and resource overhead - enables deterministic <1 µs endpoint response for time-sensitive diagnostics or OTA update routing. |
| On-chip XADC | Dual 12-bit 1 MSPS converters with thermal/supply sensors - replaces discrete monitoring ICs, reducing BOM count and board area in compact automotive modules. |
| Partial Reconfiguration | Runtime bitstream swapping of logic regions - allows dynamic feature activation (e.g., switching between parking assist and highway ADAS modes) without system reboot. |
| 256-bit AES + HMAC/SHA-256 | Hardware-accelerated bitstream encryption - protects proprietary algorithm IP against cloning or reverse engineering in field-deployed vehicles. |
| SEU Detection & Correction | Single-event upset mitigation in configuration memory - essential for radiation-tolerant operation in high-altitude or long-duration automotive deployments. |
Applications
| Advanced Driver Assistance Systems (ADAS) | Automotive Infotainment Gateway |
|---|---|
Use Scenario: Real-time fusion of radar, camera, and ultrasonic sensor data for object detection and path prediction. IC Role / Device Role / Timing Role: Primary compute accelerator executing CNN inference and Kalman filtering; synchronized via CMT-generated low-jitter clocks to sensor interfaces. Use Value: 600 DSP slices and 162k logic cells enable sub-50 ms end-to-end latency while meeting ASIL-B functional safety requirements through partial reconfiguration isolation. |
Use Scenario: Aggregating and routing data between CAN FD, Ethernet AVB, USB, and display interfaces in central domain controllers. IC Role / Device Role / Timing Role: Protocol translation hub with PCIe Gen2 x4 upstream to SoC and 8 GTX lanes downstream to camera/radar modules. Use Value: Integrated PCIe and high-speed transceivers eliminate external bridge chips, reducing latency by >30% and enabling deterministic 100 µs inter-domain message delivery. |
| Electric Vehicle Powertrain Control | Automotive Ethernet Switching |
Use Scenario: Closed-loop motor control and battery management system (BMS) supervision in traction inverters. IC Role / Device Role / Timing Role: Safety monitor co-processor sampling XADC thermal/supply data and validating MCU outputs via dual-lockstep comparison logic. Use Value: On-die XADC with ±4°C accuracy and SEU correction ensures continuous health monitoring without external fault injection testing or redundant ADCs. |
Use Scenario: Time-Sensitive Networking (TSN) switch for autonomous driving sensor networks requiring sub-1 µs packet timing precision. IC Role / Device Role / Timing Role: Deterministic Ethernet MAC layer with IEEE 802.1AS timestamping, implemented using 1600 Mb/s DDR3 I/O and CMT-synchronized 8 ns resolution timers. Use Value: HR I/O banks support 3.3 V PHY interfacing while CMT jitter filtering guarantees <50 ns clock uncertainty for TSN synchronization packets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XA7K325T-1FFG901Q | Higher density: 326,080 logic cells, 900 DSP slices, 650 block RAMs; same 28 nm HKMG process and AEC-Q100 Grade 1 rating. | Required for designs needing >2× logic capacity (e.g., full-stack autonomous driving OS + perception + planning on single FPGA). | Select when XA7K160T-1FFG676Q resources are insufficient but same automotive qualification and toolchain compatibility are mandatory. |
| XC7K160T-1FFG676I | Commercial-grade (–40°C to +100°C), identical logic/DSP/RAM specs and pinout; lacks AEC-Q100 qualification, PPAP docs, and extended temp validation. | Suitable only for non-safety automotive applications (e.g., rear-seat entertainment) where cost is prioritized over qualification rigor. | Use only for prototyping or non-OEM Tier 1 projects; not acceptable for production ECUs requiring ISO/TS 16949 traceability. |
Compared with XA7K160T-1FFG676Q, the XA7K325T-1FFG901Q offers scalable compute headroom within the same qualified platform, while the XC7K160T-1FFG676I trades automotive certification for lower unit cost - making the XA7K160T-1FFG676Q the optimal balance of verified reliability, performance, and production readiness.
Availability
XA7K160T-1FFG676Q is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), automotive infotainment gateways, and electric vehicle powertrain control requiring stable component supply across extended product lifecycles.
Supply support for XA7K160T-1FFG676Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx (now part of AMD) is a semiconductor company specializing in adaptive computing solutions, with leadership in FPGA, ACAP, and software-defined hardware platforms for aerospace, automotive, and data center markets.
The XA Kintex-7 family was designed specifically for high-volume automotive applications demanding AEC-Q100 qualification, extended temperature operation, and integrated analog/mixed-signal capability - targeting ADAS, domain controllers, and vehicle networking.
FAQ
What automotive qualifications does XA7K160T-1FFG676Q hold?
XA7K160T-1FFG676Q is AEC-Q100 Grade 1 qualified (–40°C to +125°C), ISO/TS 16949 compliant, and ships with full PPAP documentation. It undergoes accelerated stress testing including HTOL, TC, and UHAST per AEC standards - making it suitable for engine bay, transmission, and ADAS ECU deployment without additional qualification.
Does XA7K160T-1FFG676Q support PCIe Gen3?
No, XA7K160T-1FFG676Q integrates a hard PCIe Gen2 x4 Endpoint compliant with PCI Express Base Specification 2.1. It does not support Gen3 (8.0 GT/s) signaling; maximum link speed is 5.0 GT/s. For Gen3, designers must select XA7VX485T or later automotive Virtex-7 derivatives.
Can XA7K160T-1FFG676Q perform partial reconfiguration in automotive environments?
Yes, XA7K160T-1FFG676Q supports dynamic partial reconfiguration via its DRP interface and configuration port. This enables runtime logic updates - such as switching between parking and highway ADAS modes - while maintaining ASIL-B integrity through isolated reconfigurable partitions and SEU-corrected configuration memory.
What is the maximum DDR3 data rate supported by XA7K160T-1FFG676Q?
XA7K160T-1FFG676Q supports DDR3 interfaces up to 1600 Mb/s using its HP I/O banks. This is achieved with calibrated I/O timing, IDELAY/ODELAY blocks, and built-in DQS tracking - sufficient for automotive infotainment memory subsystems and sensor buffer interfaces.
How many analog inputs does the XADC in XA7K160T-1FFG676Q support?
The XADC in XA7K160T-1FFG676Q supports up to 17 analog input channels: 16 external differential/unipolar inputs plus one dedicated on-die temperature sensor and one on-die VCCINT monitor - all sampled simultaneously at 1 MSPS with 12-bit resolution.
XA7K160T-1FFG676Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12675
- Number of Logic Elements/Cells:
- 162240
- Total RAM Bits:
- 11980800
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XA7K160T-1FFG676Q FAQ
1.How can I place an order for XA7K160T-1FFG676Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XA7K160T-1FFG676Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XA7K160T-1FFG676Q reliable?
The price and inventory of XA7K160T-1FFG676Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XA7K160T-1FFG676Q is usually 5 days.
3.What payment methods are accepted for XA7K160T-1FFG676Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XA7K160T-1FFG676Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XA7K160T-1FFG676Q?
XA7K160T-1FFG676Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XA7K160T-1FFG676Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XA7K160T-1FFG676Q?
For technical support, including XA7K160T-1FFG676Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XA7K160T-1FFG676Q requirements.
6.How does Aetrix verify that XA7K160T-1FFG676Q is sourced from the original manufacturer or authorized distributors?
All XA7K160T-1FFG676Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XA7K160T-1FFG676Q meets industry standards.
7.What is the process for return or replacement of XA7K160T-1FFG676Q?
All XA7K160T-1FFG676Q units undergo pre-shipment inspection (PSI). If there is an issue with XA7K160T-1FFG676Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XA7K160T-1FFG676Q part is unused and in its original packaging.
Return procedure for XA7K160T-1FFG676Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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